| Photo-induced fabrication of Ag nanowire circuitry for invisible, ultrathin, conformable pressure sensors CJ Han, BG Park, MS Oh, SB Jung, JW Kim Journal of Materials Chemistry C 5 (38), 9986-9994, 2017 | 42 | 2017 |
| Mechanical, electrical, and thermal reliability of Sn-58wt.% Bi solder joints with Ag-decorated MWCNT for LED package component during aging treatment BG Park, WR Myung, CJ Lee, SB Jung Composites Part B: Engineering 182, 107617, 2020 | 30 | 2020 |
| Effect of epoxy content in Ag nanoparticle paste on the bonding strength of MLCC packages KH Jung, KD Min, CJ Lee, BG Park, H Jeong, JM Koo, B Lee, SB Jung Applied Surface Science 495, 143487, 2019 | 28 | 2019 |
| Fabrication of the hybrid Ag paste combined by Ag nanoparticle and micro Ag flake and its flexibility BG Park, KH Jung, SB Jung Journal of Alloys and Compounds 699, 1186-1191, 2017 | 27 | 2017 |
| Fabrication of Ag-MWNT nanocomposite paste for high-power LED package KS Kim, BG Park, H Kim, HS Lee, SB Jung Current Applied Physics 15, S36-S41, 2015 | 18 | 2015 |
| Fabrication of IPL-Sintered Ag-MWCNT composite circuits and their flexibility characteristics CJ Lee, BG Park, H Jeong, KH Jung, SB Jung Journal of Alloys and Compounds 794, 341-346, 2019 | 13 | 2019 |
| The critical role of Ag nanowires in the improvement of conductivity and flexibility of circuits fabricated with hybrid Ag nanopaste KS Kim, BG Park, KH Jung, SB Jung, JW Kim Journal of Materials Science: Materials in Electronics 26, 8644-8651, 2015 | 12 | 2015 |
| Characterization of Ag-Pd nanocomposite paste for electrochemical migration resistance KS Kim, KH Jung, BG Park, YE Shin, SB Jung Journal of Nanoscience and Nanotechnology 13 (11), 7620-7624, 2013 | 12 | 2013 |
| Enhancing adhesion strength of photonic sintered screen-printed Ag circuit by atmospheric pressure plasma BG Park, CJ Lee, SB Jung Microelectronic Engineering 202, 37-41, 2018 | 11 | 2018 |
| Effect of Ag-decorated MWCNT on the mechanical and thermal property of Sn58Bi solder joints for FCLED package CJ Lee, WR Myung, BG Park, SB Jung Journal of Materials Science: Materials in Electronics 31, 10170-10176, 2020 | 10 | 2020 |
| Microwave sintering of silver nanoink for radio frequency applications KS Kim, BG Park, KH Jung, JW Kim, MY Jeong, SB Jung Journal of Nanoscience and Nanotechnology 15 (3), 2333-2337, 2015 | 10 | 2015 |
| Screen-printed cu circuit for low-cost fabrication and its electrochemical migration characteristics KH Jung, KS Kim, BG Park, SB Jung Journal of Nanoscience and Nanotechnology 14 (12), 9493-9497, 2014 | 9 | 2014 |
| Fabrication and characterization of Ag flake hybrid circuits with IPL-sintering CJ Lee, KH Jung, KD Min, BG Park, SB Jung Journal of Materials Science & Technology 53, 13-18, 2020 | 7 | 2020 |
| Effects of polyvinylpyrrolidone molecular weight on adhesion strength of screen-printed Cu circuits to polyimide substrate KH Jung, BG Park, SB Jung Nanoscience and Nanotechnology Letters 7 (12), 999-1003, 2015 | 7 | 2015 |
| Fabrication of Ag circuit embedded in PDMS substrate and its mechanical and electrical property with variations of photonic energy KH Jung, J Kim, BG Park, CJ Lee, HJ Sung, SB Jung Journal of Alloys and Compounds 748, 898-904, 2018 | 5 | 2018 |
| Effect of PVP on fabrication of Cu nanoparticles using an electrical wire explosion method CJ Lee, KH Jung, BG Park, Y Kim, SB Jung Journal of Materials Science: Materials in Electronics 30, 4079-4084, 2019 | 4 | 2019 |
| Electrical and electrochemical migration characteristics of Ag/Cu nanopaste patterns M Koh, KS Kim, BG Park, KH Jung, CS Lee, YH Choa, MY Jeong, ... Journal of Nanoscience and Nanotechnology 14 (12), 8915-8919, 2014 | 4 | 2014 |
| Effect of atmospheric-pressure plasma treatment on the adhesion characteristics of screen-printed Ag nanoparticles on polyimide BG Park, KS Kim, KH Jung, SB Jung Journal of Nanoscience and Nanotechnology 14 (12), 9448-9453, 2014 | 4 | 2014 |
| Effects of Silane Coupling Agents on the Adhesion Strength of a Printed Cu Circuit on Polyimide CJ Lee, BG Park, KH Jung, Y Kim, SB Jung Science of Advanced Materials 12 (4), 594-599, 2020 | | 2020 |
| Bonding Characteristic of Nanopaste for Direct Bonding in Electronic Package Systems KS Kim, BG Park, KH Jung, SB Jung 대한용접학회 특별강연 및 학술발표대회 개요집, 78-78, 2013 | | 2013 |
seung-boo jungProfessor of Materials Science and Engineering, Sungkyunkwan University在 skku.edu 的电子邮件经过验证
