| Electrical behavior of phase-change memory cells based on GeTe L Perniola, V Sousa, A Fantini, E Arbaoui, A Bastard, M Armand, ... IEEE Electron Device Letters 31 (5), 488-490, 2010 | 164 | 2010 |
| Reliable 300 mm wafer level hybrid bonding for 3D stacked CMOS image sensors S Lhostis, A Farcy, E Deloffre, F Lorut, S Mermoz, Y Henrion, L Berthier, ... 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 869-876, 2016 | 113 | 2016 |
| Carbon-doped GeTe: a promising material for phase-change memories GB Beneventi, L Perniola, V Sousa, E Gourvest, S Maitrejean, JC Bastien, ... Solid-State Electronics 65, 197-204, 2011 | 103 | 2011 |
| Hybrid bonding for 3D stacked image sensors: impact of pitch shrinkage on interconnect robustness J Jourdon, S Lhostis, S Moreau, J Chossat, M Arnoux, C Sart, Y Henrion, ... 2018 IEEE International Electron Devices Meeting (IEDM), 7.3. 1-7.3. 4, 2018 | 79 | 2018 |
| Impact of oxidation on Ge2Sb2Te5 and GeTe phase-change properties E Gourvest, B Pelissier, C Vallée, A Roule, S Lhostis, S Maitrejean Journal of The Electrochemical Society 159 (4), H373-H377, 2012 | 74 | 2012 |
| Evidence of Germanium precipitation in phase-change thin films by Raman scattering E Gourvest, S Lhostis, J Kreisel, M Armand, S Maitrejean, A Roule, ... Applied Physics Letters 95 (3), 031908, 2009 | 58 | 2009 |
| Comparative assessment of GST and GeTe materials for application to embedded phase-change memory devices A Fantini, L Perniola, M Armand, JF Nodin, V Sousa, A Persico, J Cluzel, ... 2009 IEEE International Memory Workshop, 1-2, 2009 | 58 | 2009 |
| Thin films of the double perovskite Sr2FeMoO6 deposited by pulsed laser deposition RP Borges, S Lhostis, MA Bari, JJ Versluijs, JG Lunney, JMD Coey, ... Thin Solid Films 429 (1-2), 5-12, 2003 | 55 | 2003 |
| Thin films of the double perovskite Sr2FeMoO6 deposited by pulsed laser deposition RP Borges, S Lhostis, MA Bari, JJ Versluijs, JG Lunney, JMD Coey, ... Thin Solid Films 429 (1-2), 5-12, 2003 | 55 | 2003 |
| Global Shutter Quantum Dot Image Sensor Optimized for Near and Shortwave Infrared JS Steckel, E Josse, AG Pattantyus-Abraham, M Bidaud, B Mortini, ... 2021 IEEE International Electron Devices Meeting (IEDM), 23.4. 1-23.4. 4, 2021 | 51 | 2021 |
| 1μm pitch direct hybrid bonding with< 300nm Wafer-to-Wafer overlay accuracy A Jouve, V Balan, N Bresson, C Euvrard-Colnat, F Fournel, Y Exbrayat, ... 2017 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference …, 2017 | 51 | 2017 |
| Proximity sensor including reference detector for stray radiation detection A Caley, PJ Parodi-Keravec, O Le Briz, S Lhostis US Patent 9,535,157, 2017 | 50 | 2017 |
| Pulsed liquid-injection MOCVD of high-K oxides for advanced semiconductor technologies C Dubourdieu, H Roussel, C Jimenez, M Audier, JP Sénateur, S Lhostis, ... Materials Science and Engineering: B 118 (1-3), 105-111, 2005 | 49 | 2005 |
| Addition of yttrium into HfO2 films: Microstructure and electrical properties C Dubourdieu, E Rauwel, H Roussel, F Ducroquet, B Holländer, ... Journal of Vacuum Science & Technology A 27 (3), 503-514, 2009 | 45 | 2009 |
| Observation of HfO2 thin films by deep UV spectroscopic ellipsometry F Ferrieu, K Dabertrand, S Lhostis, V Ivanova, E Martinez, C Licitra, ... Journal of Non-Crystalline Solids 353 (5-7), 658-662, 2007 | 45 | 2007 |
| Theoretical and experimental study of a thermal damper based on a CNT/PCM composite structure for transient electronic cooling C Kinkelin, S Lips, U Soupremanien, V Remondière, J Dijon, H Le Poche, ... Energy conversion and management 142, 257-271, 2017 | 44 | 2017 |
| Angular and polarization properties of cross-holes nanostructured metallic filters R Girard-Desprolet, S Boutami, S Lhostis, G Vitrant Optics express 21 (24), 29412-29424, 2013 | 40 | 2013 |
| Chemical interface analysis of as grown HfO2 ultrathin films on SiO2 C Maunoury, K Dabertrand, E Martinez, M Saadoune, D Lafond, F Pierre, ... Journal of applied physics 101 (3), 2007 | 36 | 2007 |
| Hybrid bonding-based interconnects: A status on the last robustness and reliability achievements S Moreau, J Jourdon, S Lhostis, D Bouchu, B Ayoub, L Arnaud, H Fremont ECS Journal of Solid State Science and Technology 11 (2), 024001, 2022 | 35 | 2022 |
| Cu/SiO2 hybrid bonding: Finite element modeling and experimental characterization C Sart, R Estevez, V Fiori, S Lhostis, E Deloffre, G Parry, R Gonella 2016 6th Electronic System-Integration Technology Conference (ESTC), 1-7, 2016 | 34 | 2016 |
