| Heterogeneous interconnect stitching technology with compressible microinterconnects for dense multi-die integration X Zhang, PK Jo, M Zia, GS May, MS Bakir IEEE Electron Device Letters 38 (2), 255-257, 2016 | 23 | 2016 |
| Design, fabrication, and characterization of dense compressible microinterconnects PK Jo, M Zia, JL Gonzalez, H Oh, MS Bakir IEEE Transactions on Components, Packaging and Manufacturing Technology 7 (7 …, 2017 | 17 | 2017 |
| Thermal isolation using air gap and mechanically flexible interconnects for heterogeneous 3-D ICs Y Zhang, Y Zhang, T Sarvey, C Zhang, M Zia, M Bakir IEEE Transactions on Components, Packaging and Manufacturing Technology 6 (1 …, 2015 | 15 | 2015 |
| Myomatrix arrays for high-definition muscle recording B Chung, M Zia, KA Thomas, JA Michaels, A Jacob, A Pack, MJ Williams, ... Elife 12, RP88551, 2023 | 14 | 2023 |
| Flexible Multielectrode Arrays With 2-D and 3-D Contacts for Electromyography Recording M Zia, B Chung, S Sober, MS Bakir IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2020 | 13 | 2020 |
| Fabrication and characterization of 3D multi-electrode array on flexible substrate for in vivo EMG recording from expiratory muscle of songbird M Zia, B Chung, SJ Sober, MS Bakir 2018 IEEE International Electron Devices Meeting (IEDM), 29.4. 1-29.4. 4, 2018 | 13 | 2018 |
| Chip-to-chip interconnect integration technologies M Zia, C Zhang, HS Yang, L Zheng, M Bakir IEICE Electronics Express 13 (6), 20162001-20162001, 2016 | 10 | 2016 |
| A memory-based logic block with optimized-for-read SRAM for energy-efficient reconfigurable computing fabric W Yueh, S Chatterjee, M Zia, S Bhunia, S Mukhopadhyay IEEE Transactions on Circuits and Systems II: Express Briefs 62 (6), 593-597, 2015 | 9 | 2015 |
| High-performance flexible microelectrode array with PEDOT: PSS coated 3D micro-cones for electromyographic recording J Lu, M Zia, MJ Williams, AL Jacob, B Chung, SJ Sober, MS Bakir 2022 44th Annual International Conference of the IEEE Engineering in …, 2022 | 6 | 2022 |
| Microfabrication, assembly, and hermetic packaging of mm-sized free-floating neural probes P Yeon, JL Gonzalez, M Zia, SK Rajan, GS May, MS Bakir, M Ghovanloo 2017 IEEE Biomedical Circuits and Systems Conference (BioCAS), 1-4, 2017 | 6 | 2017 |
| Electrical and photonic off-chip interconnection and system integration M Zia, C Wan, Y Zhang, M Bakir Optical Interconnects for Data Centers, 265-286, 2017 | 6 | 2017 |
| 3-D integrated electronic microplate platform for low-cost repeatable biosensing applications M Zia, T Chi, JS Park, A Su, JL Gonzalez, PK Jo, MP Styczynski, H Wang, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 6 …, 2016 | 6 | 2016 |
| Interposer-to-interposer electrical and silicon photonic interconnection platform using silicon bridge HS Yang, C Zhang, M Zia, L Zheng, MS Bakir 2014 Optical Interconnects Conference, 71-72, 2014 | 6 | 2014 |
| Dense and highly elastic compressible microinterconnects (CMIs) for electronic microsystems PK Jo, M Zia, JL Gonzalez, MS Bakir 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 684-689, 2017 | 5 | 2017 |
| A microfabricated electronic microplate platform for low-cost repeatable biosensing applications M Zia, T Chi, C Zhang, P Thadesar, T Hookway, J Gonzalez, T McDevitt, ... 2015 IEEE International Electron Devices Meeting (IEDM), 29.4. 1-29.4. 4, 2015 | 5 | 2015 |
| Cascaded Ni hard mask to create chlorine-based ICP dry etched deep mesas for high-power devices H Ahmad, Z Engel, M Zia, AS Weidenbach, CM Matthews, B Zivasatienraj, ... Semiconductor Science and Technology 36 (12), 125016, 2021 | 4 | 2021 |
| Post-CMOS fabrication technology enabling simultaneous fabrication of 3-D solenoidal micro-inductors and flexible I/Os M Zia, H Oh, MS Bakir IEEE Transactions on Components, Packaging and Manufacturing Technology 8 …, 2018 | 4 | 2018 |
| Au-NiW mechanically flexible interconnects (MFIs) and TSV integration for 3D interconnects C Zhang, P Thadesar, M Zia, T Sarvey, MS Bakir 2014 International 3D Systems Integration Conference (3DIC), 1-4, 2014 | 4 | 2014 |
| Fabrication of and cell growth on ‘silicon membranes’ with high density TSVs for bio-sensing applications M Zia, C Zhang, P Thadesar, T Hookway, T Chi, J Gonzalez, T McDevitt, ... 2015 IEEE Biomedical Circuits and Systems Conference (BioCAS), 1-4, 2015 | 2 | 2015 |
| „RoboCupRescue 2009-Robot League Team< SAVIOUR (Pakistan)>‟ W Inam, M Zia, N Shayeq, K Umar, K Aziz, M Fahd, G Ishaq Institute of Engineering Science and Technology, Swabi, Pakistan, 0 | 2 | |
Joe L. GonzalezPh.D., Georgia Institute of Technology在 gatech.edu 的电子邮件经过验证
