| Solvent and isomer effects on the imidization of pyromellitic dianhydride-oxydianiline-based poly (amic ethyl ester) s NC Stoffel, EJ Kramer, W Volksen, TP Russell Polymer 34 (21), 4524-4530, 1993 | 56 | 1993 |
| Printed electronics for extreme high temperature environments M Alhendi, F Alshatnawi, EM Abbara, R Sivasubramony, G Khinda, ... Additive Manufacturing 54, 102709, 2022 | 48 | 2022 |
| Surface modification studies of polyimide films using Rutherford backscattering and forward recoil spectrometry NC Stoffel, M Hsieh, S Chandra, EJ Kramer Chemistry of materials 8 (5), 1035-1041, 1996 | 45 | 1996 |
| Method for forming sealed co-fired glass ceramic structures S Farooq, G Natarajan, SSN Reddy, RA Shelleman, NC Stoffel, ... US Patent 5,073,180, 1991 | 30 | 1991 |
| High-Resolution Profiling of the Polyimide− Polyimide Interface NC Stoffel, CA Dai, EJ Kramer, TP Russell, V Deline, W Volksen, W Wu, ... Macromolecules 29 (21), 6880-6891, 1996 | 25 | 1996 |
| Isothermal fatigue of interconnections in flexible hybrid electronics based human performance monitors RS Sivasubramony, N Adams, M Alhendi, GS Khinda, MZ Kokash, ... 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 896-903, 2018 | 22 | 2018 |
| Flexible inkjet-printed Patch antenna array on mesoporous PET substrate for 5G applications with stable RF performance after mechanical stress cycling GS Khinda, A Umar, RJ Cadwell, M Alhendi, NC Stoffel, P Borgesen, ... 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 1824-1831, 2020 | 21 | 2020 |
| Forward recoil spectrometry study of the diffusion of PMDA/ODA-based poly (amic ethyl esters) NC Stoffel, S Chandra, EJ Kramer, W Volksen, TP Russell Polymer 38 (20), 5073-5078, 1997 | 20 | 1997 |
| Power electronics package and method of manufacturing thereof AV Gowda, PA McConnelee, NC Stoffel, RI Tuominen US Patent 10,453,786, 2019 | 18 | 2019 |
| Effects of oven and laser sintering parameters on the electrical resistance of ijp nano-silver traces on mesoporous pet before and during fatigue cycling GS Khinda, MZ Kokash, M Alhendi, M Yadav, JP Lombardi, ... 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 1946-1951, 2019 | 18 | 2019 |
| Evaluation of an anisotropic conductive epoxy for interconnecting highly stretchable conductors to various surfaces R Al-Haidari, B Garakani, M Alhendi, US Somarathna, MD Poliks, ... 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 1422-1429, 2022 | 16 | 2022 |
| Fast PCR thermal cycling device J Grover, RD Juncosa, N Stoffel, M Boysel, AI Brooks, MP McLoughlin, ... IEEE sensors Journal 8 (5), 476-487, 2008 | 15 | 2008 |
| High Temperature Die Interconnection Approaches F Alshatnawi, M Alhendi, RA Al-Haidari, RS Sivasubramony, EM Abbara, ... 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 1539-1545, 2022 | 13 | 2022 |
| Printed stretchable conductors for smart clothing: the effect of conductor geometry and substrate properties on electromechanical behaviors KUS Somarathna, GS Khinda, B Garakani, EM Abbara, N Stoffel, ... 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 500-506, 2021 | 13 | 2021 |
| Fatigue cycling of electrical interconnects dispensed on flexible substrate M Alhendi, JP Lombardi III, GS Khinda, MZ Kokash, DL Weerawarne, ... International Symposium on Microelectronics 2018 (1), 000543-000548, 2018 | 12 | 2018 |
| Process for halomethylation of high performance polymers DA Foucher, NC Stoffel, RT Janezic, TW Smith, DJ Luca, B Zhang US Patent 6,187,512, 2001 | 12 | 2001 |
| Process for halomethylation of high performance polymers DA Foucher, NC Stoffel, RT Janezic, TW Smith, DJ Luca, B Zhang US Patent 6,020,119, 2000 | 12 | 2000 |
| Imidization and interdiffusion of poly (amic ethyl ester) precursors of PMDA/3, 4′‐ODA NC Stoffel, EJ Kramer, W Volksen, TP Russell Journal of Polymer Science Part B: Polymer Physics 36 (13), 2247-2258, 1998 | 11 | 1998 |
| Robustness and reliability of novel anisotropic conductive epoxy for stretchable wearable electronics A Stennermann, D Balder, M Stennermann, C Tabor, N Stoffel, ... 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 762-768, 2022 | 10 | 2022 |
| Passive wireless sensors Y Lee, JA Iannotti, NC Stoffel US Patent 9,712,894, 2017 | 10 | 2017 |
Willi VolksenResearch Staff Member, IBM Almaden Research Center在 us.ibm.com 的电子邮件经过验证
