| A soft and transparent contact lens for the wireless quantitative monitoring of intraocular pressure J Kim, J Park, YG Park, E Cha, M Ku, HS An, KP Lee, MI Huh, J Kim, ... Nature biomedical engineering 5 (7), 772-782, 2021 | 127 | 2021 |
| Geometrically engineered rigid island array for stretchable electronics capable of withstanding various deformation modes JC Yang, S Lee, BS Ma, J Kim, M Song, SY Kim, DW Kim, TS Kim, S Park Science Advances 8 (22), eabn3863, 2022 | 58 | 2022 |
| Multi-directionally wrinkle-able textile OLEDs for clothing-type displays S Choi, W Jo, Y Jeon, S Kwon, JH Kwon, YH Son, J Kim, JH Park, H Kim, ... Npj flexible electronics 4 (1), 33, 2020 | 42 | 2020 |
| A modulus-engineered multi-layer polymer film with mechanical robustness for the application to highly deformable substrate platform in stretchable electronics Y Kim, J Kim, CY Kim, T Kim, C Lee, K Jeong, W Jo, S Yoo, TS Kim, ... Chemical Engineering Journal 431, 134074, 2022 | 16 | 2022 |
| Evaluating mechanical properties of 100nm-thick atomic layer deposited Al2O3 as a free-standing film J Koo, S Lee, J Kim, DH Kim, BH Choi, TS Kim, JH Shim Scripta Materialia 187, 256-261, 2020 | 13 | 2020 |
| Electronic packaging enhancement engineered by reducing the bonding temperature via modified cure cycles SY Park, SY On, J Kim, J Lee, TS Kim, BL Wardle, SS Kim ACS Applied Materials & Interfaces 15 (8), 11024-11032, 2023 | 5 | 2023 |
| Enhancing predictability of thermal warpage by applying temperature-dependent Poisson's ratio of epoxy molding compound J Kim, M Song, CY Gu, S Ma, JH Lee, WS Lee, TS Kim Polymer Testing 125, 108140, 2023 | 3 | 2023 |
| Dual-Functional Self-Attachable and Stretchable Interface for Universal Three-Dimensional Modular Electronics JY Oh, CS Hwang, YS Yang, M Song, J Kim, TS Kim, S Kim, H Oh, ... ACS Applied Materials & Interfaces 14 (43), 49303-49312, 2022 | 3 | 2022 |
| Reducing Bonding Temperature and Energy Consumption in Electronic Packaging Using Flash Electro-Thermal Carbon Fiber Heating Elements SY Park, SY On, J Kim, J Lee, TS Kim, BL Wardle, SS Kim ACS Applied Materials & Interfaces 15 (32), 38750-38758, 2023 | 2 | 2023 |
| Thermal Warpage Behavior of Single-Side Polished Silicon Wafers J Kim, CY Gu, TS Kim Journal of the Microelectronics and Packaging Society 27 (3), 89-93, 2020 | 2 | 2020 |
| Effects of the materials properties of epoxy molding films (EMFs) on fan-out packages (FOPs) characteristics S Shin, H Lee, JM Kim, TI Lee, TS Kim, Y Kyung, M Jeong, K Lee, ... 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 1146-1151, 2019 | 2 | 2019 |
| Effects of High-Temperature Exposure on the Thermo-Mechanical Behavior of Epoxy Molding Compound and Warpage of Molded Wafers J Kim, M Song, CY Gu, MS Ju, SW Ma, JH Lee, WS Lee, TS Kim 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 1231-1236, 2023 | | 2023 |
| 열응력에 의한 실리콘 인터포저 위 금속 패드의 박락 현상 김준모， 김보연， 정청하， 김구성， 김택수 마이크로전자 및 패키징학회지 29 (3), 25-29, 2022 | | 2022 |
| 경화 조건에 따른 EMC 의 열, 기계적 물성 변화 김준모， 송명， 구창연， 마성우， 이웅선， 이진희， 김택수 대한기계학회 춘추학술대회, 77-77, 2022 | | 2022 |
| Warpage prediction of chip package using simplified model of PCB substrate J Kim 한국과학기술원, 2019 | | 2019 |
| 칩 패키지의 휨 해석을 위한 유리 섬유 강화 플라스틱 기판의 3 층 구조 모델링 김준모， 조우성， 이태익， 김택수 한국마이크로전자 및 패키징 학회 2019 년도 춘계 정기학술대회, 2019 | | 2019 |
| Warpage Analysis of Chip Package using Tri-layer Modeling of Glass Fiber-Reinforced Polymers 김준모， 이태익， 조우성， 조민수， 김택수 MPC2018 Fall Conference, 2018 | | 2018 |
Taek-Soo KimProfessor of Mechanical Engineering, KAIST在 kaist.ac.kr 的电子邮件经过验证
Taek-Soo KimProfessor of Mechanical Engineering, KAIST在 kaist.ac.kr 的电子邮件经过验证