| Improved RF devices for future adaptive wireless systems using two-sided contacting and AlN cooling LK Nanver, H Schellevis, TLM Scholtes, L La Spina, G Lorito, F Sarubbi, ... IEEE journal of solid-state circuits 44 (9), 2322-2338, 2009 | 25 | 2009 |
| Finite thickness influence on spherical and conical indentation on viscoelastic thin polymer film V Gonda, J Den Toonder, J Beijer, GQ Zhang, LJ Ernst J. Electron. Packag. 127 (1), 33-37, 2005 | 25 | 2005 |
| Prediction of thermo-mechanical integrity of wafer backend processes V Gonda, JMJ Den Toonder, J Beijer, GQ Zhang, WD van Driel, ... Microelectronics Reliability 44 (12), 2011-2017, 2004 | 21 | 2004 |
| Near-ideal implanted shallow-junction diode formation by excimer laser annealing V Gonda, A Burtsev, TLM Scholtes, LK Nanver 2005 13th International Conference on Advanced Thermal Processing of …, 2005 | 16 | 2005 |
| State-of-the-art of thermo-mechanical characterization of thin polymer films KMB Jansen, V Gonda, LJ Ernst, HJL Bressers, GQ Zhang | 14 | 2005 |
| Micro-mechanical testing of SiLK by nanoindentation and substrate curvature techniques V Gonda, KMB Jansen, LJ Ernst, J Den Toonder, GQ Zhang Microelectronics Reliability 47 (2-3), 248-251, 2007 | 11 | 2007 |
| Electrical characterization of residual implantation-induced defects in the vicinity of laser-annealed implanted ultrashallow junctions V Gonda, S Liu, TLM Scholtes, LK Nanver MRS Online Proceedings Library 912, 1-5, 2005 | 11 | 2005 |
| Mechanical characterization and modeling of low-dielectric-constant SiLK films using nano-indentation: time-and temperature-effects J Den Toonder, A Van Dijken, V Gonda, J Beijer, K Zhang, L Ernst 53rd Electronic Components and Technology Conference 2003, 708-713, 2003 | 11 | 2003 |
| Solder joint reliability based on creep strain energy density for SAC305 and doped SAC solders RSV Cruz, V Gonda MATEC Web of Conferences 343, 02005, 2021 | 10 | 2021 |
| Review of Peridynamics: Theory, Applications, and Future Perspectives. G Ladányi, V Gonda Journal of Mechanical Engineering/Strojniški Vestnik 67 (12), 2021 | 9 | 2021 |
| The relationship between surface and in-depth hardness for the nitrocarburizing treatment process M Réger, R Horváth, A Széll, T Réti, V Gonda, I Felde Metals 11 (5), 812, 2021 | 9 | 2021 |
| Reliability issues related to laser-annealed implanted back-wafer contacts in bipolar silicon-on-glass processes G Lorito, V Gonda, S Liu, TLM Scholtes, H Schellevis, LK Nanver 2006 25th International Conference on Microelectronics, 342-345, 2006 | 9 | 2006 |
| Thermal analysis and control for heating of an extrusion die R Vargas, V Gonda, L Ruiz Bánki Közlemények 1 (1), 63-66, 2018 | 6 | 2018 |
| Thermal budget considerations for excimer laser annealing of implanted dopants V Gonda, J Venturini, C Sabatier, J Van Der Cingel, LK Nanver Journal of optoelectronics and advanced materials 12 (3), 466, 2010 | 6 | 2010 |
| Excimer laser annealing for ultrashallow junctions and contacts V Gonda | 6 | 2008 |
| Silicon laser annealing by a two-pulse laser system with variable pulse offsets V Gonda, J Slabbekoorn, LK Nanver 2007 15th International Conference on Advanced Thermal Processing of …, 2007 | 6 | 2007 |
| Analysis of recrystallization peak occuring during DSC measurement GR Fejes, V Gonda, K Széll ACTA MATERIALIA TRANSYLVANICA (EN) 1 (2), 73-76, 2018 | 5 | 2018 |
| Integration of laser-annealed junctions in a low-temperature high-k metal-gate MISFET C Biasotto, V Jovanovic, V Gonda, J Van Der Cingel, S Milosavljevic, ... 2009 10th International Conference on Ultimate Integration of Silicon, 181-184, 2009 | 5 | 2009 |
| Ultrashallow doping by excimer laser drive-in of RPCVD surface deposited arsenic monolayers M Popadic, LK Nanver, C Biasotto, V Gonda, J Van Der Cingel 2008 16th IEEE International Conference on Advanced Thermal Processing of …, 2008 | 5 | 2008 |
| SiGe HBTs implemented with implanted laser-annealed emitters to completely eliminate the transient enhanced diffusion G Lorito, V Gonda, TLM Scholtes, LK Nanver 2008 26th International Conference on Microelectronics, 291-294, 2008 | 5 | 2008 |
Lis Nanver在 utwente.nl 的电子邮件经过验证
