| Polypyrrole thin film fiber optic chemical sensor for detection of VOCs H Qin, A Kulkarni, H Zhang, H Kim, D Jiang, T Kim Sensors and Actuators B: Chemical 158 (1), 223-228, 2011 | 62 | 2011 |
| Direct and quantitative study of ceria–SiO2 interaction depending on Ce3+ concentration for chemical mechanical planarization (CMP) cleaning KK Myong, J Byun, M Choo, H Kim, JY Kim, T Lim, JJ Kim Materials Science in Semiconductor Processing 122, 105500, 2021 | 41 | 2021 |
| Study of polishing characteristics of monodisperse ceria abrasive in chemical mechanical planarization JC Yang, H Kim, T Kim Journal of The Electrochemical Society 157 (3), H235, 2009 | 35 | 2009 |
| Investigation on surface hardening of polyurethane pads during chemical mechanical polishing (CMP) JC Yang, DW Oh, HJ Kim, T Kim Journal of electronic materials 39, 338-346, 2010 | 32 | 2010 |
| Development of optical monitor of alpha radiations based on CR-39 PM Joshirao, JW Shin, CK Vyas, AD Kulkarni, H Kim, T Kim, SW Hong, ... Applied radiation and isotopes 81, 184-189, 2013 | 22 | 2013 |
| Online optical monitor of alpha radiations using a polymeric solid state nuclear track detector CR-39 A Kulkarni, CK Vyas, H Kim, PC Kalsi, T Kim, V Manchanda Sensors and Actuators B: Chemical 161 (1), 697-701, 2012 | 19 | 2012 |
| Development of CO2 gas cluster cleaning method and its characterization H Choi, H Kim, D Yoon, JW Lee, BK Kang, MS Kim, JG Park, SB Kwon, ... Microelectronic engineering 102, 87-90, 2013 | 18 | 2013 |
| Investigation of the pad-conditioning performance deterioration in the chemical mechanical polishing process H Kim, S Hong, C Shin, Y Jin, DH Lim, J Kim, H Hwang, T Kim Wear 392, 93-98, 2017 | 15 | 2017 |
| Measurement of CMP slurry abrasive size distribution by scanning mobility particle sizer H Kim, JC Yang, T Kim Electrochemical and Solid-State Letters 13 (4), H137, 2010 | 14 | 2010 |
| Numerical analysis of axial-flow cyclone separator for subway station HVAC system pre-filter M Kim, H Kim, SB Kwon, SY Kim, JK Kim, CH Shin, SJ Bae, SH Hwang, ... International Journal of Air-Conditioning and Refrigeration 17 (3), 94-99, 2009 | 13 | 2009 |
| Experimental evaluation of the effect of pad debris size on microscratches during CMP process JC Yang, H Kim, DW Oh, JH Won, CG Lee, T Kim Journal of electronic materials 42, 97-102, 2013 | 12 | 2013 |
| Investigation of abrasive-free slurry for polysilicon buffing chemical mechanical planarization S Jeon, J Hong, S Hong, C Kanade, K Park, H Seok, H Kim, S Lee, T Kim Materials Science in Semiconductor Processing 128, 105755, 2021 | 11 | 2021 |
| Barrier metal slurry for low defect copper damascene chemical mechanical polishing H Kim, K Seo, J Moon, H Kim, H Hwang ECS Transactions 64 (40), 85, 2015 | 10 | 2015 |
| Investigation of copper oxide ring formation during post chemical mechanical polishing cleaning of Cu interconnect H Kim, S Hong, Y Jin, DH Lim, J Kim, H Hwang, T Kim ECS Journal of Solid State Science and Technology 6 (8), P542, 2017 | 9 | 2017 |
| Frictional characteristic of polymeric additive for the slurry of chemical mechanical planarization process H Kim, JC Yang, J Lee, SH Park, J Won, M Kim, T Kim ECS Journal of Solid State Science and Technology 1 (3), P101, 2012 | 7 | 2012 |
| Effects of ceria abrasive particle size distribution below wafer surface on in-wafer uniformity during chemical mechanical polishing processing H Kim, JC Yang, M Kim, D Oh, CG Lee, SY Kim, T Kim Journal of The Electrochemical Society 158 (6), H635, 2011 | 7 | 2011 |
| A numerical study on slurry flow with CMP pad grooves S Hong, S Bae, S Choi, P Liu, H Kim, T Kim Microelectronic Engineering 234, 111437, 2020 | 6 | 2020 |
| Diamond structure-dependent pad and wafer polishing performance during chemical mechanical polishing C Shin, A Kulkarni, K Kim, H Kim, S Jeon, E Kim, Y Jin, T Kim The International Journal of Advanced Manufacturing Technology 97, 563-571, 2018 | 6 | 2018 |
| A novel pad conditioner and pad roughness effects on tungsten CMP D Lim, H Kim, B Jang, H Cho, J Kim, H Hwang Proceedings of International Conference on Planarization/CMP Technology 2014 …, 2014 | 5 | 2014 |
| Optimization of CMP pad surface by laser induced micro hole JC Yang, H Kim, CG Lee, HD Lee, T Kim Journal of The Electrochemical Society 158 (1), H15, 2010 | 5 | 2010 |
Taesung KimSungkyunkwan University在 skku.edu 的电子邮件经过验证
