| Study of electromigration-induced formation of discrete voids in flip-chip solder joints by in-situ 3D laminography observation and finite-element modeling YW Chang, Y Cheng, F Xu, L Helfen, T Tian, M Di Michiel, C Chen, KN Tu, ... Acta Materialia 117, 100-110, 2016 | 71 | 2016 |
| Electromigration in Ni/Sn intermetallic micro bump joint for 3D IC chip stacking YM Lin, CJ Zhan, JY Juang, JH Lau, TH Chen, R Lo, M Kao, T Tian, KN Tu 2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 351-357, 2011 | 70 | 2011 |
| Electromigration mechanism of failure in flip-chip solder joints based on discrete void formation YW Chang, Y Cheng, L Helfen, F Xu, T Tian, M Scheel, M Di Michiel, ... Scientific reports 7 (1), 17950, 2017 | 50 | 2017 |
| Metallurgical challenges in microelectronic 3D IC packaging technology for future consumer electronic products KN Tu, T Tian Science China Technological Sciences 56, 1740-1748, 2013 | 47 | 2013 |
| Quantitative X-ray microtomography study of 3-D void growth induced by electromigration in eutectic SnPb flip-chip solder joints T Tian, K Chen, AA MacDowell, D Parkinson, YS Lai, KN Tu Scripta Materialia 65 (7), 646-649, 2011 | 43 | 2011 |
| Rapid diagnosis of electromigration induced failure time of Pb-free flip chip solder joints by high resolution synchrotron radiation laminography T Tian, F Xu, J Kyu Han, D Choi, Y Cheng, L Helfen, M Di Michiel, ... Applied Physics Letters 99 (8), 2011 | 27 | 2011 |
| A new physical model for life time prediction of Pb-free solder joints in electromigration tests T Tian, AM Gusak, OY Liashenko, JK Han, D Choi, KN Tu 2012 IEEE 62nd Electronic Components and Technology Conference, 741-746, 2012 | 12 | 2012 |
| Preferred orientation of 30 μm fine pitch Sn2. 5Ag micro-bumps studied by synchrotron polychromatic x-ray Laue microdiffraction T Tian, K Chen, M Kunz, N Tamura, CJ Zhan, TC Chang, KN Tu 2012 IEEE 62nd Electronic Components and Technology Conference, 882-885, 2012 | 4 | 2012 |
| Study of discrete voids formation in flip-chip solder joints due to electromigration using in-situ 3D laminography and finite-element modeling YW Chang, Y Cheng, F Xu, L Helfen, T Tian, M Di Michiel, C Chen, KN Tu, ... 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC), 141-146, 2016 | 1 | 2016 |
| Thermomigration in SnPb and Pb-Free Flip-Chip Solder Joints T Tian, KN Tu, HY Chen, HY Hsiao, C Chen Lead-free Solders: Materials Reliability for Electronics, 424-442, 2012 | | 2012 |
| A Study of the Link between Failure Mechanism of Flip Chip Solder Joints during Electromigration and Their Statistical Life Time Distribution T Tian UCLA, 2012 | | 2012 |
| A New Physical Model for Rapid Life Prediction of Pb-Free Flip Chip Solder Joints in Electromigration Tests T Tian, F Xu, JK Han, D Choi, Y Cheng, L Helfen, M Michiel, T Baumbach, ... AIP Conference Proceedings, 2012 | | 2012 |
| The Applications of Synchrotron Radiation X-rays 3D Imaging Techniques to The Study of Electromigration Failure in Flip-Chip Solder Joints T Tian UCLA, 2012 | | 2012 |
