| Fully Aerosol Jet Printed Interconnects and Fill Materials for Millimeter Wave Circuits W Spain, Z Darpinian, C Crump, J Papapolymerou, P Chahal, JD Albrecht 2021 IEEE International Conference on Microwaves, Antennas, Communications …, 2021 | 8 | 2021 |
| UV Flash Sintering of Aerosol Jet Printed Silver Conductors for Microwave Circuit Applications C Crump, V Gjokaj, B Wright, J Papapolymerou, JD Albrecht, P Chahal IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2020 | 8 | 2020 |
| Direct Printing of Antennas on Large 3D Printed Plastic Structures V Gjokaj, C Crump, B Wright, P Chahal 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 666-670, 2020 | 8 | 2020 |
| Selective Dielectric Deposition using a Dam Process for Millimeter Wave Circuit Applications C Crump, V Gjokaj, P Chahal 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 1695-1700, 2021 | 7 | 2021 |
| Aerosol Jet Printed Antenna for Vehicular Communications A Chletsou, C Crump, J Papapolymerou, JF Locke 2020 Antenna Measurement Techniques Association Symposium (AMTA), 1-4, 2020 | 5 | 2020 |
| Vivaldi Antenna Array Fabricated Using a Hybrid Process V Gjokaj, C Crump, J Papapolymerou, J Albrecht, P Chahal 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 948-953, 2019 | 4 | 2019 |
| DC-to-Ka-band Broadband Chip-to-Chip Interconnect Using Aerosol Jet Printing JA Qayyum, C Crump, J Albrecht, AC Ulusoy, J Papapolymerou 2020 50th European Microwave Conference (EuMC), 252-255, 2021 | 3 | 2021 |
| 3-D Printed W-band Substrate Integrated Waveguide Filter Using a Dam-and-Fill Process W Spain, Y Chu, C Crump, P Chahal 2022 IEEE International Symposium on Antennas and Propagation and USNC-URSI …, 2022 | 2 | 2022 |
| A Substrate-less Process for Heterogeneous Integration of mm-Wave Circuits C Crump, Y Chu, P Chahal 54th International Symposium on Microelectronics 2021 (1), 000224-000227, 2021 | 2 | 2021 |
| A Monolithic Wilkinson Power Divider on Diamond via a Combination of Additive Manufacturing and Thin-Film Process X Konstantinou, CJ Herrera-Rodriguez, MT Craton, A Hardy, C Crump, ... 2020 IEEE Radio and Wireless Symposium (RWS), 201-204, 2020 | 2 | 2020 |
| Millimeter Wave Imaging Array Using a Chip First Additive Manufacturing Process Y Chu, C Crump, W Spain, P Chahal 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 1864-1869, 2021 | 1 | 2021 |
| Additive Manufacturing for Rapid Prototyping of MM-Wave Circuits CA Crump Michigan State University, 2021 | | 2021 |
Premjeet ChahalProfessor, Michigan State University在 msu.edu 的电子邮件经过验证
Premjeet ChahalProfessor, Michigan State University在 msu.edu 的电子邮件经过验证
Vincens GjokajMichigan State University在 msu.edu 的电子邮件经过验证