| Wireless powered wearable micro light-emitting diodes HE Lee, D Lee, TI Lee, JH Shin, GM Choi, C Kim, SH Lee, JH Lee, ... Nano Energy 55, 454-462, 2019 | 103 | 2019 |
| Reversible self-bending soft hydrogel microstructures with mechanically optimized designs J Kim, C Kim, YS Song, SG Jeong, TS Kim, CS Lee Chemical Engineering Journal 321, 384-393, 2017 | 49 | 2017 |
| A three-dimensional metal grid mesh as a practical alternative to ITO S Jang, WB Jung, C Kim, P Won, SG Lee, KM Cho, ML Jin, CJ An, ... Nanoscale 8 (29), 14257-14263, 2016 | 48 | 2016 |
| Flash‐Induced Stretchable Cu Conductor via Multiscale‐Interfacial Couplings JH Park, J Seo, C Kim, DJ Joe, HE Lee, TH Im, JY Seok, CK Jeong, ... Advanced Science 5 (11), 1801146, 2018 | 41 | 2018 |
| A high aspect ratio serpentine structure for use as a strain‐insensitive, stretchable transparent conductor S Jang, C Kim, JJ Park, ML Jin, SJ Kim, OO Park, TS Kim, HT Jung Small 14 (8), 1702818, 2018 | 41 | 2018 |
| Control of reversible self-bending behavior in responsive janus microstrips MS Oh, YS Song, C Kim, J Kim, JB You, TS Kim, CS Lee, SG Im ACS applied materials & interfaces 8 (13), 8782-8788, 2016 | 35 | 2016 |
| Direct graphene transfer and its application to transfer printing using mechanically controlled, large area graphene/copper freestanding layer J Seo, C Kim, BS Ma, TI Lee, JH Bong, JG Oh, BJ Cho, TS Kim Advanced Functional Materials 28 (26), 1707102, 2018 | 34 | 2018 |
| Flexural and tensile moduli of flexible FR4 substrates TI Lee, C Kim, MS Kim, TS Kim Polymer Testing 53, 70-76, 2016 | 33 | 2016 |
| Warpage analysis of electroplated Cu films on fiber-reinforced polymer packaging substrates C Kim, TI Lee, MS Kim, TS Kim Polymers 7 (6), 985-1004, 2015 | 32 | 2015 |
| Prediction of time-dependent swelling of flexible polymer substrates using hygro-mechanical finite element simulations JB Pyo, TI Lee, C Kim, MS Kim, TS Kim Soft matter 12 (18), 4135-4141, 2016 | 19 | 2016 |
| Nanotransplantation printing of crystallographic-orientation-controlled single-crystalline nanowire arrays on diverse surfaces HJ Han, JW Jeong, SR Yang, C Kim, HG Yoo, JB Yoon, JH Park, KJ Lee, ... ACS nano 11 (11), 11642-11652, 2017 | 17 | 2017 |
| Mechanism of warpage orientation rotation due to viscoelastic polymer substrates during thermal processing C Kim, TI Lee, MS Kim, TS Kim Microelectronics Reliability 73, 136-145, 2017 | 15 | 2017 |
| A quantitative strain analysis of a flexible single-crystalline silicon membrane JH Bong, C Kim, WS Hwang, TS Kim, BJ Cho Applied Physics Letters 110 (3), 2017 | 14 | 2017 |
| Mechanical Stability Analysis via Neutral Mechanical Plane for High‐Performance Flexible Si Nanomembrane FDSOI Device SY Kim, JH Bong, C Kim, WS Hwang, TS Kim, BJ Cho Advanced Materials Interfaces 4 (21), 1700618, 2017 | 13 | 2017 |
| Effect of anisotropic thermo-elastic properties of woven-fabric laminates on diagonal warpage of thin package substrates TI Lee, C Kim, JB Pyo, MS Kim, TS Kim Composite Structures 176, 973-981, 2017 | 12 | 2017 |
| Packaging substrate bending prediction due to residual stress C Kim, H Choi, M Kim, TS Kim Journal of the Microelectronics and Packaging Society 20 (1), 21-26, 2013 | 12 | 2013 |
| Measurement of flexural modulus of lamination layers on flexible substrates TI Lee, C Kim, MS Kim, TS Kim Journal of the Microelectronics and Packaging Society 23 (3), 63-67, 2016 | 7 | 2016 |
| FEM simulation of warpage orientation change of FRP polymer substrate during thermal processing C Kim, TI Lee, MS Kim, TS Kim 2017 International Conference on Electronics Packaging (ICEP), 422-423, 2017 | 2 | 2017 |
| Measurement Technologies of Mechanical Properties of Polymers used for Flexible and Stretchable Electronic Packaging C Kim, TI Lee, TS Kim Journal of the Microelectronics and Packaging Society 23 (2), 19-28, 2016 | 2 | 2016 |
| Methodology development of warpage analysis of polymer based packaging substrate C Kim, T Lee, H Choi, MS Kim, TS Kim 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 1004-1009, 2014 | 2 | 2014 |
Taek-Soo KimProfessor of Mechanical Engineering, KAIST在 kaist.ac.kr 的电子邮件经过验证
