| A vapor-phase deposited polymer film to improve the adhesion of electroless-deposited copper layer onto various kinds of substrates JB You, SY Kim, YJ Park, YG Ko, SG Im Langmuir 30 (3), 916-921, 2014 | 48 | 2014 |
| Cost Effective 2.3D Packaging Solution by using Fanout Panel Level RDL Joonsung Kim, Yongjin Park, et al. 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), DOI …, 2021 | 26* | 2021 |
| Inductor device and method of manufacturing the same IS Kim, YJ Park, YG Ko, YS Seo, MS Kang, TH Min US Patent App. 15/003,925, 2016 | 17 | 2016 |
| Emerin represses STAT3 signaling through nuclear membrane-based spatial control B Lee, S Lee, Y Lee, Y Park, J Shim International Journal of Molecular Sciences 22 (13), 6669, 2021 | 8 | 2021 |
| System in package (SiP) semiconductor package MS Kang, YJ Park, YC Ko US Patent 11,508,639, 2022 | 3* | 2022 |
| Package module YJ Park, MS Kang, YG Ko US Patent App. 16/590,570, 17/685,227, 2020 | 3 | 2020 |
| Package board, method of manufacturing the same and stack type package using the same KW Bong, MS Kang, YW JI, HW Jung, YJ Park, YG Ko US Patent App. 14/736,128, 2016 | 2 | 2016 |
| Printed circuit board and method for manufacturing the same YJ Park, SG Im, JB You, YG Ko US Patent App. 13/929,740, 2014 | 2 | 2014 |
| Printed circuit board and method for manufacturing the same YJ Park, YG Ko, HW Jung, JS Kim US Patent App. 13/708,802, 2014 | 2 | 2014 |
| Semiconductor device and semiconductor package having the same SH Lee, JS Kim, JW Myung, YJ Park, JK Lee US Patent 11,670,568, 2023 | 1 | 2023 |
| Semiconductor package of enhanced thermal performance YJ Park, MS Kang, YC Ko, SH Lee US Patent App. 17/008,961, 2021 | 1* | 2021 |
| Insulation material, printed circuit board using the same and method of manufacturing the same YG Ko, YJ Park, KW Bong, HW Jung, YK Ko, JS Kim US Patent App. 14/444,964, 2015 | 1 | 2015 |
| PREDICTING THE THERMODYNAMIC PROPERTIES OF GOLD NANOPARTICLES USING DIFFERENT FORCE FIELDS Y Park The University of Akron, 2010 | 1 | 2010 |
| Triptolide, a Cancer Cell Proliferation Inhibitor, Causes Zebrafish Muscle Defects by Regulating Notch and STAT3 Signaling Pathways B Lee, Y Park, Y Lee, S Kwon, J Shim International Journal of Molecular Sciences 25 (9), 4675, 2024 | | 2024 |
| Inductor device and method of manufacturing the same IS Kim, YJ Park, YG Ko, YS Seo, MS Kang, TH Min US Patent 11,769,622, 2023 | | 2023 |
| Semiconductor package including frame in which semiconductor chip is embedded YJ Park, SK Lee, MI Kim, MS Kang, JH Lee, YG Ko US Patent 11,462,498, 2022 | | 2022 |
| Fan-out type semiconductor package and method of manufacturing the same MS Kang, YC Ko, YJ Park US Patent 11,387,225, 2022 | | 2022 |
| Semiconductor package YJ Park, SH Bae, W Choi US Patent 11,393,795, 2022 | | 2022 |
| Semiconductor package MS Kang, YG Ko, YJ Park, SH Moon US Patent 11,075,193, 2021 | | 2021 |
| Analysis on Distortion of Fan-Out Panel Level Packages (FOPLP) Yongjin Park, et al. 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), DOI …, 2021 | | 2021 |
Sung Gap ImKorea Advanced Institute of Science and Technology在 kaist.ac.kr 的电子邮件经过验证
Sung Gap ImKorea Advanced Institute of Science and Technology在 kaist.ac.kr 的电子邮件经过验证
Jae Bem YouAssistant professor, Chungnam National University在 cnu.ac.kr 的电子邮件经过验证