| An effective approach of reducing the keep-out-zone induced by coaxial through-silicon-via F Wang, Z Zhu, Y Yang, X Yin, X Liu, R Ding IEEE Transactions on Electron Devices 61 (8), 2928-2934, 2014 | 48 | 2014 |
| Miniaturized SIW bandpass filter based on TSV technology for THz applications F Wang, VF Pavlidis, N Yu IEEE Transactions on Terahertz Science and Technology 10 (4), 423-426, 2020 | 46 | 2020 |
| An ultracompact butterworth low-pass filter based on coaxial through-silicon vias F Wang, N Yu IEEE transactions on very large scale integration (VLSI) systems 25 (3 …, 2016 | 32 | 2016 |
| Simple and accurate inductance model of 3D inductor based on TSV F Wang, N Yu Electronics Letters 52 (21), 1815-1816, 2016 | 22 | 2016 |
| Capacitance characterization of tapered through-silicon-via considering MOS effect F Wang, Z Zhu, Y Yang, X Liu, R Ding Microelectronics Journal 45 (2), 205-210, 2014 | 19 | 2014 |
| A miniatured passive low-pass filter with ultrawide stopband based on 3-D integration technology X Yin, F Wang, Q Lu, X Liu, Y Liu, Y Yang IEEE Microwave and Wireless Components Letters 32 (1), 29-32, 2021 | 16 | 2021 |
| Analytical models for the thermal strain and stress induced by annular through-silicon-via (TSV) F Wang, Z Zhu, Y Yang, X Liu, R Ding IEICE Electronics Express 10 (20), 20130666-20130666, 2013 | 16 | 2013 |
| A novel guard method of through-silicon-via (TSV) F Wang, J Huang, N Yu IEICE Electronics Express 15 (11), 20180421-20180421, 2018 | 12 | 2018 |
| An effective approach of improving electrical and thermo-mechanical reliabilities of through-silicon vias F Wang, N Yu IEEE Transactions on Device and Materials Reliability 17 (1), 106-112, 2016 | 12 | 2016 |
| A thermal model for the top layer of 3D integrated circuits considering through silicon vias F Wang, Z Zhu, Y Yang, N Wang 2011 9th IEEE International Conference on ASIC, 618-620, 2011 | 12 | 2011 |
| Study on thermal stress and keep-out zone induced by Cu and SiO2 filled coaxial-annular through-silicon via F Wang, N Yu IEICE Electronics Express 12 (22), 20150844-20150844, 2015 | 11 | 2015 |
| Thermo-mechanical performance of Cu and SiO2 filled coaxial through-silicon-via (TSV) F Wang, Z Zhu, Y Yang, X Liu, R Ding IEICE Electronics Express 10 (24), 20130894-20130894, 2013 | 11 | 2013 |
| A transformer with high coupling coefficient and small area based on TSV F Wang, R Ren, X Yin, N Yu, Y Yang Integration 81, 211-220, 2021 | 10 | 2021 |
| A Miniaturized Wideband Interdigital Bandpass Filter With High Out-Band Suppression Based on TSV Technology for W-Band Application F Wang, K Zhang, X Yin, N Yu, Y Yang IEEE Transactions on Very Large Scale Integration (VLSI) Systems 30 (7), 989-992, 2022 | 9 | 2022 |
| Impedance matching for the reduction of signal reflection in high speed multilevel three-dimensional integrated chips X Liu, Z Zhu, Y Yang, F Wang, R Ding Journal of Semiconductors 35 (1), 015008, 2014 | 9 | 2014 |
| Characteristics of coaxial-annular through-silicon-via in microwave field F Wang, G Wang, N Yu 2016 17th International Conference on Electronic Packaging Technology (ICEPT …, 2016 | 8 | 2016 |
| A compact sixth-order common-mode noise suppression filter based on 3-D integration technology F Wang, C Hou, X Yin, N Yu, Y Yang IEEE Transactions on Components, Packaging and Manufacturing Technology 13 …, 2023 | 7 | 2023 |
| Design of compact LC lowpass filters based on coaxial through-silicon vias array X Yin, F Wang, VF Pavlidis, X Liu, Q Lu, T Zhang, Y Liu Microelectronics Journal 116, 105217, 2021 | 7 | 2021 |
| Effects of coaxial through-silicon via on carrier mobility along [100] and [110] crystal directions of (100) silicon F Wang, N Yu, Z Zhu, X Yin, Y Yang IEICE Electronics Express 12 (14), 20150434-20150434, 2015 | 7 | 2015 |
| A highly efficient heat-dissipation system using RDL and TTSV array in 3D IC F Wang, Y Li, N Yu 2019 IEEE International Conference on Electron Devices and Solid-State …, 2019 | 6 | 2019 |
