| Comparative study between the Sn–Ag–Cu/ENIG and Sn–Ag–Cu/ENEPIG solder joints under extreme temperature thermal shock R Tian, Y Tian, Y Huang, D Yang, C Chen, H Sun Journal of Materials Science: Materials in Electronics 32 (6), 6890-6899, 2021 | 26 | 2021 |
| Interfacial Microstructure and Mechanical Reliability of Sn-58Bi/ENEPIG Solder Joints C Chen, C Wang, H Sun, H Yin, X Gao, H Xue, D Ni, K Bian, Q Gu Processes 10 (2), 295, 2022 | 8 | 2022 |
| Study on Heterogeneous Al-Au Bonding on Microwave Hybrid Laminated Circuit Board H Sun, C Chen, D Ni, H Xue 2021 International Conference on Microwave and Millimeter Wave Technology …, 2021 | 2 | 2021 |
| Research on welding technology of surface mount device on high integration substrate C Chen, H Sun, D Ni, X Gao 2021 International Conference on Microwave and Millimeter Wave Technology …, 2021 | 1 | 2021 |
| 微波组件同轴-微带连接转换工艺研究 孙乎浩， 陈澄， 王成 电子工艺技术 38 (5), 276-279, 2017 | 1 | 2017 |
| 微波组件点胶工艺研究 陈澄 电子工艺技术 38 (6), 343-346, 2017 | 1 | 2017 |
| 微波组件壳体激光封焊工艺研究 陈澄， 王洪林， 孙乎浩， 王成 电子工艺技术, 28-31, 2016 | 1 | 2016 |
| A multi-stage temperature gradient assembly process for muti-channel T/R module C Chen, L Xie, H Sun 2022 23rd International Conference on Electronic Packaging Technology (ICEPT …, 2022 | | 2022 |
| Research on the mechanical reliability of the Sn-58Bi/ENEPIG BGA solder joints C Chen, C Wang, H Sun 2021 International Conference on Microwave and Millimeter Wave Technology …, 2021 | | 2021 |
| 微波组件用载体及芯片的返修工艺研究 陈澄， 孙乎浩， 谢璐 电子工艺技术 41 (2), 2020 | | 2020 |
| 微波组件馈电绝缘子装配工艺研究 陈澄， 于春永 电子工艺技术 37 (6), 353-355, 2016 | | 2016 |
