| IMC morphology, interfacial reaction and joint reliability of Pb-free Sn–Ag–Cu solder on electrolytic Ni BGA substrate JW Yoon, SW Kim, SB Jung Journal of Alloys and Compounds 392 (1-2), 247-252, 2005 | 165 | 2005 |
| Intermetallic compound layer growth at the interface between Sn–Cu–Ni solder and Cu substrate JW Yoon, YH Lee, DG Kim, HB Kang, SJ Suh, CW Yang, CB Lee, ... Journal of alloys and compounds 381 (1-2), 151-157, 2004 | 161 | 2004 |
| Wettability and interfacial reactions of Sn–Ag–Cu/Cu and Sn–Ag–Ni/Cu solder joints JW Yoon, BI Noh, BK Kim, CC Shur, SB Jung Journal of alloys and compounds 486 (1-2), 142-147, 2009 | 156 | 2009 |
| Interfacial reaction and mechanical properties of eutectic Sn–0.7 Cu/Ni BGA solder joints during isothermal long-term aging JW Yoon, SW Kim, SB Jung Journal of Alloys and compounds 391 (1-2), 82-89, 2005 | 146 | 2005 |
| Reliability investigation and interfacial reaction of ball-grid-array packages using the lead-free Sn-Cu solder JW Yoon, SW Kim, JM Koo, DG Kim, SB Jung Journal of Electronic Materials 33, 1190-1199, 2004 | 108 | 2004 |
| Growth of an intermetallic compound layer with Sn-3.5 Ag-5Bi on Cu and Ni-P/Cu during aging treatment JW Yoon, CB Lee, SB Jung Journal of electronic materials 32, 1195-1202, 2003 | 103 | 2003 |
| Comparative study of ENIG and ENEPIG as surface finishes for a Sn-Ag-Cu solder joint JW Yoon, BI Noh, SB Jung Journal of electronic materials 40, 1950-1955, 2011 | 101 | 2011 |
| Interfacial reactions between Sn–0.4 Cu solder and Cu substrate with or without ENIG plating layer during reflow reaction JW Yoon, SB Jung Journal of alloys and compounds 396 (1-2), 122-127, 2005 | 97 | 2005 |
| Interfacial reactions and shear strengths between Sn-Ag-based Pb-free solder balls and Au/EN/Cu metallization SW Kim, JW Yoon, SB Jung Journal of electronic materials 33, 1182-1189, 2004 | 97 | 2004 |
| Interfacial reactions between Sn-58 mass% Bi eutectic solder and (Cu, electroless Ni-P/Cu) substrate JW Yoon, CB Lee, SB Jung Materials transactions 43 (8), 1821-1826, 2002 | 97 | 2002 |
| Characteristic evaluation of electroless nickel–phosphorus deposits with different phosphorus contents JW Yoon, JH Park, CC Shur, SB Jung Microelectronic Engineering 84 (11), 2552-2557, 2007 | 93 | 2007 |
| IMC growth and shear strength of Sn-Ag-Bi-In/Au/Ni/Cu BGA joints during aging JW Yoon, SW Kim, SB Jung Materials transactions 45 (3), 727-733, 2004 | 93 | 2004 |
| Investigation of interfacial reactions between Sn–5Bi solder and Cu substrate JW Yoon, SB Jung Journal of Alloys and Compounds 359 (1-2), 202-208, 2003 | 91 | 2003 |
| Cu–Sn and Ni–Sn transient liquid phase bonding for die-attach technology applications in high-temperature power electronics packaging BS Lee, SK Hyun, JW Yoon Journal of Materials Science: Materials in Electronics 28, 7827-7833, 2017 | 87 | 2017 |
| Sequential interfacial intermetallic compound formation of Cu6Sn5 and Ni3Sn4 between Sn–Ag–Cu solder and ENEPIG substrate during a reflow process JW Yoon, BI Noh, JH Yoon, HB Kang, SB Jung Journal of Alloys and Compounds 509 (9), L153-L156, 2011 | 85 | 2011 |
| Effect of reflow time on interfacial reaction and shear strength of Sn–0.7 Cu solder/Cu and electroless Ni–P BGA joints JW Yoon, SW Kim, SB Jung Journal of alloys and compounds 385 (1-2), 192-198, 2004 | 83 | 2004 |
| Effect of isothermal aging on intermetallic compound layer growth at the interface between Sn-3.5 Ag-0.75 Cu solder and Cu substrate JW Yoon, SB Jung Journal of materials science 39, 4211-4217, 2004 | 82 | 2004 |
| Growth kinetics of Ni3Sn4 and Ni3P layer between Sn–3.5 Ag solder and electroless Ni–P substrate JW Yoon, SB Jung Journal of alloys and compounds 376 (1-2), 105-110, 2004 | 76 | 2004 |
| Intermetallic compound layer formation between Sn–3.5 mass% Ag BGA solder ball and (Cu, immersion Au/electroless Ni–P/Cu) substrate CB Lee, JW Yoon, SJ Suh, SB Jung, CW Yang, CC Shur, YE Shin Journal of Materials Science: Materials in Electronics 14, 487-493, 2003 | 70 | 2003 |
| Interfacial reactions and shear strength on Cu and electrolytic Au/Ni metallization with Sn-Zn solder JW Yoon, SB Jung Journal of materials research 21 (6), 1590-1599, 2006 | 67 | 2006 |
seung-boo jungProfessor of Materials Science and Engineering, Sungkyunkwan University在 skku.edu 的电子邮件经过验证
