| Reliability of lead-free interconnections under consecutive thermal and mechanical loadings TT Mattila, JK Kivilahti Journal of Electronic Materials 35, 250-256, 2006 | 114 | 2006 |
| Impact of printed wiring board coatings on the reliability of lead-free chip-scale package interconnections TT Mattila, V Vuorinen, JK Kivilahti Journal of materials research 19, 3214-3223, 2004 | 108 | 2004 |
| Failure mechanisms of lead-free chip scale package interconnections under fast mechanical loading TT Mattila, JK Kivilahti Journal of electronic materials 34, 969-976, 2005 | 101 | 2005 |
| Evolution of microstructure and failure mechanism of lead-free solder interconnections in power cycling and thermal shock tests T Laurila, T Mattila, V Vuorinen, J Karppinen, J Li, M Sippola, JK Kivilahti Microelectronics Reliability 47 (7), 1135-1144, 2007 | 100 | 2007 |
| Solid-state reactions between Cu (Ni) alloys and Sn V Vuorinen, T Laurila, T Mattila, E Heikinheimo, JK Kivilahti Journal of Electronic Materials 36, 1355-1362, 2007 | 96 | 2007 |
| The role of recrystallization in the failure of SnAgCu solder interconnections under thermomechanical loading TT Mattila, JK Kivilahti IEEE Transactions on Components and Packaging Technologies 33 (3), 629-635, 2010 | 94 | 2010 |
| Reliability of CSP interconnections under mechanical shock loading conditions TT Mattila, P Marjamaki, JK Kivilahti IEEE Transactions on Components and Packaging Technologies 29 (4), 787-795, 2006 | 92 | 2006 |
| Localized recrystallization and cracking of lead-free solder interconnections under thermal cycling H Chen, M Mueller, TT Mattila, J Li, X Liu, KJ Wolter, M Paulasto-Kröckel Journal of Materials Research 26 (16), 2103-2116, 2011 | 70 | 2011 |
| Thermal cycling reliability of Sn-Ag-Cu solder interconnections—Part 2: Failure mechanisms J Hokka, TT Mattila, H Xu, M Paulasto-Kröckel Journal of electronic materials 42, 963-972, 2013 | 58 | 2013 |
| Shock impact reliability and failure analysis of a three-axis MEMS gyroscope J Li, M Broas, J Makkonen, TT Mattila, J Hokka, M Paulasto-Kröckel Journal of microelectromechanical systems 23 (2), 347-355, 2013 | 52 | 2013 |
| Clinical spectrum of bacteraemic Fusobacterium infections: from septic shock to nosocomial bacteraemia E Nohrström, T Mattila, V Pettilä, P Kuusela, P Carlson, E Kentala, ... Scandinavian journal of infectious diseases 43 (6-7), 463-470, 2011 | 51 | 2011 |
| Analysis of the redeposition of AuSn4 on Ni/Au contact pads when using SnPbAg, SnAg, and SnAgCu solders T Laurila, V Vuorinen, T Mattila, JK Kivilahti Journal of electronic materials 34, 103-111, 2005 | 47 | 2005 |
| Effects of thermal cycling parameters on lifetimes and failure mechanism of solder interconnections TT Mattila, H Xu, O Ratia, M Paulasto-Kröckel 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC …, 2010 | 43 | 2010 |
| A comparative study of the failure mechanisms encountered in drop and large amplitude vibration tests P Marjamaki, TT Mattila, JK Kivilahti 56th Electronic Components and Technology Conference 2006, 7 pp., 2006 | 42 | 2006 |
| Thermal cycling reliability of Sn-Ag-Cu solder interconnections. part 1: effects of test parameters J Hokka, TT Mattila, H Xu, M Paulasto-Kröckel Journal of electronic materials 42, 1171-1183, 2013 | 41 | 2013 |
| On the effects of temperature on the drop reliability of electronic component boards TT Mattila, J Li, JK Kivilahti Microelectronics Reliability 52 (1), 165-179, 2012 | 39 | 2012 |
| Simulation of dynamic recrystallization in solder interconnections during thermal cycling J Li, H Xu, TT Mattila, JK Kivilahti, T Laurila, M Paulasto-Kröckel Computational Materials Science 50 (2), 690-697, 2010 | 39 | 2010 |
| Shock impact reliability characterization of a handheld product in accelerated tests and use environment J Karppinen, J Li, J Pakarinen, TT Mattila, M Paulasto-Kröckel Microelectronics Reliability 52 (1), 190-198, 2012 | 36 | 2012 |
| Metallurgical factors behind the reliability of high-density lead-free interconnections TT Mattila, TT Laurila, JK Kivilahti Micro-and opto-electronic materials and structures: physics, mechanics …, 2007 | 36 | 2007 |
| Reliability of high-density lead-free solder interconnections under thermal cycling and mechanical shock loading T Mattila Helsinki University of Technology, 2005 | 32 | 2005 |
