| Galvanically isolated, power and electromagnetic side-channel attack resilient secure AES core with integrated charge pump based power management M Wang, S Xie, PN Li, A Sayal, G Li, VV Iyer, A Thimmaiah, M Orshansky, ... 2021 IEEE Custom Integrated Circuits Conference (CICC), 1-2, 2021 | 7 | 2021 |
| Java JIT Testing with Template Extraction Z Zang, FY Yu, A Thimmaiah, A Shi, M Gligoric arXiv preprint arXiv:2403.11281, 2024 | 2 | 2024 |
| A hierarchical classification method for high-accuracy instruction disassembly with near-field EM measurements VV Iyer, A Thimmaiah, M Orshansky, A Gerstlauer, AE Yilmaz ACM Transactions on Embedded Computing Systems 23 (1), 1-21, 2024 | 2 | 2024 |
| Machine learning for executable code in software testing and verification P Nie | 2 | 2023 |
| Pattern-Based Peephole Optimizations with Java JIT Tests Z Zang, A Thimmaiah, M Gligoric Proceedings of the 32nd ACM SIGSOFT International Symposium on Software …, 2023 | 2 | 2023 |
| High-level simulation of embedded software vulnerabilities to EM side-channel attacks A Thimmaiah, VV Iyer, A Gerstlauer, M Orshansky International Conference on Embedded Computer Systems, 155-170, 2022 | 2 | 2022 |
| JOG: Java JIT Peephole Optimizations and Tests from Patterns Z Zang, A Thimmaiah, M Gligoric Proceedings of the 2024 IEEE/ACM 46th International Conference on Software …, 2024 | 1 | 2024 |
| Testing the resilience of cryptographic modules against fine-grained time-and frequency-domain EM side-channel analysis attacks V Iyer, A Thimmaiah, A Yilmaz 2021 International Conference on Electromagnetics in Advanced Applications …, 2021 | 1 | 2021 |
| ExLi: An Inline-Test Generation Tool for Java Y Liu, A Thimmaiah, O Legunsen, M Gligoric The ACM International Conference on the Foundations of Software Engineering …, 2024 | | 2024 |
| Object Graph Programming A Thimmaiah, L Lampropoulos, C Rossbach, M Gligoric Proceedings of the 46th IEEE/ACM International Conference on Software …, 2024 | | 2024 |
| MoM-Hb Algorithm for Prediction of High Voltage Interference in Automotive Active Circuitry T Aditya, BP Nayak, A Devi, D Gope 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging …, 2018 | | 2018 |
| ICSE-Companion 2024 W Minn, YN Tun, Z Zang, A Thimmaiah, S Lazreg, M Cordy | | |
