| High-frequency scalable electrical model and analysis of a through silicon via (TSV) J Kim, JS Pak, J Cho, E Song, J Cho, H Kim, T Song, J Lee, H Lee, K Park, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 1 (2 …, 2011 | 524 | 2011 |
| Near-memory processing in action: Accelerating personalized recommendation with axdimm L Ke, X Zhang, J So, JG Lee, SH Kang, S Lee, S Han, YG Cho, JH Kim, ... IEEE Micro 42 (1), 116-127, 2021 | 98 | 2021 |
| Memory module B So, JH Cho, JJ Lee, JJ Lee US Patent 7,072,201, 2006 | 95 | 2006 |
| Memory module system with efficient control of on-die termination B So, JH Cho, JJ Lee US Patent 7,180,327, 2007 | 64 | 2007 |
| Stacked board-on-chip package having mirroring structure and dual inline memory module on which the stacked board-on-chip packages are mounted JH Cho, JJ Lee, D Kim, B So US Patent 7,276,786, 2007 | 44 | 2007 |
| Aquabolt-XL: Samsung HBM2-PIM with in-memory processing for ML accelerators and beyond JH Kim, S Kang, S Lee, H Kim, W Song, Y Ro, S Lee, D Wang, H Shin, ... 2021 IEEE Hot Chips 33 Symposium (HCS), 1-26, 2021 | 43 | 2021 |
| Through silicon via (TSV) equalizer J Kim, E Song, J Cho, JS Pak, J Lee, H Lee, K Park, J Kim 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging …, 2009 | 43 | 2009 |
| Mixed-mode ABCD parameters: Theory and application to signal integrity analysis of PCB-level differential interconnects J Cho, E Song, H Kim, S Ahn, JS Pak, J Kim, J Kim IEEE transactions on electromagnetic compatibility 53 (3), 814-822, 2010 | 30 | 2010 |
| Memory module with registers K Park, JH Cho, B So, JJ Lee, Y Yun, KS Kim US Patent 7,818,488, 2010 | 28 | 2010 |
| Aquabolt-XL HBM2-PIM, LPDDR5-PIM with in-memory processing, and AXDIMM with acceleration buffer JH Kim, SH Kang, S Lee, H Kim, Y Ro, S Lee, D Wang, J Choi, J So, ... IEEE Micro 42 (3), 20-30, 2022 | 25 | 2022 |
| Modeling and design optimization of a wideband passive equalizer on PCB based on near-end crosstalk and reflections for high-speed serial data transmission E Song, J Cho, J Kim, Y Shim, G Kim, J Kim IEEE Transactions on Electromagnetic Compatibility 52 (2), 410-420, 2010 | 24 | 2010 |
| Circuit for controlling an AC-timing parameter of a semiconductor memory device and method thereof JH Cho, BC Kim US Patent 6,795,354, 2004 | 24* | 2004 |
| A compact and wide-band passive equalizer design using a stub with defected ground structure for high speed data transmission Y Shim, W Lee, E Song, J Cho, J Kim IEEE microwave and wireless components letters 20 (5), 256-258, 2010 | 22 | 2010 |
| Accurate high frequency lossy model of differential signal line including mode-conversion and common-mode propagation effect S Baek, S Ahn, J Park, J Kim, J Kim, J Cho 2004 International Symposium on Electromagnetic Compatibility (IEEE Cat. No …, 2004 | 19 | 2004 |
| Improving in-memory database operations with acceleration DIMM (AxDIMM) D Lee, J So, M Ahn, JG Lee, J Kim, J Cho, R Oliver, VC Thummala, R JV, ... Proceedings of the 18th International Workshop on Data Management on New …, 2022 | 18 | 2022 |
| A wide-band passive equalizer design on PCB based on near-end crosstalk and reflections for 12.5 Gbps serial data transmission E Song, J Cho, W Lee, M Shin, J Kim IEEE microwave and wireless components letters 18 (12), 794-796, 2008 | 16 | 2008 |
| Scaling of Memory Performance and Capacity with CXL Memory Expander. SJ Park, H Kim, KS Kim, J So, J Ahn, WJ Lee, D Kim, YJ Kim, J Seok, ... HCS, 1-27, 2022 | 15 | 2022 |
| SMT: Software-defined memory tiering for heterogeneous computing systems with CXL memory expander K Kim, H Kim, J So, W Lee, J Im, S Park, J Cho, H Song IEEE Micro 43 (2), 20-29, 2023 | 14 | 2023 |
| Circuit Board Assemblies and Data Processing Systems Including the Same JH Cho, MH Sung, KS Kim, SJ Seo, JJ Lee US Patent App. 13/240,439, 2012 | 10 | 2012 |
| Data transmission system and method JH Cho, JJ Lee, JH Kim, B So US Patent 7,505,521, 2009 | 10 | 2009 |
