| Aluminum Patterned Electroplating from AlCl3–[EMIm]Cl Ionic Liquid towards Microsystems Application MS Al Farisi, S Hertel, M Wiemer, T Otto Micromachines 9 (11), 589, 2018 | 30 | 2018 |
| Assembly and packaging of micro systems by using reactive bonding processes A Schumacher, U Gaiß, S Knappmann, G Dietrich, S Braun, E Pflug, ... 2015 European Microelectronics Packaging Conference (EMPC), 1-6, 2015 | 9 | 2015 |
| Reactive bonding with integrated reactive and nano scale energetic material systems (iRMS): State-of-the-Art and Future Development Trends J Braeuer, J Besser, S Hertel, R Masser, W Schneider, M Wiemer, ... ECS Transactions 64 (5), 329, 2014 | 7 | 2014 |
| Optimal design configuration for aluminum pillar fabrication towards fine pitch ultrasonic bonding applications I Cirulis, S Braun, K Vogel, F Roscher, M Wiemer, K Hiller, H Kuhn 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), 6-10, 2022 | 5 | 2022 |
| Reactive bonding K Vogel, S Braun, C Hofmann, M Weiser, M Wiemer, T Otto, H Kuhn 3D and Circuit Integration of MEMS, 309-329, 2021 | 5 | 2021 |
| Investigation of aluminum patterned electrodeposition process from AlCl3-[EMIm]Cl ionic liquid for microsystems application MS Al Farisi, S Hertel, M Wiemer, T Otto 2018 International Conference on Electronics Packaging and iMAPS All Asia …, 2018 | 5 | 2018 |
| Electroplated Aluminum Pillars for Ultrasonic Flip Chip Bonding S Braun, I Cirulis, JE Liedtke, K Hiller, M Wiemer, H Kuhn IMAPSource Proceedings 2022 (1), 000294-000299, 2023 | 4 | 2023 |
| Process Development of Aluminum Electroplating from an Ionic Liquid on 150 mm Wafer Level S Braun, M Wiemer, SE Schulz Micromachines 15 (6), 746, 2024 | 3 | 2024 |
| Investigation of Aluminum and Gold Flip-Chip Bonding for Quantum Device Integration I Cirulis, U Zschenderlein, S Braun, M Radestock, R Pantou, K Vogel, ... 2023 24th European Microelectronics and Packaging Conference & Exhibition …, 2023 | 3 | 2023 |
| Electroplating of Pd/Sn multilayers for reactive bonding in packaging and assembly applications S Hertel, K Vogel, M Wiemer, T Otto 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC), 1-5, 2020 | 3 | 2020 |
| Fine Pitch Aluminum Hybrid Bonding: Overcoming the Challenges in Plating, Passivation and Bonding I Cirulis, DS Kalangi, V Dubey, M Franz, D Wünsch, S Braun, M Haase, ... 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC), 1-4, 2024 | 1 | 2024 |
| Electrochemical deposition of reactive material systems for assembly and packaging applications S Hertel, W Schulte, M Weiser, M Becker, M Wiemer, T Otto Micro-Nano-Integration; 7th GMM-Workshop, 1-6, 2018 | 1 | 2018 |
| Aluminum-Aluminum Wafer Level Thermo Compression Bonding Using Thick Electroplated Aluminum Bonding Frames S Braun, I Cirulis, K Vogel, C Hofmann, M Wiemer 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC), 1-5, 2024 | | 2024 |
| Full-Field IR-Thermography for Bond-Quality Inspection of Electroplated Aluminium Interconnects for Cryo-SiP Architectures B Wunderle, D May, I Cirulis, S Braun, U Zschenderlein, J Heilmann, ... 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC), 1-9, 2024 | | 2024 |
| Full-Field Through-Chip IR-Thermography-based Quality Testing & Failure Analysis on Electroplated Aluminium Interconnects for Cryogenic Applications in Ion-Trap Quantum Computers D May, B Wunderle, I Cirulis, S Braun, U Zschenderlein, J Heilmann, ... 2024 25th International Conference on Thermal, Mechanical and Multi-Physics …, 2024 | | 2024 |
| Electroplating of Palladium‐Based Integrated Reactive Multilayer Systems (iRMS) K Vogel, S Braun, S Reede, M Becker, S Schmitz, K Froehner, ... Advanced Engineering Materials, 2400400, 2024 | | 2024 |
| CuO/Al reactive multilayers as internal heat source for wafer bonding K Vogel, F Roscher, S Braun, S Zimmermann, M Wiemer, H Kuhn MikroSystemTechnik Congress 2021; Congress, 1-4, 2021 | | 2021 |
| Galvanische Aluminium-Abscheidung auf unterschiedlichen Startschichten für die Leiterplatten-und Mikrosystemtechnik (Teil 1) S Braun, M Wiemer, T Otto | | 2020 |
| Fabrication of Nano Porous Gold towards Wafer Level Packaging S Hertel, A Jobke, M Wiemer, D Reuter, T Otto Smart Systems Integration; 13th International Conference and Exhibition on …, 2019 | | 2019 |
| Wafer-und Chipintegration mittels reaktiver CuO/Al Multilagensysteme K Vogel, S Braun, H Bender, F Roscher, S Zimmermann, M Wiemer | | 2019 |
