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Heungdong Kwon
Heungdong Kwon
在 stanford.edu 的电子邮件经过验证
标题
引用次数
引用次数
年份
Direct visualization of thermal conductivity suppression due to enhanced phonon scattering near individual grain boundaries
A Sood, R Cheaito, T Bai, H Kwon, Y Wang, C Li, L Yates, T Bougher, ...
Nano letters 18 (6), 3466-3472, 2018
1082018
Uncovering Thermal and Electrical Properties of Sb2Te3/GeTe Superlattice Films
H Kwon, AI Khan, C Perez, M Asheghi, E Pop, KE Goodson
Nano Letters 21 (14), 5984-5990, 2021
422021
Thermal and manufacturing design considerations for silicon-based embedded microchannel-3D manifold coolers (EMMCs): part 1—experimental study of single-phase cooling …
KW Jung, E Cho, H Lee, C Kharangate, F Zhou, M Asheghi, EM Dede, ...
Journal of Electronic Packaging 142 (3), 031117, 2020
352020
Phase Change Dynamics and Two-Dimensional 4-Bit Memory in Ge2Sb2Te5 via Telecom-Band Encoding
GA Sevison, S Farzinazar, JA Burrow, C Perez, H Kwon, J Lee, M Asheghi, ...
ACS Photonics 7 (2), 480-487, 2020
342020
Unveiling the effect of superlattice interfaces and intermixing on phase change memory performance
AI Khan, X Wu, C Perez, B Won, K Kim, P Ramesh, H Kwon, MC Tung, ...
Nano Letters 22 (15), 6285-6291, 2022
272022
Two-fold reduction of switching current density in phase change memory using Bi₂Te₃ thermoelectric interfacial layer
AI Khan, H Kwon, R Islam, C Perez, ME Chen, M Asheghi, KE Goodson, ...
IEEE Electron Device Letters 41 (11), 1657-1660, 2020
252020
Electro-thermal confinement enables improved superlattice phase change memory
AI Khan, H Kwon, ME Chen, M Asheghi, HSP Wong, KE Goodson, E Pop
IEEE Electron Device Letters 43 (2), 204-207, 2021
222021
Tungsten-doped Ge2Sb2Te5 phase change material for high-speed optical switching devices
P Guo, JA Burrow, GA Sevison, H Kwon, C Perez, JR Hendrickson, ...
Applied Physics Letters 116 (13), 2020
212020
High stability thermal accelerometer based on ultrathin platinum ALD nanostructures
CLM Everhart, KE Kaplan, MM Winterkorn, H Kwon, J Provine, M Asheghi, ...
2018 IEEE Micro Electro Mechanical Systems (MEMS), 976-979, 2018
162018
Heat conductor–insulator transition in electrochemically controlled hybrid superlattices
J Zhou, Y Wu, H Kwon, Y Li, X Xiao, Y Ye, Y Ma, KE Goodson, HY Hwang, ...
Nano Letters 22 (13), 5443-5450, 2022
142022
Tunable dielectric and thermal properties of oxide dielectrics via substrate biasing in plasma-enhanced atomic layer deposition
Y Kim, H Kwon, HS Han, HJK Kim, BSY Kim, BC Lee, J Lee, M Asheghi, ...
ACS Applied Materials & Interfaces 12 (40), 44912-44918, 2020
142020
Energy Efficient Neuro‐Inspired Phase–Change Memory Based on Ge4Sb6Te7 as a Novel Epitaxial Nanocomposite
AI Khan, H Yu, H Zhang, JR Goggin, H Kwon, X Wu, C Perez, KM Neilson, ...
Advanced Materials 35 (30), 2300107, 2023
132023
Thermal characterization of metal–oxide interfaces using time-domain thermoreflectance with nanograting transducers
H Kwon, C Perez, W Park, M Asheghi, KE Goodson
ACS Applied Materials & Interfaces 13 (48), 58059-58065, 2021
102021
Thermal Interface Enhancement via Inclusion of an Adhesive Layer Using Plasma-Enhanced Atomic Layer Deposition
H Kwon, C Perez, HK Kim, M Asheghi, W Park, KE Goodson
ACS Applied Materials & Interfaces 13 (18), 21905-21913, 2021
82021
First Fire-free, Low-voltage (~1.2 V), and Low Off-current (~3 nA) SiOxTey Selectors
S Vaziri, IM Datye, E Ambrosi, AI Khan, H Kwon, CH Wu, CF Hsu, J Guy, ...
2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and …, 2022
72022
Dominant energy carrier transitions and thermal anisotropy in epitaxial iridium thin films
C Perez, A Jog, H Kwon, D Gall, M Asheghi, S Kumar, W Park, ...
Advanced Functional Materials 32 (45), 2207781, 2022
62022
Capillary-enhanced two-phase micro-cooler using copper-inverse-opal wick with silicon microchannel manifold for high-heat-flux cooling application
H Kwon, Q Wu, D Kong, S Hazra, K Jiang, S Narumanchi, H Lee, ...
International Communications in Heat and Mass Transfer 156, 107592, 2024
42024
Nanoscale phase change memory arrays patterned by block copolymer directed self-assembly
MC Tung, AI Khan, H Kwon, M Asheghi, KE Goodson, E Pop, HSP Wong
Novel Patterning Technologies 2022 12054, 39-46, 2022
22022
Parametric Study of Silicon-Based Embedded Microchannels With 3D Manifold Coolers (EMMC) for High Heat Flux (~1 kW/cm2) Power Electronics Cooling
KW Jung, S Hazra, H Kwon, A Piazza, E Jih, M Asheghi, MP Gupta, ...
International Electronic Packaging Technical Conference and Exhibition 59322 …, 2019
22019
Design of manifolded 3D μ-coolers enabling high heat flux capillary-driven boiling over large areas
Q Wu, H Kwon, M Asheghi, KE Goodson
IEEE Transactions on Components, Packaging and Manufacturing Technology, 2024
12024
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