| Temperature prediction of rolling tires by computer simulation YJ Lin, SJ Hwang Mathematics and Computers in Simulation 67 (3), 235-249, 2004 | 192 | 2004 |
| Experimental investigation of infrared rapid surface heating for injection molding PC Chang, SJ Hwang Journal of Applied Polymer Science 102 (4), 3704-3713, 2006 | 141 | 2006 |
| Simulation of infrared rapid surface heating for injection molding PC Chang, SJ Hwang International Journal of Heat and Mass Transfer 49 (21-22), 3846-3854, 2006 | 110 | 2006 |
| The influence of Cr-based coating on the adhesion force between epoxy molding compounds and IC encapsulation mold SM Chiu, SJ Hwang, CW Chu, D Gan Thin Solid Films 515 (1), 285-292, 2006 | 79 | 2006 |
| Three-dimensional modeling of mold filling in microelectronics encapsulation process RY Chang, WH Yang, SJ Hwang, F Su IEEE Transactions on Components and Packaging Technologies 27 (1), 200-209, 2004 | 76 | 2004 |
| Warpage prediction and experiments of fan-out waferlevel package during encapsulation process SS Deng, SJ Hwang, HH Lee IEEE Transactions on Components, Packaging and Manufacturing Technology 3 (3 …, 2013 | 73 | 2013 |
| Process optimization for directed energy deposition of SS316L components PY Lin, FC Shen, KT Wu, SJ Hwang, HH Lee The International Journal of Advanced Manufacturing Technology 111, 1387-1400, 2020 | 59 | 2020 |
| Enhanced hydrogen storage properties of MgH2 co-catalyzed with zirconium oxide and single-walled carbon nanotubes SJ Hwang, YS Chuang Journal of Alloys and Compounds 664, 284-290, 2016 | 50 | 2016 |
| PVTC equation for epoxy molding compound SJ Hwang, YS Chang IEEE Transactions on components and packaging technologies 29 (1), 112-117, 2006 | 49 | 2006 |
| Method and apparatus for rapid prototyping using computer-printer aided to object realization WH Lai, CI Cheng, SY Lee, MR Wang, CS Wang, CY Chen, CL Chen, ... US Patent App. 11/093,078, 2005 | 46 | 2005 |
| Study of warpage due to PVTC relation of EMC in IC packaging LC Hong, SJ Hwang IEEE Transactions on Components and Packaging Technologies 27 (2), 291-295, 2004 | 44 | 2004 |
| Development of an external-type microinjection molding module for thermoplastic polymer PC Chang, SJ Hwang, HH Lee, DY Huang Journal of Materials Processing Technology 184 (1-3), 163-172, 2007 | 43 | 2007 |
| Modeling a working coil coupled with magnetic flux concentrators for barrel induction heating in an injection molding machine HT Bui, SJ Hwang International Journal of Heat and Mass Transfer 86, 16-30, 2015 | 41 | 2015 |
| Study of PVTC relation of EMC YS Chang, SJ Hwang, HH Lee, DY Huang J. Electron. Packag. 124 (4), 371-373, 2002 | 35 | 2002 |
| Synthesis and hydrogen absorption/desorption properties of Mg–Nb2O5-SWCNT/MWCNT nanocomposite prepared by reactive milling YS Chuang, SJ Hwang Journal of Alloys and Compounds 656, 835-842, 2016 | 30 | 2016 |
| On a porous medium combustor for hydrogen flame stabilization and operation SS Su, SJ Hwang, WH Lai International journal of hydrogen energy 39 (36), 21307-21316, 2014 | 30 | 2014 |
| Simulations and experiments of three-dimensional paddle shift for IC packaging SY Teng, SJ Hwang Microelectronic Engineering 85 (1), 115-125, 2008 | 30 | 2008 |
| Temperature prediction for system in package assembly during the reflow soldering process SS Deng, SJ Hwang, HH Lee International Journal of Heat and Mass Transfer 98, 1-9, 2016 | 27 | 2016 |
| Modeling of viscoelastic behavior of an epoxy molding compound during and after curing YJ Lin, SJ Hwang, HH Lee, DY Huang IEEE Transactions on Components, Packaging and Manufacturing Technology 1 …, 2011 | 27 | 2011 |
| Isobaric cure shrinkage behaviors of epoxy molding compound in isothermal state SJ Hwang, YS Chang Journal of Polymer Science Part B: Polymer Physics 43 (17), 2392-2398, 2005 | 27 | 2005 |
