| PCA and ICA based prognostic health monitoring of electronic assemblies subjected to simultaneous temperature-vibration loads P Lall, T Thomas International Electronic Packaging Technical Conference and Exhibition 58097 …, 2017 | 25 | 2017 |
| Prognostication of Damage in Automotive Underhood Electronics Subjected to Temperature and Vibration P Lall, T Thomas, J Suhling 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 1330-1341, 2018 | 13 | 2018 |
| Feature Extraction and RUL Prediction of SAC Solder Alloy Packages by Different Statistical and Time-frequency Analysis Techniques under Simultaneous Temperature-Vibration Loads P Lall, T Thomas, J Suhling 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2018 | 13 | 2018 |
| 𝜷-hydroxybutyric acid attenuates oxidative stress and improves markers of mitochondrial function in the HT-22 hippocampal cell line M Majrashi, M Altukri, S Ramesh, M Govindarajulu, J Schwartz, ... Journal of Integrative Neuroscience 20 (2), 321-329, 2021 | 11 | 2021 |
| Assessment of damage progression in automotive electronics assemblies subjected to temperature and vibration P Lall, T Thomas International Electronic Packaging Technical Conference and Exhibition 51920 …, 2018 | 9 | 2018 |
| COVID-19 induced renal injury differs from that in other viral-infections RS Parise, M Govindarajulu, S Ramesh, T Thomas, T Moore, ... Emergency and Critical Care Medicine 2 (1), 23-31, 2022 | 5 | 2022 |
| Prognostic and RUL Estimations of SAC105, SAC305, and SnPb Solders under Different Drop and Shock Loads using Long Short-Term Memory (LSTM) Deep Learning Technique P Lall, T Thomas, K Blecker 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2021 | 5 | 2021 |
| Health Monitoring and Feature Vector Identification of Failure for SAC305 Solder PCB’s under Shock Loads up to 10,000 g P Lall, T Thomas, K Blecker 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020 | 5 | 2020 |
| Correlation of accelerated tests with human body measurements for flexible electronics in wearable applications P Lall, T Thomas, J Narangaparambil, K Goyal, H Jang, V Yadav, W Liu 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020 | 5 | 2020 |
| Health monitoring of PCB’s under mechanical shock loads P Lall, T Thomas, J Suhling, K Blecker International Electronic Packaging Technical Conference and Exhibition 59322 …, 2019 | 5 | 2019 |
| Prognostics and RUL Estimations of SAC305, SAC105 and SnAg Solders Under Temperature and Vibration Using Long Short-Term Memory (LSTM) Deep Learning P Lall, T Thomas, K Blecker International Electronic Packaging Technical Conference and Exhibition 85505 …, 2021 | 4 | 2021 |
| RUL Estimations of SAC305 Solder PCB's under Different Conditions of Temperature and Vibration Loads P Lall, T Thomas, K Blecker 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2020 | 4 | 2020 |
| Sensitivity of sensor location and use conditions on the detectability of accrued damage for PHM under combined temperature vibration P Lall, T Thomas 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2019 | 4 | 2019 |
| Prognostication of accrued damage and impending failure under temperature-vibration in leadfree electronics P Lall, T Thomas, J Suhling, K Blecker 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 505-514, 2019 | 4 | 2019 |
| Feature Vector Identification and Prognostics of SAC305 PCBs for Varying G-Levels of Drop and Shock Loads P Lall, T Thomas, K Blecker 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2021 | 3 | 2021 |
| Principal component analysis and independent component analysis-based prognostic health monitoring of electronic assemblies subjected to simultaneous temperature-vibration loads P Lall, T Thomas Journal of Electronic Packaging 143 (1), 011011, 2021 | 3 | 2021 |
| Remaining Useful Life Estimation and Prognostication of SAC305 Printed Circuit Boards for Dynamic Conditions of Temperature and Vibration Loads P Lall, T Thomas, K Blecker Journal of Electronic Packaging 144 (2), 021111, 2022 | 1 | 2022 |
| Deep Learning Neural Network Approach for Correlation between Print Parameters and Realized Electrical Performance and Geometry on Ink-Jet Platform P Lall, T Thomas, K Goyal, S Miller 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical …, 2022 | 1 | 2022 |
| Remaining Useful Life Estimation using a combined Physics of Failure and Deep Learning-based approach on SAC305 Solder PCBs subjected to Thermo-Mechanical Vibration Loads P Lall, T Thomas, J Suhling, K Blecker 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical …, 2022 | 1 | 2022 |
| Acceleration Factors for Flexible Electronics in Wearable Applications From Actual Human Body Measurements P Lall, T Thomas, V Yadav, J Narangaparambil, W Liu International Electronic Packaging Technical Conference and Exhibition 59322 …, 2019 | 1 | 2019 |
Pradeep LallAuburn University在 auburn.edu 的电子邮件经过验证
Pradeep LallAuburn University在 auburn.edu 的电子邮件经过验证
Jeffrey C. SuhlingAuburn University, Department of Mechanical Engineering在 auburn.edu 的电子邮件经过验证