| The effect of encapsulant discoloration and delamination on the electrical characteristics of photovoltaic module NC Park, JS Jeong, BJ Kang, DH Kim Microelectronics Reliability 53 (9-11), 1818-1822, 2013 | 136 | 2013 |
| Field failure mechanism study of solder interconnection for crystalline silicon photovoltaic module JS Jeong, N Park, C Han Microelectronics Reliability 52 (9-10), 2326-2330, 2012 | 103 | 2012 |
| Estimation of the degradation rate of multi-crystalline silicon photovoltaic module under thermal cycling stress N Park, J Jeong, C Han Microelectronics Reliability 54 (8), 1562-1566, 2014 | 43 | 2014 |
| Reliability improvement of InGaN LED backlight module by accelerated life test (ALT) and screen policy of potential leakage LED JS Jeong, JK Jung, SD Park Microelectronics Reliability 48 (8-9), 1216-1220, 2008 | 34 | 2008 |
| Field discoloration analysis and UV/temperature accelerated degradation test of EVA for PV JS Jeong, N Park 2013 IEEE 39th Photovoltaic Specialists Conference (PVSC), 3010-3013, 2013 | 22 | 2013 |
| Analysis for the degradation mechanism of photovoltaic ribbon wire under thermal cycling J Jeong, N Park, W Hong, C Han 2011 37th IEEE Photovoltaic Specialists Conference, 003159-003161, 2011 | 16 | 2011 |
| Field failure mechanism and improvement of EOS failure of integrated IGBT inverter modules JS Jeong, SH Hong, SD Park Microelectronics Reliability 47 (9-11), 1795-1799, 2007 | 13 | 2007 |
| Failure analysis of video processor defined as No Fault Found (NFF): Reproduction in system level and advanced analysis technique in IC level JS Jeong, SD Park Microelectronics Reliability 49 (9-11), 1153-1157, 2009 | 9 | 2009 |
| Failure mechanism and reliability test method for USB interface circuitry on CPUs for mobile devices JS Jeong Microelectronics Reliability 52 (9-10), 2014-2018, 2012 | 8 | 2012 |
| Lifetime and failure analysis of perovskite-based ceramic NTC thermistors by thermal cycling and abrasion combined stress JS Jeong, W Lee, C Lee, J Choi Microelectronics Reliability 76, 112-116, 2017 | 7 | 2017 |
| Lifetime prediction model of thermal fatigue stress on crystalline silicon photovoltaic module N Park, C Han, J Jeong, D Kim 2013 IEEE 39th Photovoltaic Specialists Conference (PVSC), 1575-1578, 2013 | 6 | 2013 |
| Stress mechanism about field lightning surge of high voltage BJT based line driver for ADSL system JS Jeong, JH Lee, JS Ha, SD Park Microelectronics Reliability 45 (9-11), 1398-1401, 2005 | 6 | 2005 |
| Field Failure Mechanism Investigation of GaAs based HBT Power Amplifier Module (PAM) JS Jeong, JS Ha, SD Park | 5 | 2004 |
| Failure mechanism of COF based Line Driver IC for Flat Panel Display by contamination JS Jeong, YJ Kim Microelectronics Reliability 50 (9-11), 1488-1493, 2010 | 3 | 2010 |
| Barrier properties of Cu/TiW/ITO electrode for Si heterojunction solar cell under low temperature thermal aging JS Jeong, EG Shin Microelectronics Reliability 114, 113914, 2020 | 2 | 2020 |
| Effect of H/Ar treatment on ZnO: B transparent conducting oxide for flexible a-Si: H/μc-Si: H photovoltaic modules under damp heat stress JS Jeong, YH Kim, CK Park, HD Kim, J Choi Microelectronics Reliability 64, 640-645, 2016 | 2 | 2016 |
| Field failure mechanism and reproduction due to moisture for low-voltage ZnO varistors JS Jeong Microelectronics Reliability 53 (9-11), 1632-1637, 2013 | 2 | 2013 |
| Effect of EVA discoloration in 25-year-old single crystalline silicon photovoltaic modules operated under moderate climate JS Jeong Microelectronics Reliability 138, 114721, 2022 | 1 | 2022 |
| Lifetime and degradation analysis of AgPt alloy thick film/AlN heater for semiconductor wafer annealing JS Jeong, YG An Microelectronics Reliability 126, 114402, 2021 | 1 | 2021 |
| The degradation mechanism of flexible a-Si: H/μc-Si: H photovoltaic modules JS Jeong, YH Kim, CK Park, HD Kim, J Choi Microelectronics Reliability 55 (9-10), 1804-1810, 2015 | 1 | 2015 |
