The use of functionally graded poly-SiGe layers for MEMS applications A Witvrouw, A Mehta Materials science forum 492, 255-260, 2005 | 388 | 2005 |
Keyhole-induced porosities in Laser-based Powder Bed Fusion (L-PBF) of Ti6Al4V: High-fidelity modelling and experimental validation M Bayat, A Thanki, S Mohanty, A Witvrouw, S Yang, J Thorborg, NS Tiedje, ... Additive Manufacturing 30, 100835, 2019 | 351 | 2019 |
On the influence of laser defocusing in Selective Laser Melting of 316L J Metelkova, Y Kinds, K Kempen, C de Formanoir, A Witvrouw, ... Additive Manufacturing 23, 161-169, 2018 | 250 | 2018 |
Experimental determination of the maximum post-process annealing temperature for standard CMOS wafers S Sedky, A Witvrouw, H Bender, K Baert IEEE transactions on Electron Devices 48 (2), 377-385, 2001 | 191 | 2001 |
Viscosity and elastic constants of amorphous Si and Ge A Witvrouw, F Spaepen Journal of Applied Physics 74 (12), 7154-7161, 1993 | 158 | 1993 |
Bulk and interface stresses in silver‐nickel multilayered thin films JA Ruud, A Witvrouw, F Spaepen Journal of applied physics 74 (4), 2517-2523, 1993 | 156 | 1993 |
Fabrication and reliability testing of Ti/TiN heaters P De Moor, A Witvrouw, V Simons, I De Wolf Micromachining and Microfabrication Process Technology V 3874, 284-293, 1999 | 152 | 1999 |
Comparison between wet HF etching and vapor HF etching for sacrificial oxide removal A Witvrouw, B Du Bois, P De Moor, A Verbist, CA Van Hoof, H Bender, ... Micromachining and Microfabrication Process Technology VI 4174, 130-141, 2000 | 148 | 2000 |
Materials issues in the processing, the operation and the reliability of MEMS A Witvrouw, HAC Tilmans, I De Wolf Microelectronic Engineering 76 (1-4), 245-257, 2004 | 93 | 2004 |
Method for depositing polycrystalline sige suitable for micromachining and devices obtained thereof K Baert, M Caymax, C Rusu, S Sedky, A Witvrouw US Patent 7,176,111, 2007 | 78 | 2007 |
CMOS-MEMS integration: why, how and what? A Witvrouw Proceedings of the 2006 IEEE/ACM international conference on Computer-aided …, 2006 | 71 | 2006 |
Poly SiGe, a promising material for MEMS monolithic integration with the driving electronics S Sedky, A Witvrouw, K Baert Sensors and Actuators A: Physical 97, 503-511, 2002 | 67 | 2002 |
Creep as a reliability problem in MEMS R Modlinski, A Witvrouw, P Ratchev, A Jourdain, V Simons, HAC Tilmans, ... Microelectronics Reliability 44 (9-11), 1733-1738, 2004 | 59 | 2004 |
Creep characterization of Al alloy thin films for use in MEMS applications R Modlinski, A Witvrouw, P Ratchev, R Puers, JMJ den Toonder, I De Wolf Microelectronic engineering 76 (1-4), 272-278, 2004 | 51 | 2004 |
Method for forming a hermetically sealed cavity A Witvrouw, RH Rico, JP Celis US Patent 8,062,497, 2011 | 50 | 2011 |
Determination of the plane stress elastic constants of thin films from substrate curvature measurements: Applications to amorphous metals A Witvrouw, F Spaepen Journal of applied physics 73 (11), 7344-7350, 1993 | 50 | 1993 |
Poly-SiGe, a superb material for MEMS A Witvrouw, M Gromova, A Mehta, S Sedky, P De Moor, K Baert, ... MRS Online Proceedings Library (OPL) 782, A2. 1, 2003 | 49 | 2003 |
New low-stress PECVD poly-SiGe layers for MEMS C Rusu, S Sedky, B Parmentier, A Verbist, O Richard, B Brijs, L Geenen, ... Journal of microelectromechanical systems 12 (6), 816-825, 2003 | 48 | 2003 |
CMOS–MEMS integration today and tomorrow A Witvrouw scripta materialia 59 (9), 945-949, 2008 | 47 | 2008 |
Creep-resistant aluminum alloys for use in MEMS R Modlinski, P Ratchev, A Witvrouw, R Puers, I De Wolf Journal of Micromechanics and Microengineering 15 (7), S165, 2005 | 47 | 2005 |