| Characteristics of coupling capacitance between signal-ground TSVs considering MOS effect in silicon interposers R Fang, X Sun, M Miao, Y Jin IEEE Transactions on Electron Devices 62 (12), 4161-4168, 2015 | 23 | 2015 |
| Measurement-based electrical characterization of through silicon vias and transmission lines for 3D integration X Sun, R Fang, Y Zhu, X Zhong, Y Bian, Y Guan, M Miao, J Chen, Y Jin Microelectronic Engineering 149, 145-152, 2016 | 22 | 2016 |
| A 3D micro-channel cooling system embedded in LTCC packaging substrate S Jia, M Miao, R Fang, S Guo, D Hu, Y Jin 2012 7th IEEE International Conference on Nano/Micro Engineered and …, 2012 | 15 | 2012 |
| Investigation of micromachined LTCC functional modules for high-density 3D SIP based on LTCC packaging platform M Miao, Y Jin, R Fang, F Mu, S Guo, X Zhang, Y Zhang, D Hu, Z Li, ... 2013 IEEE 63rd Electronic Components and Technology Conference, 1815-1822, 2013 | 13 | 2013 |
| Development and characterization of a through-multilayer TSV integrated SRAM module Y Zhu, S Ma, X Sun, R Fang, X Zhong, Y Bian, M Chen, J Chen, M Miao, ... 2013 IEEE 63rd Electronic Components and Technology Conference, 885-890, 2013 | 12 | 2013 |
| Design, fabrication, and performance characterization of LTCC-based capacitive accelerometers H Liu, R Fang, M Miao, Y Zhang, Y Yan, X Tang, H Lu, Y Jin Micromachines 9 (3), 120, 2018 | 11 | 2018 |
| Investigation of cooling performance of micro-channel structure embedded in LTCC substrate for 3D micro-system D Hu, M Miao, S Ma, R Fang, S Guo, Y Jin 2012 IEEE 11th International Conference on Solid-State and Integrated …, 2012 | 11 | 2012 |
| Modeling and design of a 3D interconnect based circuit cell formed with 3D SiP techniques mimicking brain neurons for neuromorphic computing applications M Miao, L Wang, T Chen, L Sun, X Duan, J Zhang, N Li, R Fang, X Sun, ... 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 490-497, 2018 | 10 | 2018 |
| Defect detection for the TSV transmission channel using machine learning approach H Liu, R Fang, M Miao, Y Yang, Y Jin 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 2168-2172, 2019 | 7 | 2019 |
| Thermal-mechanical reliability assessment of TSV structure for 3D IC integration H Liu, Q Zeng, Y Guan, R Fang, X Sun, F Su, J Chen, M Miao, Y Jin 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC), 758-764, 2016 | 5 | 2016 |
| Noise coupling between through-silicon vias and active devices for 20/14-nm technology nodes R Fang, X Sun, M Miao, Y Jin AIP Advances 5 (4), 2015 | 5 | 2015 |
| Electrical measurement and analysis of TSV/RDL for 3D integration X Sun, R Fang, Y Zhu, X Zhong, Y Bian, S Ma, M Miao, J Chen, Y Wang, ... 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC), 709-712, 2014 | 5 | 2014 |
| Modeling and analysis of TSV noise coupling and suppression methods for 20nm node and beyond R Fang, X Sun, Y Jin, M Miao 2014 15th International Conference on Electronic Packaging Technology, 783-787, 2014 | 4 | 2014 |
| Fast time domain crosstalk analysis of through silicon vias based on equivalent circuit model Z Zhang, R Fang, G Wang, X Sun, Y Jin, M Miao 2014 15th International Conference on Electronic Packaging Technology, 134-137, 2014 | 4 | 2014 |
| Study of TSV leakage current and breakdown voltage Y Xu, G Wang, X Sun, R Fang, M Miao, Y Jin 2013 14th International Conference on Electronic Packaging Technology, 458-461, 2013 | 4 | 2013 |
| Simulation-based investigation in effects of design parameters on electrical characters for a TSV-bump combination R Fang, X Sun, M Miao, Y Jin 2012 13th International Conference on Electronic Packaging Technology & High …, 2012 | 4 | 2012 |
| Bias-dependent high frequency characterization of through-silicon via (TSV) for 3D integration X Sun, R Fang, H Liu, M Miao, Y Jin 2016 IEEE MTT-S International Microwave Workshop Series on Advanced …, 2016 | 3 | 2016 |
| Micromachined cavity-based bandpass filter and suspended planar slow-wave structure for vacuum-microelectronic millimeter-wave/THz microsystem embedded in LTCC packaging substrates M Miao, R Fang, X Zhang, B Ning, F Mu, Z Li, W Xiang, Y Jin 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 1767-1773, 2015 | 3 | 2015 |
| In-line testing of blind TSVs for 3D IC integration and M/NEMS packaging Y Xu, G Wang, X Sun, R Fang, M Miao, Y Jin The 8th Annual IEEE International Conference on Nano/Micro Engineered and …, 2013 | 3 | 2013 |
| Accurate Modeling of the Capacitance of Through-Silicon Via Considering Minority Carrier Effects H Liu, R Fang, M Miao, Y Jin IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2020 | 2 | 2020 |
