Overview on micro-and nanomechanical testing: New insights in interface plasticity and fracture at small length scales G Dehm, BN Jaya, R Raghavan, C Kirchlechner Acta Materialia 142, 248-282, 2018 | 333 | 2018 |
Can microscale fracture tests provide reliable fracture toughness values? A case study in silicon BN Jaya, C Kirchlechner, G Dehm Journal of Materials Research 30 (5), 686-698, 2015 | 184 | 2015 |
Superlattice effect for enhanced fracture toughness of hard coatings R Hahn, M Bartosik, R Soler, C Kirchlechner, G Dehm, PH Mayrhofer Scripta Materialia 124, 67-70, 2016 | 168 | 2016 |
Differences in deformation behavior of bicrystalline Cu micropillars containing a twin boundary or a large-angle grain boundary PJ Imrich, C Kirchlechner, C Motz, G Dehm Acta materialia 73, 240-250, 2014 | 162 | 2014 |
On the mechanical heterogeneity in dual phase steel grades: Activation of slip systems and deformation of martensite in DP800 C Tian, D Ponge, L Christiansen, C Kirchlechner Acta Materialia 183, 274-284, 2020 | 98 | 2020 |
Effects of structure and interfaces on fracture toughness of CrN/AlN multilayer coatings M Schlögl, C Kirchlechner, J Paulitsch, J Keckes, PH Mayrhofer Scripta materialia 68 (12), 917-920, 2013 | 95 | 2013 |
Dislocation-induced breakthrough of strength and ductility trade-off in a non-equiatomic high-entropy alloy W Guo, J Su, W Lu, CH Liebscher, C Kirchlechner, Y Ikeda, F Körmann, ... Acta Materialia 185, 45-54, 2020 | 94 | 2020 |
The influence of a brittle Cr interlayer on the deformation behavior of thin Cu films on flexible substrates: Experiment and model VM Marx, F Toth, A Wiesinger, J Berger, C Kirchlechner, MJ Cordill, ... Acta materialia 89, 278-289, 2015 | 94 | 2015 |
Size effect in bi-crystalline micropillars with a penetrable high angle grain boundary NV Malyar, JS Micha, G Dehm, C Kirchlechner Acta Materialia 129, 312-320, 2017 | 87 | 2017 |
Dislocation-twin boundary interaction in small scale Cu bi-crystals loaded in different crystallographic directions NV Malyar, JS Micha, G Dehm, C Kirchlechner Acta Materialia 129, 91-97, 2017 | 72 | 2017 |
Deformation-induced martensite: a new paradigm for exceptional steels S Djaziri, Y Li, GA Nematollahi, B Grabowski, S Goto, C Kirchlechner, ... Advanced Materials 28 (35), 7753-7757, 2016 | 71 | 2016 |
Microstructural and mechanical characterization of an equiatomic YGdTbDyHo high entropy alloy with hexagonal close-packed structure R Soler, A Evirgen, M Yao, C Kirchlechner, F Stein, M Feuerbacher, ... Acta materialia 156, 86-96, 2018 | 70 | 2018 |
Microscale fracture behavior of single crystal silicon beams at elevated temperatures BN Jaya, JM Wheeler, J Wehrs, JP Best, R Soler, J Michler, ... Nano letters 16 (12), 7597-7603, 2016 | 68 | 2016 |
Internal and external stresses: In situ TEM compression of Cu bicrystals containing a twin boundary PJ Imrich, C Kirchlechner, D Kiener, G Dehm Scripta materialia 100, 94-97, 2015 | 65 | 2015 |
Impact of instrumental constraints and imperfections on the dislocation structure in micron-sized Cu compression pillars C Kirchlechner, J Keckes, C Motz, W Grosinger, MW Kapp, JS Micha, ... Acta materialia 59 (14), 5618-5626, 2011 | 65 | 2011 |
Advanced nanomechanics in the TEM: effects of thermal annealing on FIB prepared Cu samples D Kiener, Z Zhang, S Šturm, S Cazottes, PJ Imrich, C Kirchlechner, ... Philosophical Magazine 92 (25-27), 3269-3289, 2012 | 63 | 2012 |
Mechanical size effects in a single crystalline equiatomic FeCrCoMnNi high entropy alloy R Raghavan, C Kirchlechner, BN Jaya, M Feuerbacher, G Dehm Scripta materialia 129, 52-55, 2017 | 61 | 2017 |
On the influence of microcantilever pre-crack geometries on the apparent fracture toughness of brittle materials S Brinckmann, K Matoy, C Kirchlechner, G Dehm Acta Materialia 136, 281-287, 2017 | 60 | 2017 |
Segregation-induced nanofaceting transition at an asymmetric tilt grain boundary in copper NJ Peter, T Frolov, MJ Duarte, R Hadian, C Ophus, C Kirchlechner, ... Physical review letters 121 (25), 255502, 2018 | 59 | 2018 |
Measuring electro-mechanical properties of thin films on polymer substrates MJ Cordill, O Glushko, J Kreith, VM Marx, C Kirchlechner Microelectronic engineering 137, 96-100, 2015 | 59 | 2015 |