关注
Oleh FESIIENKO
Oleh FESIIENKO
在 usherbrooke.ca 的电子邮件经过验证
标题
引用次数
引用次数
年份
Plasma induced damage on AlGaN/GaN heterostructure during gate opening for power devices
O Fesiienko, C Petit-Etienne, M Darnon, A Soltani, H Maher, E Pargon
Journal of Vacuum Science & Technology A 41 (3), 2023
42023
Enhancing minority carrier lifetime in Ge: Insights from HF and HCl cleaning procedures
A Chapotot, J Chrétien, O Fesiienko, E Pargon, J Cho, K Dessein, ...
Journal of Vacuum Science & Technology A 42 (1), 2024
2024
Procédés de gravure à faible endommagement des surfaces: application à la gravure SiN sur AlGaN/GaN pour les transistors à haute mobilité électronique| Theses. fr
O Fesiienko
Université Grenoble Alpes, 2023
2023
Low-damage surface etching processes: application to SiN etching on AlGaN/GaN for high electron mobility transistors
O Fesiienko
Université de Sherbrooke (Québec, Canada); Université Grenoble Alpes, 2023
2023
Development of low-damage plasma etching processes for preserving AlGaN/GaN heterostructure integrity in MIS HEMT
O Fesiienko, C Petit-Etienne, M Darnon, A Soltani, H Maher, E Pargon
2022 Compound Semiconductor Week (CSW), 1-2, 2022
2022
Development of low-damage plasma process using remote plasma source for the gate opening step in the AlGaN/GaN MOS HEMT integration
O Fesiienko, C Petit-Etienne, M Darnon, A Soltani, H Maher, E Pargon
Plasma Etch and Strip in Microtechnologies, 2022
2022
Comparative Study of Low Damage Plasma Etching Processes on the Integrity of AlGaN Layers Integrated in GaN HEMT During Gate Opening
O Fesiienko, C Petit-Etienne, M Darnon, A Soltani, H Maher, E Pargon
AVS 67 Virtual Symposium, 2021
2021
Impact of plasma etching process exposure on the integrity of AlN and AlGaN layers integrated in GaN heterojunction transistors (HEMTs)
E Pargon, H Maher, C Petit-Etienne, A Soltani, M Darnon
Journées nationales sur les technologies émergentes en micro-nano …, 2019
2019
Неорганічний матеріал медичного призначення на основі модифікованого нанопористого кремнію
ОО Фесієнко
2018
系统目前无法执行此操作,请稍后再试。
文章 1–9