| Optimal design configuration for aluminum pillar fabrication towards fine pitch ultrasonic bonding applications I Cirulis, S Braun, K Vogel, F Roscher, M Wiemer, K Hiller, H Kuhn 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), 6-10, 2022 | 5 | 2022 |
| Electroplated Aluminum Pillars for Ultrasonic Flip Chip Bonding S Braun, I Cirulis, JE Liedtke, K Hiller, M Wiemer, H Kuhn IMAPSource Proceedings 2022 (1), 000294-000299, 2023 | 4 | 2023 |
| Investigation of Aluminum and Gold Flip-Chip Bonding for Quantum Device Integration I Cirulis, U Zschenderlein, S Braun, M Radestock, R Pantou, K Vogel, ... 2023 24th European Microelectronics and Packaging Conference & Exhibition …, 2023 | 3 | 2023 |
| Fine Pitch Aluminum Hybrid Bonding: Overcoming the Challenges in Plating, Passivation and Bonding I Cirulis, DS Kalangi, V Dubey, M Franz, D Wünsch, S Braun, M Haase, ... 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC), 1-4, 2024 | 1 | 2024 |
| Aluminum-Aluminum Wafer Level Thermo Compression Bonding Using Thick Electroplated Aluminum Bonding Frames S Braun, I Cirulis, K Vogel, C Hofmann, M Wiemer 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC), 1-5, 2024 | | 2024 |
| Full-Field IR-Thermography for Bond-Quality Inspection of Electroplated Aluminium Interconnects for Cryo-SiP Architectures B Wunderle, D May, I Cirulis, S Braun, U Zschenderlein, J Heilmann, ... 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC), 1-9, 2024 | | 2024 |
| Full-Field Through-Chip IR-Thermography-based Quality Testing & Failure Analysis on Electroplated Aluminium Interconnects for Cryogenic Applications in Ion-Trap Quantum Computers D May, B Wunderle, I Cirulis, S Braun, U Zschenderlein, J Heilmann, ... 2024 25th International Conference on Thermal, Mechanical and Multi-Physics …, 2024 | | 2024 |
Steffen KurthFraunhofer ENAS在 enas.fraunhofer.de 的电子邮件经过验证
Steffen KurthFraunhofer ENAS在 enas.fraunhofer.de 的电子邮件经过验证