| Die attachment, wire bonding, and encapsulation process in LED packaging: A review MA Alim, MZ Abdullah, MSA Aziz, R Kamarudin Sensors and Actuators A: Physical 329, 112817, 2021 | 64 | 2021 |
| Recent advances on thermally conductive adhesive in electronic packaging: a review MA Alim, MZ Abdullah, MSA Aziz, R Kamarudin, P Gunnasegaran Polymers 13 (19), 3337, 2021 | 38 | 2021 |
| Influence of nanoparticles on thermophysical properties of hybrid nanofluids of different volume fractions MZ Abdullah, KH Yu, HY Loh, R Kamarudin, P Gunnasegaran, A Alkhwaji Nanomaterials 12 (15), 2570, 2022 | 15 | 2022 |
| Experimental study on luminous intensity of white LEDs of different configurations MA Alim, MZ Abdullah, MSA Aziz, R Kamarudin, AP Irawan, E Siahaan IOP Conference Series: Materials Science and Engineering 1007 (1), 012145, 2020 | 7 | 2020 |
| Influence of oxyhydrogen gas retrofit into two-stroke engine on emissions and exhaust gas temperature variations R Kamarudin, YZ Ang, NS Topare, MN Ismail, KF Mustafa, ... Heliyon 10 (5), 2024 | 4 | 2024 |
| Impact of Cu Pillar Bump Diameter and Solder Material on Reflow Soldering: A Computational Study with Thermal Fluid–Structure Interaction JR Lee, MS Abdul Aziz, CY Khor, MHH Ishak, R Kamarudin, FC Ani Journal of Electronic Materials 53 (3), 1201-1213, 2024 | 3 | 2024 |
| A numerical investigation of laminar hybrid nanofluid flow inside circular straight minitube K Fadzli, MZ Abdullah, NM Mazlan, AA Janyekar, R Kamarudin, ... Journal of Advanced Research in Fluid Mechanics and Thermal Sciences 64 (2 …, 2019 | 3 | 2019 |
| Influence of Silica Oxide Nanofluid for Different Concentrations on Photovoltaic Cell MAFB Mhd Nasser, R Kamarudin, P Gunnasegaran, MZ Abdullah, ... Journal of Nanofluids 13 (3), 772-782, 2024 | 1 | 2024 |
| An experimental investigation of shear strength and adhesion on the chip-substrate joint in LED packaging MA Alim, MSA Aziz, MZ Abdullah, R Kamarudin, JR Lee, MS Rusdi, ... International Journal of Adhesion and Adhesives 119, 103272, 2022 | 1 | 2022 |
| The Effect of the Epoxy Curing Method on the Encapsulation of Led K Muniary, MS Rusdi, MS Abdul Aziz, R Kamaruddin, MHH Ishak, ... Green Materials and Electronic Packaging Interconnect Technology Symposium …, 2022 | 1 | 2022 |
| Analysis of LED wire bonding during encapsulation process H Roslan, MSA Aziz, MZ Abdullah, R Kamarudin, MHH Ishak, F Ismail, ... IOP Conference Series: Materials Science and Engineering 1007 (1), 012173, 2020 | 1 | 2020 |
| Analysis Study of Thermal and Exergy Efficiency in Double-Layers Porous Media Combustion Using Different Sizes of Burner: A Comparison. NC Ismail, MZ Abdullah, NM Mazlan, KF Mustafa, MS Rusdi, R Kamarudin Pertanika Journal of Science & Technology 32 (2), 2024 | | 2024 |
| Effect of Different Epoxy Materials During LED Wire Bonding Encapsulation Process Using CFD Approach MSB Zubir, MSB Rusdi, MS Abdul Aziz, R Kamaruddin, MHH Ishak, ... Green Materials and Electronic Packaging Interconnect Technology Symposium …, 2022 | | 2022 |
| Investigation of Thermal Reflow Profile for Copper Pillar Technology JR Lee, MS Abdul Aziz, MFR Rosli, MS Rusdi, R Kamaruddin, MHH Ishak, ... Green Materials and Electronic Packaging Interconnect Technology Symposium …, 2022 | | 2022 |
| Effect of Needle Size and Needle Height to Substrate in Encapsulation Process of LED Packaging MA Alim, MZ Abdullah, MSA Aziz, R Kamarudin, MS Rusdi, MHH Ishak, ... Advanced Materials and Engineering Technologies, 149-156, 2022 | | 2022 |
| PERTANIKA JOURNAL OF SCIENCE AND TECHNOLOGY NA Ismail, MZ Abdullah, NM Mazlan, KF Mustafa, MS Rusdi, R Kamarudin | | |
