| Ultra-compact TSV-based LC low-pass filter with stopband up to 40 GHz for microwave application X Yin, Z Zhu, Y Liu, Q Lu, X Liu, Y Yang IEEE Transactions on Microwave Theory and Techniques 67 (2), 738-745, 2018 | 65 | 2018 |
| Compact bandpass filter and diplexer with wide-stopband suppression based on balanced substrate-integrated waveguide X Liu, Z Zhu, Y Liu, Q Lu, X Yin, Y Yang IEEE Transactions on Microwave Theory and Techniques 69 (1), 54-64, 2020 | 57 | 2020 |
| Metal proportion optimization of annular through-silicon via considering temperature and keep-out zone X Yin, Z Zhu, Y Yang, R Ding IEEE Transactions on Components, Packaging and Manufacturing Technology 5 (8 …, 2015 | 50 | 2015 |
| An effective approach of reducing the keep-out-zone induced by coaxial through-silicon-via F Wang, Z Zhu, Y Yang, X Yin, X Liu, R Ding IEEE Transactions on Electron Devices 61 (8), 2928-2934, 2014 | 49 | 2014 |
| Wideband substrate integrated waveguide bandpass filter based on 3-D ICs X Liu, Z Zhu, Y Liu, Q Lu, X Yin, Y Yang IEEE Transactions on Components, Packaging and Manufacturing Technology 9 (4 …, 2018 | 42 | 2018 |
| Effectiveness of Layer in Mitigating Substrate Noise Induced by Through-Silicon Via for Microwave Applications X Yin, Z Zhu, Y Yang, R Ding IEEE Microwave and Wireless Components Letters 26 (9), 687-689, 2016 | 36 | 2016 |
| 3-D compact 3-dB branch-line directional couplers based on through-silicon via technology for millimeter-wave applications Q Lu, Z Zhu, G Shan, Y Liu, X Liu, X Yin IEEE Transactions on Components, Packaging and Manufacturing Technology 9 (9 …, 2019 | 24 | 2019 |
| Wideband electromagnetic modeling of coaxial-annular through-silicon vias Q Lu, Z Zhu, Y Liu, X Liu, X Yin IEEE Transactions on Electromagnetic Compatibility 60 (6), 1915-1922, 2017 | 21 | 2017 |
| A miniatured passive low-pass filter with ultrawide stopband based on 3-D integration technology X Yin, F Wang, Q Lu, X Liu, Y Liu, Y Yang IEEE Microwave and Wireless Components Letters 32 (1), 29-32, 2021 | 17 | 2021 |
| A Miniaturized Wideband Interdigital Bandpass Filter With High Out-Band Suppression Based on TSV Technology for W-Band Application F Wang, K Zhang, X Yin, N Yu, Y Yang IEEE Transactions on Very Large Scale Integration (VLSI) Systems 30 (7), 989-992, 2022 | 12 | 2022 |
| A transformer with high coupling coefficient and small area based on TSV F Wang, R Ren, X Yin, N Yu, Y Yang Integration 81, 211-220, 2021 | 11 | 2021 |
| Electromagnetic modeling and analysis of the tapered differential through glass vias Y Liu, Z Zhu, X Liu, Q Lu, X Yin, L Guo, Y Yang Microelectronics Journal 83, 27-31, 2019 | 11 | 2019 |
| A Miniaturized Wideband SIR Interdigital Bandpass Filter With High Performance Based on TSV Technology for W-Band Application F Wang, K Zhang, X Yin, N Yu, Y Yang IEEE Transactions on Components, Packaging and Manufacturing Technology 13 …, 2023 | 10 | 2023 |
| A compact sixth-order common-mode noise suppression filter based on 3-D integration technology F Wang, C Hou, X Yin, N Yu, Y Yang IEEE Transactions on Components, Packaging and Manufacturing Technology 13 …, 2023 | 9 | 2023 |
| Design of compact LC lowpass filters based on coaxial through-silicon vias array X Yin, F Wang, VF Pavlidis, X Liu, Q Lu, T Zhang, Y Liu Microelectronics Journal 116, 105217, 2021 | 9 | 2021 |
| Thermo-mechanical characterization of single-walled carbon nanotube (SWCNT)-based through-silicon via (TSV) in (100) silicon X Yin, Z Zhu, Y Yang, R Ding Nanoscience and Nanotechnology Letters 7 (6), 481-485, 2015 | 9 | 2015 |
| Effects of coaxial through-silicon via on carrier mobility along [100] and [110] crystal directions of (100) silicon F Wang, N Yu, Z Zhu, X Yin, Y Yang IEICE Electronics Express 12 (14), 20150434-20150434, 2015 | 8 | 2015 |
| Optimization of 3D IC Routing Based on Thermal Equalization Analysis L Liu, F Wang, X Yin, C Sun, X Li, Y Li, N Yu, Y Yang IEEE Transactions on Device and Materials Reliability, 2024 | 6 | 2024 |
| Miniature and symmetrical Transformer based on through-silicon vias F Wang, R Ren, X Yin, N Yu, Y Yang IEEE Transactions on Components, Packaging and Manufacturing Technology 12 …, 2022 | 6 | 2022 |
| Compact TSV-based hairpin bandpass filter for THz applications F Wang, L Ke, X Yin, N Yu, Y Yang IEEE Access 9, 132078-132083, 2021 | 5 | 2021 |
