关注
Namo Vijayakumar
Namo Vijayakumar
在 auburn.edu 的电子邮件经过验证
标题
引用次数
引用次数
年份
The effect of iso-thermal aging on vibrational performance of SAC 105 and 305 alloys
N Vijayakumar, S Thirugnanasambandam, P Soobramaney, J Zhang, ...
2013 IEEE International Symposium on Advanced Packaging Materials, 69-81, 2013
142013
Drop Reliability test on different dimensional Lead-free Wafer level Chip Scale packages
S Thirugnanasambandam, N Vijayakumar, J Zhang, J Evans, F Xie, ...
SMTA International, 2012
92012
The Effects of Thermal Aging on the Mechanical Behavior of Fine Pitch Electronics Packages
NP Vijayakumar
Auburn University, 2013
42013
Impact of Component Termination on Conductive Adhesive Reliability for Harsh Environment Electronics
JL Evans, F Xie, H Pai, N Vijayakumar, J Cobb, D Skamser, A Hill, S Harry
系统目前无法执行此操作,请稍后再试。
文章 1–4