| Phase transformation behaviors and properties of a high strength Cu-Ni-Si alloy Q Lei, Z Xiao, W Hu, B Derby, Z Li Materials Science and Engineering: A 697, 37-47, 2017 | 148 | 2017 |
| Microstructure and mechanical properties of a high strength Cu-Ni-Si alloy treated by combined aging processes Q Lei, Z Li, Y Gao, X Peng, B Derby Journal of Alloys and Compounds 695, 2413-2423, 2017 | 98 | 2017 |
| Effects of substrate temperature and deposition rate on the phase separated morphology of co-sputtered, Cu-Mo thin films B Derby, Y Cui, JK Baldwin, A Misra Thin Solid Films 647, 50-56, 2018 | 49 | 2018 |
| Suppression of shear banding in high-strength Cu/Mo nanocomposites with hierarchical bicontinuous intertwined structures Y Cui, B Derby, N Li, NA Mara, A Misra Materials Research Letters 6 (3), 184-190, 2018 | 46 | 2018 |
| Processing of novel pseudomorphic Cu–Mo hierarchies in thin films B Derby, Y Cui, JK Baldwin, R Arróyave, MJ Demkowicz, A Misra Materials Research Letters 7 (1), 1-11, 2019 | 30 | 2019 |
| Design of bicontinuous metallic nanocomposites for high-strength and plasticity Y Cui, B Derby, N Li, A Misra Materials & Design 166, 107602, 2019 | 29 | 2019 |
| 3-D phase-field simulations of self-organized composite morphologies in physical vapor deposited phase-separating binary alloys K Ankit, B Derby, R Raghavan, A Misra, MJ Demkowicz Journal of Applied Physics 126 (7), 2019 | 24 | 2019 |
| Hillock formation in co-deposited thin films of immiscible metal alloy systems M Powers, B Derby, E Raeker, N Champion, A Misra Thin Solid Films 693, 137692, 2020 | 17 | 2020 |
| Microstructural characterization of phase-separated co-deposited Cu–Ta immiscible alloy thin films M Powers, B Derby, A Shaw, E Raeker, A Misra Journal of Materials Research 35 (12), 1531-1542, 2020 | 14 | 2020 |
| Effect of addition of Ni and Si on the microstructure and mechanical properties of Cu–Zn alloys W Chen, Y Jia, J Yi, M Wang, B Derby, Q Lei Journal of Materials Research 32 (16), 3137-3145, 2017 | 13 | 2017 |
| Microstructure evolution and hardness of an ultra-high strength Cu-Ni-Si alloy during thermo-mechanical processing Q Lei, Z Li, WP Hu, Y Liu, CL Meng, B Derby, W Zhang Journal of Materials Engineering and Performance 25, 2615-2625, 2016 | 11 | 2016 |
| Fracture resistance of hierarchical Cu–Mo nanocomposite thin films Y Cui, B Derby, N Li, A Misra Materials Science and Engineering: A 799, 139891, 2021 | 9 | 2021 |
| Compositionally-driven formation mechanism of hierarchical morphologies in co-deposited immiscible alloy thin films M Powers, JA Stewart, R Dingreville, BK Derby, A Misra Nanomaterials 11 (10), 2635, 2021 | 8 | 2021 |
| Interface effect of Fe and Fe2O3 on the distributions of ion induced defects H Kim, MR Chancey, T Chung, I Brackenbury, MO Liedke, M Butterling, ... Journal of Applied Physics 132 (10), 2022 | 7 | 2022 |
| The mechanism behind the high radiation tolerance of Fe–Cr alloys S Agarwal, M Butterling, MO Liedke, KH Yano, DK Schreiber, ACL Jones, ... Journal of Applied Physics 131 (12), 2022 | 7 | 2022 |
| Microstructure development and morphological transition during deposition of immiscible alloy films Y Lu, B Derby, H Sriram, K Kadirvel, C Wang, X Liu, A Misra, Y Wang Acta Materialia 220, 117313, 2021 | 7 | 2021 |
| Electrochemical stability, physical, and electronic properties of thermally pre-formed oxide compared to artificially sputtered oxide on Fe thin films in aqueous chloride J Han, MG Wartenberg, HL Chan, BK Derby, N Li, JR Scully Corrosion Science 186, 109456, 2021 | 7 | 2021 |
| Metal-ion-controlled growth and nanoindentation response of 3D, bicontinuous Cu–Fe thin films BK Derby, A Chatterjee, A Misra Journal of Applied Physics 128 (3), 2020 | 7 | 2020 |
| An experimentally driven high-throughput approach to design refractory high-entropy alloys C Lee, D Xie, BK Derby, JK Baldwin, C Tandoc, OEI Atwani, YJ Hu, ... Materials & Design 223, 111259, 2022 | 6 | 2022 |
| Microstructure and mechanical properties of nanoscale Cu/(Ta50Nb25Mo25) multilayers L Jiang, M Powers, Y Cui, BK Derby, A Misra Materials Science and Engineering: A 799, 140200, 2021 | 6 | 2021 |
Amit MisraUniversity of Michigan在 umich.edu 的电子邮件经过验证
