| Impact of dielectric and copper via design on wafer-to-wafer hybrid bonding V Dubey, D Wünsch, K Gottfried, M Wiemer, T Fischer, S Schermer, ... 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 795-799, 2023 | 12 | 2023 |
| Process and Design Challenges for Hybrid Bonding V Dubey, D Wünsch, K Gottfried, M Wiemer, T Fischer, A Hanisch, ... Ecs Transactions 112 (3), 73, 2023 | 7 | 2023 |
| Intra-level mix and match lithography with electron beam lithography and i-line stepper combined with resolution enhancement for structures below the CD-limit C Helke, CH Canpolat-Schmidt, G Heldt, S Schermer, S Hartmann, ... Micro and Nano Engineering 19, 100189, 2023 | 3 | 2023 |
| Development of an e-beam/i-line stepper intra-level mix and match approach with the photoresist mr-EBL 6000.5 for PIC related structures such as waveguides, ring resonators and … M Reinhardt, C Helke, S Schermer, S Hartmann, A Voigt, D Reuter 38th European Mask and Lithography Conference (EMLC 2023) 12802, 142-149, 2023 | 2 | 2023 |
| 2.5 D-patterning via i-line grayscale exposure for photonic structures and micro lens arrays S Schermer, C Helke, B Sake, A Zanzal, P Reynolds, S DeMoor, A Voigt, ... Novel Patterning Technologies 2024 12956, 147-152, 2024 | 1 | 2024 |
| Aluminum-nitride-based modular photonic integrated circuit technology and characterization platform (PIC-TCP) F Tank, J Wecker, C Stöckel, C Helke, S Schermer, A Shaporin, K Hiller, ... Integrated Optics: Devices, Materials, and Technologies XXVIII 12889, 51-56, 2024 | 1 | 2024 |
| High-resolution projection lithography for MEMS-applications using thick photoresist AZ 10XT S Schermer, C Helke, D Song, D Reuter, H Kuhn 2022 Smart Systems Integration (SSI), 1-5, 2022 | 1 | 2022 |
| Scalable fabrication approach and fill factor optimization for single pixel microlens arrays J Bonitz, C Helke, N Dittmar, S Schermer, M Haase, L Hofmann, D Reuter Journal of Vacuum Science & Technology B 42 (6), 2024 | | 2024 |
| Characterization of negative tone photoresist mr-EBL 6000.5 for i-line stepper and electron beam lithography for the Intra-Level Mix & Match Approach S Schermer, C Helke, M Reinhardt, S Hartmann, F Tank, J Wecker, ... Micro and Nano Engineering, 100264, 2024 | | 2024 |
| Advancing Fine Pitch (< 5μm) Interconnects through Self-Aligned Die-to-Wafer Hybrid Bonding for Chiplet Integration V Dubey, D Wünsch, K Gottfried, R Kinner, R Suroshe, M Küchler, ... 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC), 469-473, 2023 | | 2023 |
| Modelling and process development of ceramic heat transfer layers for ignition of integrated reactive multilayer systems K Vogel, S Schermer, C Helke, S Zimmermann, D Reuter MikroSystemTechnik Kongress 2023; Kongress, 441-444, 2023 | | 2023 |
| Micro and Nano Engineering C Helke, CH Canpolat-Schmidt, G Heldt, S Schermer, S Hartmann, ... | | |
