| Intrinsically stretchable organic solar cells with efficiencies of over 11% J Noh, GU Kim, S Han, SJ Oh, Y Jeon, D Jeong, SW Kim, TS Kim, BJ Kim, ... ACS Energy Letters 6 (7), 2512-2518, 2021 | 89 | 2021 |
| Aqueous-soluble naphthalene diimide-based polymer acceptors for efficient and air-stable all-polymer solar cells S Lee, Y Kim, Z Wu, C Lee, SJ Oh, NT Luan, J Lee, D Jeong, K Zhang, ... ACS applied materials & interfaces 11 (48), 45038-45047, 2019 | 39 | 2019 |
| Unveiling the annealing-dependent mechanical properties of freestanding indium tin oxide thin films SJ Oh, JH Kwon, S Lee, KC Choi, TS Kim ACS Applied Materials & Interfaces 13 (14), 16650-16659, 2021 | 30 | 2021 |
| Intrinsic Mechanical Properties of Free-Standing SiNx Thin Films Depending on PECVD Conditions for Controlling Residual Stress SJ Oh, BS Ma, C Yang, TS Kim ACS Applied Electronic Materials 4 (8), 3980-3987, 2022 | 13 | 2022 |
| A Study on the dynamic bending property of chip-on-flex assembly using anchoring polymer layer anisotropic conductive films Y Pan, SJ Oh, JH Kim, TS Kim, KW Paik IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2020 | 10 | 2020 |
| Study of mechanical degradation of freestanding ALD Al2O3 by a hygrothermal environment and a facile protective method for environmentally stable Al2O3: Toward highly reliable … S Lee, Y Jeon, SJ Oh, SW Lee, KC Choi, TS Kim, JH Kwon Materials Horizons 10 (10), 4488-4500, 2023 | 8 | 2023 |
| On-skin and tele-haptic application of mechanically decoupled taxel array on dynamically moving and soft surfaces SY Kwon, G Park, H Jin, C Gu, SJ Oh, JY Sim, W Youm, TS Kim, HJ Kim, ... npj Flexible Electronics 6 (1), 98, 2022 | 8 | 2022 |
| Elucidating the effect of Ag interlayer formation on the intrinsic mechanical properties of free-standing ITO/Ag/ITO thin films SJ Oh, S Lee, KC Choi, JH Kwon, TS Kim Journal of Materials Chemistry C 11 (22), 7262-7271, 2023 | 7 | 2023 |
| Measurement of mechanical properties of thin film materials for flexible displays SJ Oh, BS Ma, HJ Kim, C Yang, TS Kim Journal of the Microelectronics and Packaging Society 27 (3), 77-81, 2020 | 3 | 2020 |
| Bonding characteristics between carbonized copper and a glass/phenolic composite S Oh, M Kim, J Choe Composite Structures 147, 294-301, 2016 | 3 | 2016 |
| Integration of Large-Area Halide Perovskite Single Crystals and Substrates via Chemical Welding Using an Ionic Liquid for Applications in X-ray Detection MK Kim, YS Choi, D Kim, K Heo, SJ Oh, S Lee, J An, H Yoo, SH Kim, ... ACS Applied Materials & Interfaces 15 (49), 57404-57414, 2023 | 1 | 2023 |
| A Study on the Fabric Substrates With Fine-Pitch Laminated Cu Metal Patterns Using B-Stage Adhesive Films SY Jung, SJ Oh, TI Lee, TS Kim, KW Paik IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2019 | 1 | 2019 |
| Measurement of EMC/PCB Interfacial Adhesion Energy of Chip Package Considering Warpage HJ Kim, KH Ahn, SJ Oh, DH Kim, JS Kim, ES Kim, TS Kim Journal of the Microelectronics and Packaging Society 26 (4), 101-105, 2019 | 1 | 2019 |
| Nanolaminate‐Induced Mechanically and Environmentally Robust Al2O3/TiO2 Thin Film Encapsulation by Low‐Temperature Atomic Layer Deposition: Toward Flexible and Wearable OLEDs SJ Oh, SW Lee, H Lee, H Kim, TS Kim, JH Kwon Advanced Materials Technologies, 2400381, 2024 | | 2024 |
| Highly Efficient and Reliable Organic Light–Emitting Diodes Enabled by a Multifunctional Hazy Substrate for Extreme Environments (Adv. Funct. Mater. 18/2024) Y Jeon, TY Lee, M Nam, H Lee, H Kim, SW Lee, SJ Oh, S Choi, JY Yang, ... Advanced Functional Materials 34 (18), 2470098, 2024 | | 2024 |
| Highly Efficient and Reliable Organic Light–Emitting Diodes Enabled by a Multifunctional Hazy Substrate for Extreme Environments Y Jeon, TY Lee, M Nam, H Lee, H Kim, SW Lee, SJ Oh, S Choi, JY Yang, ... Advanced Functional Materials 34 (18), 2310268, 2024 | | 2024 |
| Plane Stress Fracture Toughness Testing of Freestanding Ultra‐Thin Nanocrystalline Gold Films on Water Surface M Song, BS Ma, SJ Oh, TS Kim Small Methods, 2301220, 2024 | | 2024 |
| Elucidating the Mechanical Properties of Transparent Conductive Thin Films for Mechanically Reliable Microelectronics SJ Oh, KC Choi, JH Kwon, TS Kim The 21st International Symposium on Microelectronics and Packaging (ISMP), 2023 | | 2023 |
| Water Sureface Platform for Elucidating Thickness-Dependent Plane Stress Fracture Toughness or Ultra-Thin Nanocrystalline Gold Films M Song, BS Ma, SJ Oh, TS Kim ICEM20 - 20th International Conference on Experimental Mechanics, 2023 | | 2023 |
| MECHANICAL BEHAVIOUR OF TRANSPARENT CONDUCTING OXIDE THIN FILMS FOR ADVANCED ELECTRONIC APPLICATIONS SJ Oh, JH Kwon, S Lee, TS Kim ICEM20 - 20th International Conference on Experimental Mechanics, 2023 | | 2023 |
Taek-Soo KimProfessor of Mechanical Engineering, KAIST在 kaist.ac.kr 的电子邮件经过验证
