RF-powered battery-less Wireless Sensor Network in structural monitoring R Ge, H Pan, Z Lin, N Gong, J Wang, X Chen 2016 IEEE international conference on electro information technology (EIT …, 2016 | 16 | 2016 |
Sizing-priority based low-power embedded memory for mobile video applications SA Pourbakhsh, X Chen, D Chen, X Wang, N Gong, J Wang 2016 17th International Symposium on Quality Electronic Design (ISQED), 1-5, 2016 | 16 | 2016 |
Data-driven low-cost on-chip memory with adaptive power-quality trade-off for mobile video streaming D Chen, J Edstrom, X Chen, W Jin, J Wang, N Gong Proceedings of the 2016 International Symposium on Low Power Electronics and …, 2016 | 12 | 2016 |
Spider: Sizing-priority-based application-driven memory for mobile video applications N Gong, SA Pourbakhsh, X Chen, X Wang, D Chen, J Wang IEEE Transactions on Very Large Scale Integration (VLSI) Systems 25 (9 …, 2017 | 9 | 2017 |
Dummy TSV based bit-line optimization in 3D on-chip memory X Chen, SA Pourbakhsh, L Hou, N Gong, J Wang 2016 IEEE International Conference on Electro Information Technology (EIT …, 2016 | 3 | 2016 |
A novel hybrid delay unit based on dummy TSVs for 3-D on-chip memory X Chen, SA Pourbakhsh, J Fu, N Gong, J Wang IEEE Transactions on Very Large Scale Integration (VLSI) Systems 26 (7 …, 2018 | 2 | 2018 |
On-chip thermal management method based on phase change material J Fu, SA Pourbakhsh, X Chen, M Li, Z Lin, L Hou, F Haring, N Gong, ... 2017 IEEE 60th International Midwest Symposium on Circuits and Systems …, 2017 | 2 | 2017 |
High Performance Static Random Access Memory Design for Emerging Applications X Chen North Dakota State University, 2018 | | 2018 |
Closed form delay models for buffer-driven TSVs in 3D on-chip memory X Chen, SA Pourbakhsh, N Gong, J Wang 2017 IEEE 60th International Midwest Symposium on Circuits and Systems …, 2017 | | 2017 |
3D memory design based on through silicon vias enabled timing optimization X Chen, SA Pourbakhsh, L Hou, N Gong, J Wang 2016 5th International Symposium on Next-Generation Electronics (ISNE), 1-2, 2016 | | 2016 |