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| Sintered nanocopper paste for high-performance 3D heterogeneous package integration Y Wang, AO Watanabe, N Ogura, PM Raj, R Tummala Journal of Electronic Materials 49, 6737-6745, 2020 | 16 | 2020 |
| 8.1 μm-emitting InP-based quantum cascade laser grown on Si by metalorganic chemical vapor deposition LJM S. Xu, S. Zhang, J. D. Kirch, H. Gao, Y. Wang, M. L. Lee, R. Tatavarti ... Applied Physics Letters 123 (3), 031110, 2023 | 12 | 2023 |
| Low-loss additively-deposited ultra-short copper-paste interconnections in 3D antenna-integrated packages for 5G and IoT applications AO Watanabe, Y Wang, N Ogura, PM Raj, V Smet, MM Tentzeris, ... 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 972-976, 2019 | 8 | 2019 |
| AlGaAsP Distributed Bragg Reflectors for GaAsP/Si Solar Cells B Li, Y Wang, A Birge, B Kim, X Fang, ML Lee IEEE Journal of Photovoltaics, 2024 | | 2024 |
