| Low-temperature Cu–Cu direct bonding using pillar–concave structure in advanced 3-D heterogeneous integration YT Yang, TC Chou, TY Yu, YW Chang, TY Huang, KM Yang, CT Ko, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 7 (9 …, 2017 | 22 | 2017 |
| An advanced 2.5-D heterogeneous integration packaging for high-density neural sensing microsystem YC Hu, YC Huang, PT Huang, SL Wu, HC Chang, YT Yang, YH You, ... IEEE Transactions on Electron Devices 64 (4), 1666-1673, 2017 | 19 | 2017 |
| Mechanism and process window study for die-to-wafer (D2W) hybrid bonding H Ren, YT Yang, G Ouyang, SS Iyer ECS Journal of Solid State Science and Technology 10 (6), 064008, 2021 | 16 | 2021 |
| Recess effect study and process optimization of sub-10 μm pitch die-to-wafer hybrid bonding H Ren, YT Yang, SS Iyer 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 149-156, 2022 | 13 | 2022 |
| Investigation of Pillar–Concave Structure for Low-Temperature Cu–Cu Direct Bonding in 3-D/2.5-D Heterogeneous Integration TC Chou, KM Yang, JC Li, TY Yu, YT Yang, HW Hu, YW Liu, CT Ko, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2020 | 10 | 2020 |
| Atomic Layer Deposited Al2O3 Encapsulation for the Silicon Interconnect Fabric NS Chase, K Sahoo, YT Yang, SS Iyer 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 1241-1246, 2020 | 10 | 2020 |
| Demonstration of superconducting interconnects on the silicon interconnect fabric using thermocompression bonding YT Yang, C Hu, J Green, P Zhang, N Shakoorzadeh, P Ambhore, ... 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 1861-1866, 2020 | 7 | 2020 |
| A Flexible Power Module for Wearable Medical Devices with Wireless Recharging using Corrugated Flexible Coils G Ouyang, G Ezhilarasu, H Sun, H Ren, YT Yang, SS Iyer 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2266-2271, 2021 | 5 | 2021 |
| Copper to gold thermal compression bonding in heterogenous wafer-scale systems K Sahoo, S Pal, N Shakoorzadeh, YT Yang, SS Iyer 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 487-493, 2021 | 5 | 2021 |
| Adhesion property of polyimide and passivation layer for polymer/metal wafer-level hybrid bonding in 3D integration CH Lu, YT Kho, YT Yang, YP Chen, CP Chen, TT Hung, CF Chen, ... 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 401-406, 2018 | 5 | 2018 |
| Nb-based superconducting silicon interconnect fabric for cryogenic electronics YT Yang, C Hu, P Zhang, N Shakoorzadeh, N Ni, KL Wang, SS Iyer Quantum Science and Technology 6 (2), 025014, 2021 | 4 | 2021 |
| High transmittance broadband THz polarizer using 3D-IC technologies NC Chi, TY Yu, HC Tsai, SY Wang, CW Luo, YT Yang, KN Chen 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 1793-1798, 2017 | 4 | 2017 |
| Split-Fabric: A Novel Wafer-Scale Hardware Obfuscation Methodology using Silicon Interconnect Fabric Y Safari, YT Yang, SS Iyer, T Nakatani, N Levine, B Vaisband 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 660-667, 2022 | 3 | 2022 |
| Study on low temperature Cu bonding and temporary bond/de-bond for RDL-first fan-out panel level package CT Ko, KM Yang, JW Lin, CL Wang, TC Chou, YT Yang, TY Yu, YH Chen, ... 2017 5th International Workshop on Low Temperature Bonding for 3D …, 2017 | 3 | 2017 |
| An advanced 3D/2.5 D integration packaging approach using double-self-assembly method with complex topography, and micropin-fin heat sink interposer for pressure sensing system YC Hu, CP Lin, HC Chang, YT Yang, CS Chen, KN Chen 2016 IEEE International Electron Devices Meeting (IEDM), 9.2. 1-9.2. 4, 2016 | 3 | 2016 |
| A study on warpage and reflow profile for extreme extension of mass reflow bonding J Shin, K Woo, D Kwon, Y Kim, Y Lee, D Kang, K Sahoo, H Ren, ... 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 1158-1162, 2022 | 2 | 2022 |
| Nb-Based Superconducting Silicon Interconnect Fabric for Cryogenic Computing Applications YT Yang, C Hu, P Zhang, N Shakoorzadeh, H Ren, N Ni, KL Wang, ... 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 1577-1582, 2021 | 2 | 2021 |
| Breakthrough in Cu to Cu Pillar-Concave Bonding on Silicon Substrate with Polymer Layer for Advanced Packaging, 3D, and Heterogeneous Integration YT Yang, TY Yu, SC Kuo, TY Huang, KM Yang, CT Ko, YH Chen, ... 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 637-642, 2017 | 2 | 2017 |
| A Novel Low-Warpage Hyper RDL (HRDL) Interposer Enabled by Low Temperature Hybrid Bonding for Advanced Packaging Applications YC Huang, YX Lin, CK Hsiung, YT Yang, TH Hung, KN Chen IEEE Electron Device Letters, 2024 | 1 | 2024 |
| TSV-less Power Delivery for Wafer-scale Assemblies and Interposers H Ren, S Pal, G Ouyang, R Irwin, YT Yang, SS Iyer 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 1934-1939, 2022 | 1 | 2022 |
