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Sangeon Lee
Sangeon Lee
Staff Engineer at Intel Corporation
Verified email at umich.edu
Title
Cited by
Cited by
Year
Highly stretchable or transparent conductor fabrication by a hierarchical multiscale hybrid nanocomposite
P Lee, J Ham, J Lee, S Hong, S Han, YD Suh, S Lee, J Yeo, SS Lee, ...
Advanced Functional Materials 24 (36), 5671-5678, 2014
3492014
High‐performance flexible transparent electrode with an embedded metal mesh fabricated by cost‐effective solution process
A Khan, S Lee, T Jang, Z Xiong, C Zhang, J Tang, LJ Guo, WD Li
Small 12 (22), 3021-3030, 2016
2182016
Superamphiphobic surface by nanotransfer molding and isotropic etching
S Lee, HJ Kim, SH Lee, DG Choi
Langmuir 29 (25), 8070-8075, 2013
782013
Highly robust silicon nanowire/graphene core–shell electrodes without polymeric binders
S Lee, HJ Kim, H Kim, JH Park, DG Choi
Nanoscale 5 (19), 8986-8991, 2013
392013
Gold-coated silicon nanowire–graphene core–shell composite film as a polymer binder-free anode for rechargeable lithium-ion batteries
HJ Kim, S Lee, J Lee, JY Jung, ES Lee, JH Choi, JH Jung, M Oh, S Hyun, ...
Physica E: Low-dimensional Systems and Nanostructures 61, 204-209, 2014
232014
Mass-producible superhydrophobic surfaces
S Lee, KW Lee, JH Kim, KC Lee, SS Lee, SU Hong
Chemical Communications 47 (43), 12005-12007, 2011
222011
Polymer‐free Vertical Transfer of Silicon Nanowires and their Application to Energy Storage
HJ Kim, J Lee, S Lee, W Kim, HJ Kim, DG Choi, JH Park
ChemSusChem 6 (11), 2144-2148, 2013
152013
Flexible Superhydrophobic Polymeric Surfaces with Micro‐/Nanohybrid Structures Using Black Silicon
S Lee, D Lee, P Lee, SH Ko, SS Lee, SU Hong
Macromolecular Materials and Engineering 298 (3), 311-317, 2013
132013
Embossed superhydrophobic polymer surfaces with topological variances
S Lee, HG Lim, SS Lee, DG Choi, D Lee, SU Hong
Macromolecular Research 21 (8), 916-920, 2013
122013
Bioinspired toughening mechanisms in a multilayer transparent conductor structure
S Lee, LJ Guo
ACS Applied Materials & Interfaces 14 (5), 7440-7449, 2022
102022
Optimized optical/electrical/mechanical properties of ultrathin metal films for flexible transparent conductor applications: review
YB Park, S Lee, M Tobah, T Ma, LJ Guo
Optical Materials Express 13 (2), 304-347, 2023
92023
Scalable Solution-processed Fabrication Strategy for High-performance, Flexible, Transparent Electrodes with Embedded Metal Mesh
A Khan, S Lee, T Jang, Z Xiong, C Zhang, J Tang, LJ Guo, WD Li
JoVE (Journal of Visualized Experiments), e56019, 2017
22017
Mechanical properties of Metal Based Flexible Transparent Conductive Electrode: From Fracture Mechanics perspective
S Lee
University of Michigan, 2019
12019
Food packing material having hydrophobicity, manufacturing method and mold thereof
JH Lee, KS Jo, SW Lee, MY Park, S Lee, KW Lee, JH Kim, HK Lim, ...
US Patent 9,427,923, 2016
12016
Food packing material having hydrophobicity, manufacturing method and mold thereof
S Lee
EP Patent App. EP2734454A4, 2015
12015
Large package body size scaling with two novel technologies: Multi Ball BGA and Liquid Metal Interconnect
X Lu, J Wu, S Lee, K Meyyappan
2024 IEEE 74th Electronic Components and Technology Conference (ECTC), 1293-1297, 2024
2024
Liquid metal (LM) dispensing apparatus and methods for design and operation of same
S Lee, T Gao, X Lu, MT Magnavita, J Wu
US Patent App. 17/851,968, 2023
2023
Direct injection filling device, system, and method for liquid metal interconnects
S Lee, T Gao, X Lu, J Wu, MT Magnavita, AW Carlson
US Patent App. 17/712,090, 2023
2023
Transparent and flexible conductors made by additive processes
LJ Guo, T Jang, S Lee, J Lee
US Patent 11,217,358, 2022
2022
Food packaging material having uniform coating of oil
S Lee
US Patent 20,190,022,899, 2019
2019
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Articles 1–20