| Microsphere-assisted, nanospot, non-destructive metrology for semiconductor devices S Kwon, J Park, K Kim, Y Cho, M Lee Light: Science & Applications 11 (1), 32, 2022 | 43 | 2022 |
| Thickness and surface measurement of transparent thin-film layers using white light scanning interferometry combined with reflectometry T Jo, KR Kim, SR Kim, HJ Pahk Journal of the Optical Society of Korea 18 (3), 236-243, 2014 | 41 | 2014 |
| Volumetric thin film thickness measurement using spectroscopic imaging reflectometer and compensation of reflectance modeling error K Kim, S Kim, S Kwon, HJ Pahk International Journal of Precision Engineering and Manufacturing 15, 1817-1822, 2014 | 31 | 2014 |
| Fast analysis of film thickness in spectroscopic reflectometry using direct phase extraction K Kim, S Kwon, HJ Pahk Current Optics and Photonics 1 (1), 29-33, 2017 | 27 | 2017 |
| Thickness measurement of a transparent thin film using phase change in white-light phase-shift interferometry J Kim, K Kim, HJ Pahk Current Optics and Photonics 1 (5), 505-513, 2017 | 20 | 2017 |
| Microsphere-assisted ultra-small spot spectral reflectometry technique for semiconductor device metrology S Kwon, K Kim, J Park, Y Cho, M Lee Metrology, Inspection, and Process Control for Semiconductor Manufacturing …, 2021 | 4 | 2021 |
| 위상추출법과 이미징 분광 반사계를 이용한 박막 두께 형상 측정 김광락 서울대학교 대학원, 2015 | 3 | 2015 |
| 선형가변필터와 CCD 카메라를 이용한 투명박막의 두께형상 측정 김광락 석사학위논문, 서울대학교 대학원, 2009 | 2 | 2009 |
| Microsphere-assisted hyperspectral imaging: super-resolution, non-destructive metrology for semiconductor devices J Park, Y Choi, S Kwon, Y Lee, J Kim, J Kim, J Lee, J Ahn, H Kwak, ... Light: Science & Applications 13 (1), 122, 2024 | 1 | 2024 |
| Automatic beam optimization method for scanning electron microscopy based on electron beam Kernel estimation Y Cho, J Cho, J Park, J Wang, S Jeong, J Lee, Y Hwang, J Kim, J Yu, ... Communications Engineering 3 (1), 82, 2024 | | 2024 |
| Microsphere-assisted Hybrid Spectroscopic Reflectometry Using Hyperspectral Imaging for Nanospot 3D Semiconductor Metrology S Kwon, J Park, Y Choi, K Kim, J Kim, Y Lee, M Lee, C Choi CLEO: Applications and Technology, AM2M. 4, 2023 | | 2023 |
| 백색광 간섭계를 이용한 TSV Bottom CD 측정 방법에 관한 연구 현창홍， 김성룡， 김광락， 박희재 한국생산제조학회 학술발표대회 논문집, 141-141, 2015 | | 2015 |
| 백색광 간섭계를 이용한 TSV 깊이 측정에서 기준거울의 영향 김광락， 김성룡， 현창홍， 황영민， 박희재 한국생산제조학회 학술발표대회 논문집, 124-124, 2013 | | 2013 |
Soonyang KwonPh.d in Mechanical Engineering, Seoul National University在 snu.ac.kr 的电子邮件经过验证
Soonyang KwonPh.d in Mechanical Engineering, Seoul National University在 snu.ac.kr 的电子邮件经过验证
Lee MyungjunSamsung Electronics在 kla-tencor.com 的电子邮件经过验证
Taeyong JoSeoul National University在 samsung.com 的电子邮件经过验证