| Estimating radio-frequency interference to an antenna due to near-field coupling using decomposition method based on reciprocity H Wang, V Khilkevich, YJ Zhang, J Fan IEEE Transactions on Electromagnetic Compatibility 55 (6), 1125-1131, 2013 | 94 | 2013 |
| Radio-frequency interference estimation using equivalent dipole-moment models and decomposition method based on reciprocity J Pan, H Wang, X Gao, C Hwang, E Song, HB Park, J Fan IEEE Transactions on Electromagnetic Compatibility 58 (1), 75-84, 2015 | 87 | 2015 |
| Improved target impedance and IC transient current measurement for power distribution network design J Kim, S Wu, H Wang, Y Takita, H Takeuchi, K Araki, G Feng, J Fan 2010 IEEE International Symposium on Electromagnetic Compatibility, 445-450, 2010 | 72 | 2010 |
| Closed-form expressions for the maximum transient noise voltage caused by an IC switching current on a power distribution network J Kim, L Li, S Wu, H Wang, Y Takita, H Takeuchi, K Araki, J Fan, ... IEEE Transactions on Electromagnetic Compatibility 54 (5), 1112-1124, 2012 | 51 | 2012 |
| The effects of substrate doping density on the electrical performance of through-silicon vias H Wang, J Kim, Y Shi, J Fan Proc. of Asia-Pacific EMC Symposium, Jeju Island, Korea, 2011 | 27 | 2011 |
| Capacitive sensing array having electrical isolation Z Yang, H Wang US Patent 10,296,773, 2019 | 23 | 2019 |
| Modeling local via structures using innovative PEEC formulation based on cavity Green's functions with wave port excitation H Wang, J Fan IEEE transactions on microwave theory and techniques 61 (5), 1748-1757, 2013 | 20 | 2013 |
| Investigation of mixed-mode input impedance of multi-layer differential vias for impedance matching with traces H Wang, W Cheng, J Zhang, J Fisher, L Zhu, JL Drewniak, J Fan 2009 IEEE International Symposium on Electromagnetic Compatibility, 203-207, 2009 | 15 | 2009 |
| Applying feature selective validation (FSV) as an objective function for data optimization S Pan, H Wang, J Fan 2010 IEEE International Symposium on Electromagnetic Compatibility, 718-721, 2010 | 13 | 2010 |
| Stub length prediction for back-drilled vias using a fast via tool J Zhang, QB Chen, H Wang, J Fan, A Orlandi, JL Drewniak 2010 IEEE Electrical Design of Advanced Package & Systems Symposium, 1-4, 2010 | 12 | 2010 |
| Capacitance calculation for a shared-antipad via structure using an integral equation method based on partial capacitance H Wang, AE Ruehli, J Fan 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging …, 2011 | 11 | 2011 |
| Capacitance calculation for via structures using an integral equation method based on partial capacitance H Wang, S Pan, J Kim, AE Ruehli, J Fan IEEE Transactions on Components, Packaging and Manufacturing Technology 3 …, 2013 | 10 | 2013 |
| Topology-based accurate modeling of current-mode voltage regulator modules for power distribution network design J Sun, Y Yan, H Wang, E Chen, K Wu, J Fan IEEE Transactions on Electromagnetic Compatibility 64 (2), 524-535, 2021 | 9 | 2021 |
| Analysis of via impedance variations with a polynomial chaos method J Shen, H Wang, J Chen, J Fan 2011 IEEE International Symposium on Electromagnetic Compatibility, 899-904, 2011 | 9 | 2011 |
| Measurement of multiple switching current components through a bulk decoupling capacitor using a lab-made low-cost current probe L Li, J Kim, H Wang, S Wu, Y Takita, H Takeuchi, K Araki, J Fan 2011 IEEE International Symposium on Electromagnetic Compatibility, 417-421, 2011 | 9 | 2011 |
| RFI estimation for multiple noise sources due to modulation at a digital mic using diople moment based reciprocity S Xia, J Sun, Q Huang, Y Wang, H Wang, K Wu, S Wu, J Fan 2020 IEEE International Symposium on Electromagnetic Compatibility & Signal …, 2020 | 8 | 2020 |
| Practical fixture design for passive intermodulation tests for flexible metallic contacts S Xia, Y He, Y Wang, H Wang, G Mankaruse, D Chan, H Zhou, W Lee, ... 2022 IEEE International Symposium on Electromagnetic Compatibility & Signal …, 2022 | 7 | 2022 |
| Undesired resonances in high-speed differential pair due to non-ideal return path design Y Wang, H Wang, K Wu 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal …, 2019 | 7 | 2019 |
| Augmented genetic algorithm v2 with reinforcement learning for PDN decap optimization H Manoharan, J Juang, H Wang, J Pan, K Qiu, X Gao, C Hwang 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power …, 2023 | 6 | 2023 |
| Comparison among different via models based on feature selective validation technique S Pan, H Wang, J Fan 2009 IEEE International Symposium on Electromagnetic Compatibility, 264-267, 2009 | 6 | 2009 |
Jun FanMissouri University of Science and Technology在 mst.edu 的电子邮件经过验证
