| Spatial and temporal analysis of wind effects on PV module temperature and performance H Goverde, D Goossens, J Govaerts, V Dubey, F Catthoor, K Baert, ... Sustainable Energy Technologies and Assessments 11, 36-41, 2015 | 67 | 2015 |
| 3D stacking using bump-less process for sub 10um pitch interconnects J Derakhshandeh, I De Preter, C Gerets, L Hou, N Heylen, E Beyne, ... 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 128-133, 2016 | 31 | 2016 |
| Method for aligning micro-electronic components V Dubey, I De Wolf, E Beyne US Patent 9,601,459, 2017 | 19 | 2017 |
| Method for self-aligned solder reflow bonding and devices obtained thereof V Dubey, E Beyne, J Derakhshandeh US Patent 9,978,710, 2018 | 14 | 2018 |
| Die to wafer 3D stacking for below 10um pitch microbumps J Derakhshandeh, L Hou, I De Preter, C Gerets, S Suhard, V Dubey, ... 2016 IEEE International 3D Systems Integration Conference (3DIC), 1-4, 2016 | 14 | 2016 |
| Impact of Dielectric and Copper Via Design on Wafer-to-Wafer Hybrid Bonding V Dubey, D Wünsch, K Gottfried, M Wiemer, T Fischer, S Schermer, ... 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 795-799, 2023 | 11 | 2023 |
| Process and Design Challenges for Hybrid Bonding V Dubey, D Wünsch, K Gottfried, M Wiemer, T Fischer, A Hanisch, ... ECS Transactions 112 (3), 73, 2023 | 6 | 2023 |
| Fine pitch rapid heat self-aligned assembly and liquid-mediated direct bonding of Si chips V Dubey, J Derakhshandeh, E Beyne, JP Celis, I De Wolf IEEE Transactions on Components, Packaging and Manufacturing Technology 6 (6 …, 2016 | 6 | 2016 |
| Physics of self-aligned assembly at room temperature V Dubey, E Beyne, J Derakhshandeh, I De Wolf Physics of Fluids 30 (1), 2018 | 4 | 2018 |
| On the feasibility of die-to-wafer inorganic dielectric bonding T Wang, A Podpod, G Capuz, L Peng, A Phommahaxay, F Inoue, P Bex, ... 2016 6th Electronic System-Integration Technology Conference (ESTC), 1-5, 2016 | 4 | 2016 |
| Surface treatment to enable low temperature and pressure copper direct bonding V Dubey, J Derakhshandeh, E Beyne, C Gerets, E Cooper, P Laermans, ... 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 2435-2441, 2016 | 4 | 2016 |
| Simulation of photovoltaic modules H Goverde, F Catthoor, V Dubey, J Poortmans, C Baert US Patent App. 10/192,009, 2019 | 3* | 2019 |
| Room temperature and zero pressure high quality oxide direct bonding for 3D self-aligned assembly V Dubey, S Van Huylenbroeck, N Tutunjyan, J Slabbekoorn, I De Wolf, ... 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC), 579-582, 2014 | 3 | 2014 |
| Recent Developments in Low Temperature Wafer Level Metal Bonding for Heterogenous Integration HNVD Tobias Wernicke, Bernhard Rebhan, Vesa Vuorinen, Mervi Paulasto-Krockel ... ECS Journal of Solid State Science and Technology, 2024 | 2* | 2024 |
| Evaporation of confined droplet between parallel chips with varying gap at room temperature V Dubey Journal of Micromechanics and Microengineering 32 (7), 075001, 2022 | 2 | 2022 |
| Fine Pitch Aluminum Hybrid Bonding: Overcoming the Challenges in Plating, Passivation and Bonding I Cirulis, DS Kalangi, V Dubey, M Franz, D Wünsch, S Braun, M Hasse, ... 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC), 2024 | 1 | 2024 |
| Fine pitch 3D-integration using self-aligned assembly V Dubey Materials Engineering, KU Leuven, 2017 | 1 | 2017 |
| Liquid mediated direct bonding and bond propagation V Dubey, J Derakhshandeh, JM O'Callaghan, K Willems, KJ Rebibis, ... 2016 6th Electronic System-Integration Technology Conference (ESTC), 1-4, 2016 | 1 | 2016 |
| Investigations on Low-Temperature Aluminium Thermocompression Bonding Using Surface Passivation Technique K Diex, T Jäckel, V Dubey, D Wünsch, K Vogel, J Bonitz, A Hanisch, ... 2024 8th International Workshop on Low Temperature Bonding for 3D …, 2024 | | 2024 |
| Low Temperature LiTaO3-to-Si Wafer Bonding D Richter, D Wünsch, V Dubey, F Stoll, M Wiemer, S Schulz 2024 8th International Workshop on Low Temperature Bonding for 3D …, 2024 | | 2024 |
Ingrid De Wolfimec AND KU Leuven在 imec.be 的电子邮件经过验证
