| Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices CHC SKD Ye US Patent 7,504,284, 2009 | 137 | 2009 |
| Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices CHC SKD Ye US Patent 8,030,748, 2011 | 86 | 2011 |
| Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices WLL SKD Ye, CH Chong, CK Lee US Patent 7,557,443, 2009 | 84* | 2009 |
| Stacked device package for peripheral and center device pad layout device DYS Kim, CC Hui, LW Lai, RB Said US Patent 7,205,656, 2007 | 65 | 2007 |
| MICROELECTRONIC PACKAGES WITH SMALL FOOTPRINTS AND ASSOCIATED METHODS OF MANUFACTURING US Patent 8,923,004, 2014 | 64* | 2014 |
| Hormonal change and cytokine mRNA expression in peripheral blood mononuclear cells during the development of canine autoimmune thyroiditis EW Choi, IS Shin, DH Bhang, DH Lee, BK Bae, MS Kang, DY Kim, ... Clinical & Experimental Immunology 146 (1), 101-108, 2006 | 32 | 2006 |
| STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH SUPPORT MEMBERS AND ASSOCIATED SYSTEMS AND METHODS US Patent 9,418,974, 2016 | 31* | 2016 |
| Semiconductor component having chip on board leadframe DYS Kim, JTT Fook, LC Kuan US Patent 6,903,449, 2005 | 25 | 2005 |
| MICROELECTRONIC DEVICE PACKAGES, STACKED MICROELECTRONIC DEVICE PACKAGES, AND METHODS FOR MANUFACTURING MICROELECTRONIC DEVICES US Patent 9,627,367, 2017 | 21* | 2017 |
| STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH DIE SUPPORT MEMBERS AND ASSOCIATED SYSTEMS AND METHODS US Patent 9,406,660, 2016 | 18* | 2016 |
| Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices CHC SKD Ye US Patent 8,519,523, 2013 | 16 | 2013 |
| Semiconductor device packages including a controller element HWN SKD Ye US Patent 9,761,562, 2017 | 14* | 2017 |
| Method for fabricating semiconductor component with chip on board leadframe DYS Kim, JTT Fook, LC Kuan US Patent 7,049,173, 2006 | 14 | 2006 |
| Stacked microelectronic devices WLL SKD Ye, CH Chong, CK Lee US Patent 8,823,159, 2014 | 13* | 2014 |
| Method for manufacturing microelectronic devices WLL SKD Ye, CH Chong, CK Lee US Patent 8,507,318, 2013 | 11* | 2013 |
| Diluted magnetic semiconductor of p-type InMnP: Zn epilayer Y Shon, HC Jeon, YS Park, SJ Lee, DY Kim, HS Kim, TW Kang, YJ Park, ... Journal of crystal growth 281 (2-4), 501-507, 2005 | 11 | 2005 |
| Stacked die package for peripheral and center device pad layout device DYS Kim, CC Hui, LW Lai, RB Said US Patent 7,846,768, 2010 | 10 | 2010 |
| An experimental study on semiconductor process chiller for energy saving DA Cha, OK Kwon, JH Yun, DY Kim Proceeding of the KSME Spring Annual Conference, 371-376, 2010 | 10 | 2010 |
| Chip on board leadframe for semiconductor components having area array DYS Kim, JTT Fook, LC Kuan US Patent 7,459,778, 2008 | 7 | 2008 |
| Methods of manufacturing a semiconductor device package including a controller element HWN SKD Ye US Patent 10,014,281, 2018 | 6 | 2018 |
Ng Hong WanNanyang Technological University在 pmail.ntu.edu.sg 的电子邮件经过验证
Ng Hong WanNanyang Technological University在 pmail.ntu.edu.sg 的电子邮件经过验证