Buoyancy-induced flows and transport B Gebhart CRC Press, 1988 | 1913 | 1988 |
Thermal challenges in next-generation electronic systems SV Garimella, AS Fleischer, JY Murthy, A Keshavarzi, R Prasher, C Patel, ... IEEE Transactions on Components and Packaging Technologies 31 (4), 801-815, 2008 | 514 | 2008 |
Bending fatigue study of sputtered ITO on flexible substrate K Alzoubi, MM Hamasha, S Lu, B Sammakia Journal of Display Technology 7 (11), 593-600, 2011 | 243 | 2011 |
Pluggable electronic circuit package assembly with snap together heat sink housing J Funari, TC Godown, SD Reynolds, BG Sammakia US Patent 5,109,318, 1992 | 163 | 1992 |
Electronic package with heat spreader member M Anschel, BG Sammakia US Patent 4,914,551, 1990 | 148 | 1990 |
A review of recent developments in some practical aspects of air-cooled electronic packages S Sathe, B Sammakia | 141 | 1998 |
Comparative analysis of different data center airflow management configurations S Shrivastava, B Sammakia, R Schmidt, M Iyengar International Electronic Packaging Technical Conference and Exhibition 42002 …, 2005 | 123 | 2005 |
A brief overview of recent developments in thermal management in data centers S Alkharabsheh, J Fernandes, B Gebrehiwot, D Agonafer, K Ghose, ... Journal of Electronic Packaging 137 (4), 040801, 2015 | 121 | 2015 |
Experimental-numerical comparison for a high-density data center: Hot spot heat fluxes in excess of 500 W/ft2 SK Shrivastava, BG Sammakia, R Schmidt, M Iyengar, JW VanGilder Thermal and Thermomechanical Proceedings 10th Intersociety Conference on …, 2006 | 109 | 2006 |
Optimization of data center room layout to minimize rack inlet air temperature S Bhopte, D Agonafer, R Schmidt, B Sammakia | 102 | 2006 |
Thermal challenges in next generation electronic systems-summary of panel presentations and discussions SV Garimella, YK Joshi, A Bar-Cohen, R Mahajan, KC Toh, VP Carey, ... IEEE Transactions on Components and Packaging Technologies 25 (4), 569-575, 2002 | 102 | 2002 |
Method and apparatus for testing of integrated circuit chips M Anschel, AP Ingraham, CR Lamb, MD Lowell, VR Markovich, W Mayr, ... US Patent 5,420,520, 1995 | 101 | 1995 |
Electronic package having active means to maintain its operating temperature constant LSW Mok, S Purushothaman, BG Sammakia, JS Wilczynski, TY Wu US Patent 5,491,610, 1996 | 94 | 1996 |
A review of recent advances in thermal management in three dimensional chip stacks in electronic systems V Venkatadri, B Sammakia, K Srihari, D Santos | 91 | 2011 |
Electronic package with improved heat sink J Funari, MC Green, SD Reynolds, BG Sammakia US Patent 4,849,856, 1989 | 91 | 1989 |
Flexible chemiresistor sensors: Thin film assemblies of nanoparticles on a polyethylene terephthalate substrate L Wang, J Luo, J Yin, H Zhang, J Wu, X Shi, E Crew, Z Xu, Q Rendeng, ... Journal of Materials Chemistry 20 (5), 907-915, 2010 | 81 | 2010 |
Estimating thermal conductivity of amorphous silica nanoparticles and nanowires using molecular dynamics simulations SS Mahajan, G Subbarayan, BG Sammakia Physical Review E—Statistical, Nonlinear, and Soft Matter Physics 76 (5 …, 2007 | 81 | 2007 |
An efficient network model for determining the effective thermal conductivity of particulate thermal interface materials S Kanuparthi, G Subbarayan, T Siegmund, B Sammakia IEEE Transactions on Components and Packaging Technologies 31 (3), 611-621, 2008 | 67 | 2008 |
Predictive model for optimized design parameters in flip-chip packages and assemblies S Park, HC Lee, B Sammakia, K Raghunathan IEEE Transactions on Components and Packaging Technologies 30 (2), 294-301, 2007 | 67 | 2007 |
Three-objective shape optimization and parametric study of a micro-channel heat sink with discrete non-uniform heat flux boundary conditions Y Hadad, B Ramakrishnan, R Pejman, S Rangarajan, PR Chiarot, ... Applied Thermal Engineering 150, 720-737, 2019 | 65 | 2019 |