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Miao Wang
Miao Wang
在 ford.com 的电子邮件经过验证
标题
引用次数
引用次数
年份
A double-end sourced wire-bonded multichip SiC MOSFET power module with improved dynamic current sharing
M Wang, F Luo, L Xu
IEEE Journal of Emerging and Selected Topics in Power Electronics 5 (4 …, 2017
782017
Investigation and review of challenges in a high-temperature 30-kVA three-phase inverter using SiC MOSFETs
F Qi, M Wang, L Xu
IEEE Transactions on Industry Applications 54 (3), 2483-2491, 2018
342018
A double-end sourced multi-chip improved wire-bonded SiC MOSFET power module design
M Wang, F Luo, L Xu
2016 IEEE Applied Power Electronics Conference and Exposition (APEC), 709-714, 2016
132016
Common-mode noise comparison study for lateral wire-bonded and vertically integrated power modules
C Yao, W Li, H Li, C Han, M Wang, J Qian, X Zhang, F Luo, J Wang
2015 IEEE Energy Conversion Congress and Exposition (ECCE), 3092-3098, 2015
132015
Design and evaluation of 30kVA inverter using SiC MOSFET for 180° C ambient temperature operation
F Qi, M Wang, L Xu, B Zhao, Z Zhou, X Ren
2016 IEEE Applied Power Electronics Conference and Exposition (APEC), 2912-2918, 2016
112016
An optimized gate-loop layout for multi-chip SiC MOSFET power modules
M Wang, F Luo, L Xu
2015 IEEE 3rd Workshop on Wide Bandgap Power Devices and Applications (WiPDA …, 2015
62015
Sensorless control of BLDC motor from zero to low speed based on rotor saliency
Y Liu, M Wang, L Xu
2014 IEEE Conference and Expo Transportation Electrification Asia-Pacific …, 2014
62014
Stepping vector control of BLDC motor
Y Liu, L Xu, M Wang, M Jin
2014 IEEE Conference and Expo Transportation Electrification Asia-Pacific …, 2014
42014
An improved wire-bonded power module with double-end sourced structure
M Wang, F Luo, L Xu
2016 IEEE Energy Conversion Congress and Exposition (ECCE), 1-5, 2016
32016
Development of 30KVA inverter using SIC MOSFET for 180° C ambient temperature operation
F Qi, M Wang, L Xu
2016 IEEE International Power Electronics and Motion Control Conference …, 2016
22016
A high power-density three-phase inverter adopting the double-end sourced power module layout
M Wang, F Luo, W Li, J Qian, L Xu
2016 International Symposium on 3D Power Electronics Integration and …, 2016
22016
Design of A Double-End Sourced Multi-Chip Power Module and A High Power-Density Three-Phase Inverter
M Wang
The Ohio State University, 2016
2016
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