| Embedded cooling technologies for densely integrated electronic systems TE Sarvey, Y Zhang, L Zheng, P Thadesar, R Gutala, C Cheung, ... 2015 IEEE Custom Integrated Circuits Conference (CICC), 1-8, 2015 | 46 | 2015 |
| Airgap interconnects: Modeling, optimization, and benchmarking for backplane, pcb, and interposer applications V Kumar, R Sharma, E Uzunlar, L Zheng, R Bashirullah, P Kohl, MS Bakir, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 4 (8 …, 2014 | 36 | 2014 |
| Novel electrical and fluidic microbumps for silicon interposer and 3-D ICs L Zheng, Y Zhang, G Huang, MS Bakir IEEE Transactions on Components, Packaging and Manufacturing Technology 4 (5 …, 2014 | 35 | 2014 |
| 3-D stacked tier-specific microfluidic cooling for heterogeneous 3-D ICs Y Zhang, L Zheng, MS Bakir IEEE Transactions on Components, Packaging and Manufacturing Technology 3 …, 2013 | 35 | 2013 |
| A silicon interposer platform utilizing microfluidic cooling for high-performance computing systems L Zheng, Y Zhang, MS Bakir IEEE Transactions on Components, Packaging and Manufacturing Technology 5 …, 2015 | 22 | 2015 |
| IEEE Trans. Elec. Dev. JF Zhang, V Kumar, H Oh, L Zheng, GS May, A Naeemi, MS Bakir IEEE Trans. Elec. Dev 63, 2510-2516, 2016 | 21 | 2016 |
| Full-chip power supply noise time-domain numerical modeling and analysis for single and stacked ICs L Zheng, Y Zhang, MS Bakir IEEE transactions on electron devices 63 (3), 1225-1231, 2016 | 20 | 2016 |
| Silicon interposer with embedded microfluidic cooling for high-performance computing systems L Zheng, Y Zhang, X Zhang, MS Bakir 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 828-832, 2015 | 13 | 2015 |
| Low-loss silicon interposer for three-dimensional system integration with embedded microfluidic cooling PA Thadesar, L Zheng, MS Bakir 2014 Symposium on VLSI Technology (VLSI-Technology): Digest of Technical …, 2014 | 11 | 2014 |
| Design, fabrication and assembly of a novel electrical and microfluidic I/Os for 3-D chip stack and silicon interposer L Zheng, Y Zhang, MS Bakir 2013 IEEE 63rd Electronic Components and Technology Conference, 2243-2248, 2013 | 11 | 2013 |
| Impact of on-chip interconnect on the performance of 3-D integrated circuits with through-silicon vias: Part II X Zhang, V Kumar, H Oh, L Zheng, GS May, A Naeemi, MS Bakir IEEE Transactions on Electron Devices 63 (6), 2510-2516, 2016 | 10 | 2016 |
| Chip-to-chip interconnect integration technologies M Zia, C Zhang, HS Yang, L Zheng, M Bakir IEICE Electronics Express 13 (6), 20162001-20162001, 2016 | 10 | 2016 |
| Impact of on-chip interconnect on the performance of 3-D integrated circuits with through silicon vias: Part i V Kumar, H Oh, X Zhang, L Zheng, MS Bakir, A Naeemi IEEE Transactions on Electron Devices 63 (6), 2503-2509, 2016 | 9 | 2016 |
| Fabrication and characterization of electrical interconnects and microfluidic cooling for 3D ICS with silicon interposer H Oh, Y Zhang, L Zheng, GS May, MS Bakir Heat Transfer Engineering 37 (11), 903-911, 2016 | 7 | 2016 |
| A simulation tool for rapid investigation of trends in 3-DIC performance and power consumption W Wahby, L Zheng, Y Zhang, MS Bakir IEEE Transactions on Components, Packaging and Manufacturing Technology 6 (2 …, 2016 | 7 | 2016 |
| Interposer-to-interposer electrical and silicon photonic interconnection platform using silicon bridge HS Yang, C Zhang, M Zia, L Zheng, MS Bakir 2014 Optical Interconnects Conference, 71-72, 2014 | 6 | 2014 |
| Electrical and fluidic microbumps and interconnects for 3D-IC and silicon interposer L Zheng, MS Bakir 2012 IEEE International SOC Conference, 159-164, 2012 | 6 | 2012 |
| Electrical interconnect and microfluidic cooling within 3D ICs and silicon interposer H Oh, Y Zhang, L Zheng, MS Bakir International Conference on Nanochannels, Microchannels, and Minichannels …, 2014 | 4 | 2014 |
| Tier-independent microfluidic cooling for heterogeneous 3D ICs with nonuniform power dissipation Y Zhang, L Zheng, MS Bakir 2013 IEEE International Interconnect Technology Conference-IITC, 1-3, 2013 | 3 | 2013 |
| Compact modeling and optimization of fine-pitch interconnects for silicon interposers V Kumar, L Zheng, M Bakir, A Naeemi 2013 IEEE International Interconnect Technology Conference-IITC, 1-3, 2013 | 3 | 2013 |
Yang ZhangApple, Previous: Georgia Tech在 apple.com 的电子邮件经过验证
