| Modeling thermal stresses in 3-D IC interwafer interconnects J Zhang, MO Bloomfield, JQ Lu, RJ Gutmann, TS Cale IEEE transactions on semiconductor manufacturing 19 (4), 437-448, 2006 | 69 | 2006 |
| Thermal stresses in 3D IC inter-wafer interconnects J Zhang, MO Bloomfield, JQ Lu, RJ Gutmann, TS Cale Microelectronic Engineering 82 (3-4), 534-547, 2005 | 57 | 2005 |
| Integrated multiscale process simulation TS Cale, MO Bloomfield, DF Richards, KE Jansen, MK Gobbert Computational materials science 23 (1-4), 3-14, 2002 | 51 | 2002 |
| A computational framework for modelling grain-structure evolution in three dimensions MO Bloomfield, DF Richards, TS Cale Philosophical Magazine 83 (31-34), 3549-3568, 2003 | 39 | 2003 |
| Modeling pattern density dependent bump formation in copper electrochemical deposition YH Im, MO Bloomfield, S Sen, TS Cale Electrochemical and solid-state letters 6 (3), C42, 2003 | 37 | 2003 |
| Formation and evolution of grain structures in thin films MO Bloomfield, TS Cale Microelectronic engineering 76 (1-4), 195-204, 2004 | 29 | 2004 |
| Extension velocities for level set based surface profile evolution DF Richards, MO Bloomfield, S Sen, TS Cale Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 19 (4 …, 2001 | 29 | 2001 |
| Passivity-based iterative learning control design for selective laser melting MJB Spector, Y Guo, S Roy, MO Bloomfield, A Maniatty, S Mishra 2018 Annual American Control Conference (ACC), 5618-5625, 2018 | 20 | 2018 |
| Thermomechanical behavior of EUV pellicle under dynamic exposure conditions DL Goldfarb, MO Bloomfield, M Colburn Extreme Ultraviolet (EUV) Lithography VII 9776, 601-611, 2016 | 18 | 2016 |
| Stress-induced grain boundary migration in polycrystalline copper MO Bloomfield, DN Bentz, TS Cale Journal of electronic materials 37, 249-263, 2008 | 16 | 2008 |
| Modeling plasma processes in microelectronics DF Richards, MO Bloomfield, S Soukane, TS Cale Vacuum 59 (1), 168-178, 2000 | 13 | 2000 |
| Simulation of finite-strain inelastic phenomena governed by creep and plasticity Z Li, MO Bloomfield, AA Oberai Computational Mechanics 62, 323-345, 2018 | 10 | 2018 |
| Two deterministic approaches to topography evolution TS Cale, MO Bloomfield, MK Gobbert Surface and Coatings Technology 201 (22-23), 8873-8877, 2007 | 9 | 2007 |
| Thermally induced stresses in 3D-IC inter-wafer interconnects: A combined grain-continuum and continuum approach MO Bloomfield, DN Bentz, JQ Lu, RJ Gutmann, TS Cale Microelectronic engineering 84 (11), 2750-2756, 2007 | 8 | 2007 |
| Modeling and simulation of plasma enhanced processing for integrated circuit fabrication V Prasad, MO Bloomfield, DF Richards, H Liang, TS Cale Vacuum 65 (3-4), 443-455, 2002 | 7 | 2002 |
| Modeling thermal stresses of copper interconnects in 3D IC structures DN Bentz, J Zhang, M Bloomfield, JQ Lu, RJ Gutmann, TS Cale Proc. COMSOL Multiphysics User's Conference, 2005 | 6 | 2005 |
| Modeling of ionized magnetron sputtering of copper MO Bloomfield, TS Cale MRS Online Proceedings Library (OPL) 616, 147, 2000 | 6 | 2000 |
| Component-based workflows for parallel thermomechanical analysis of arrayed geometries MO Bloomfield, Z Li, B Granzow, DA Ibanez, AA Oberai, GA Hansen, ... Engineering with Computers 33, 509-517, 2017 | 5 | 2017 |
| Electrochem. & Solid-State Lett. 6 YH Im, MO Bloomfield, S Sen, TS Cale C42, 2003 | 5 | 2003 |
| Grain based modeling of stress induced copper migration for 3D-IC interwafer vias DN Bentz, MO Bloomfield, H Huang, RJ Gutmann, TS Cale 2006 International Conference on Simulation of Semiconductor Processes and …, 2006 | 4 | 2006 |
Jing ZhangAssociate Professor of Mechanical Engineering, Purdue University in Indianapolis在 purdue.edu 的电子邮件经过验证
