| Step and flash imprint lithography: a new approach to high-resolution patterning M Colburn, SC Johnson, MD Stewart, S Damle, TC Bailey, B Choi, ... Microlithography'99, 379-389, 1999 | 1067 | 1999 |
| STEP AND FLASH IMPRINT LITHOGRAPHY CG Willson, ME Colburn EP Patent 1,228,401, 2005 | 584 | 2005 |
| Step and flash imprint lithography CG Willson, ME Colburn US Patent 6,334,960, 2002 | 582 | 2002 |
| Polymer self assembly in semiconductor microelectronics CT Black, R Ruiz, G Breyta, JY Cheng, ME Colburn, KW Guarini, HC Kim, ... IBM Journal of Research and Development 51 (5), 605-633, 2007 | 550 | 2007 |
| Step and flash imprint lithography: Template surface treatment and defect analysis T Bailey, BJ Choi, M Colburn, M Meissl, S Shaya, JG Ekerdt, ... Journal of Vacuum Science & Technology B 18 (6), 3572-3577, 2000 | 513 | 2000 |
| Template for room temperature, low pressure micro-and nano-imprint lithography T Bailey, BJ Choi, M Colburn, SV Sreenivasan, CG Willson, J Ekerdt US Patent 6,696,220, 2004 | 422 | 2004 |
| RECOVERY OF HYDROPHOBICITY OF LOW-K AND ULTRA LOW-K ORGANOSILICATE FILMS USED AS INTER METAL DIELECTRICS N Chakrapani, ME Colburn, CD Dimitrakopoulos, SV Nitta, D Pfeiffer, ... EP Patent 1,812,961, 2007 | 373 | 2007 |
| Recovery of hydrophobicity of low-k and ultra low-k organosilicate films used as inter metal dielectrics N Chakrapani, ME Colburn, CD Dimitrakopoulos, D Pfeiffer, ... US Patent 7,687,913, 2010 | 366 | 2010 |
| Simple and versatile methods to integrate directed self-assembly with optical lithography using a polarity-switched photoresist JY Cheng, DP Sanders, HD Truong, S Harrer, A Friz, S Holmes, ... Acs Nano 4 (8), 4815-4823, 2010 | 281 | 2010 |
| Patterning curved surfaces: Template generation by ion beam proximity lithography and relief transfer by step and flash imprint lithography P Ruchhoeft, M Colburn, B Choi, H Nounu, S Johnson, T Bailey, S Damle, ... Journal of Vacuum Science & Technology B 17 (6), 2965-2969, 1999 | 212 | 1999 |
| Sidewall image transfer process employing a cap material layer for a metal nitride layer JC Arnold, SD Burns, ME Colburn, DV Horak, Y Yin US Patent 20,120,282,779, 2012 | 179 | 2012 |
| Sidewall image transfer process employing a cap material layer for a metal nitride layer JC Arnold, SD Burns, ME Colburn, DV Horak, Y Yin US Patent 8,298,954, 2012 | 179 | 2012 |
| DSA grapho-epitaxy process with etch stop material JA Abdallah, ME Colburn, SJ Holmes, D Kawamura, C Liu, ... US Patent 8,859,433, 2014 | 178 | 2014 |
| Closed air gap interconnect structure KL Saenger, M Surendra, SV Nitta, S Purushothaman, ME Colburn, ... US Patent 7,361,991, 2008 | 178 | 2008 |
| A 7nm FinFET technology featuring EUV patterning and dual strained high mobility channels R Xie, P Montanini, K Akarvardar, N Tripathi, B Haran, S Johnson, T Hook, ... 2016 IEEE International Electron Devices Meeting (IEDM), 2.7. 1-2.7. 4, 2016 | 177 | 2016 |
| Design of orientation stages for step and flash imprint lithography BJ Choi, SV Sreenivasan, S Johnson, M Colburn, CG Wilson Precision Engineering 25 (3), 192-199, 2001 | 177 | 2001 |
| Two-Dimensional Pattern Formation Using Graphoepitaxy of PS-b-PMMA Block Copolymers for Advanced FinFET Device and Circuit Fabrication H Tsai, JW Pitera, H Miyazoe, S Bangsaruntip, SU Engelmann, CC Liu, ... ACS nano 8 (5), 5227-5232, 2014 | 176 | 2014 |
| Development and advantages of step-and-flash lithography M Colburn, T Bailey, BJ Choi, JG Ekerdt, SV Sreenivasan, CG Willson Solid State Technology 44 (7), 67-80, 2001 | 170 | 2001 |
| Step and flash imprint lithography for sub-100-nm patterning M Colburn, A Grot, MN Amistoso, BJ Choi, TC Bailey, JG Ekerdt, ... Microlithography 2000, 453-457, 2000 | 170 | 2000 |
| High-resolution overlay alignment methods for imprint lithography SV Sreenivasan, BJ Choi, M Colburn, T Bailey US Patent 6,921,615, 2005 | 160 | 2005 |
S.V. SreenivasanUniversity of Texas at Austin在 mail.utexas.edu 的电子邮件经过验证
