| Recent progress on the development of Sn–Bi based low-temperature Pb-free solders F Wang, H Chen, Y Huang, L Liu, Z Zhang Journal of Materials Science: Materials in Electronics 30, 3222-3243, 2019 | 161 | 2019 |
| Development of Cu–Sn intermetallic compound at Pb-free solder/Cu joint interface X Ma, F Wang, Y Qian, F Yoshida Materials Letters 57 (22-23), 3361-3365, 2003 | 148 | 2003 |
| Improvement of microstructure and interface structure of eutectic Sn–0.7 Cu solder with small amount of Zn addition F Wang, X Ma, Y Qian Scripta materialia 53 (6), 699-702, 2005 | 117 | 2005 |
| Intermetallic compound formation at Sn–3.0 Ag–0.5 Cu–1.0 Zn lead-free solder alloy/Cu interface during as-soldered and as-aged conditions FJ Wang, ZS Yu, K Qi Journal of Alloys and Compounds 438 (1-2), 110-115, 2007 | 75 | 2007 |
| Interfacial reaction and mechanical properties of Sn-Bi solder joints F Wang, Y Huang, Z Zhang, C Yan Materials 10 (8), 920, 2017 | 72 | 2017 |
| Depressing effect of 0.2 wt.% Zn addition into Sn-3.0 Ag-0.5 Cu solder alloy on the intermetallic growth with Cu substrate during isothermal aging FJ Wang, F Gao, X Ma, YY Qian Journal of electronic materials 35, 1818-1824, 2006 | 66 | 2006 |
| Microstructural evolution and joint strength of Sn-58Bi/Cu joints through minor Zn alloying substrate during isothermal aging F Wang, L Zhou, X Wang, P He Journal of Alloys and compounds 688, 639-648, 2016 | 60 | 2016 |
| Microstructural evolution and tensile properties of Sn–Ag–Cu mixed with Sn–Pb solder alloys F Wang, M O’Keefe, B Brinkmeyer Journal of Alloys and Compounds 477 (1-2), 267-273, 2009 | 55 | 2009 |
| Reactive wetting of Sn0. 7Cu–xZn lead-free solders on Cu substrate H Wang, F Wang, F Gao, X Ma, Y Qian Journal of alloys and compounds 433 (1-2), 302-305, 2007 | 55 | 2007 |
| Development of lead-free interconnection materials in electronic industry during the past decades: Structure and properties S Zhong, L Zhang, M Li, W Long, F Wang Materials & Design 215, 110439, 2022 | 41 | 2022 |
| Interfacial behaviors of Sn-Pb, Sn-Ag-Cu Pb-free and mixed Sn-Ag-Cu/Sn-Pb solder joints during electromigration F Wang, D Li, S Tian, Z Zhang, J Wang, C Yan Microelectronics Reliability 73, 106-115, 2017 | 41 | 2017 |
| Electromigration behaviors in Sn–58Bi solder joints under different current densities and temperatures F Wang, L Liu, D Li, M Wu Journal of Materials Science: Materials in Electronics 29, 21157-21169, 2018 | 38 | 2018 |
| Mechanical properties of SnBi-SnAgCu composition mixed solder joints using bending test F Wang, Y Huang, C Du Materials Science and Engineering: A 668, 224-233, 2016 | 37 | 2016 |
| Interfacial behavior and joint strength of Sn–Bi solder with solid solution compositions F Wang, H Chen, Y Huang, C Yan Journal of Materials Science: Materials in Electronics 29, 11409-11420, 2018 | 31 | 2018 |
| Effects of Zn, Zn-Al and Zn-P additions on the tensile properties of Sn-Bi solder X Wang, Y Wang, F Wang, N Liu, J Wang Acta Metallurgica Sinica (English Letters) 27, 1159-1164, 2014 | 25 | 2014 |
| Microstructures, interface reaction, and properties of Sn–Ag–Cu and Sn–Ag–Cu–0.5 CuZnAl solders on Fe substrate L Zhang, W Long, F Wang Journal of Materials Science: Materials in Electronics 31, 6645-6653, 2020 | 23 | 2020 |
| Effect of indium addition on interfacial IMC growth and bending properties of eutectic Sn–0.7 Cu solder joints S Tian, S Li, J Zhou, F Xue, R Cao, F Wang Journal of Materials Science: Materials in Electronics 28, 16120-16132, 2017 | 23 | 2017 |
| Effect of Sn-Ag-Cu on the improvement of electromigration behavior in Sn-58Bi solder joint F Wang, L Zhou, Z Zhang, J Wang, X Wang, M Wu Journal of Electronic Materials 46, 6204-6213, 2017 | 23 | 2017 |
| Effect of doping Al on the liquid oxidation of Sn–Bi–Zn solder XJ Wang, QS Zhu, B Liu, N Liu, FJ Wang Journal of Materials Science: Materials in Electronics 25, 2297-2304, 2014 | 23 | 2014 |
| Improvement on interfacial structure and properties of Sn–58Bi/Cu joint using Sn–3.0 Ag–0.5 Cu solder as barrier F Wang, D Li, Z Zhang, M Wu, C Yan Journal of Materials Science: Materials in Electronics 28, 19051-19060, 2017 | 21 | 2017 |
