| Additive manufacturing for enhancing thermal dissipation in heat sink implementation: a review BM Nafis, R Whitt, AC Iradukunda, D Huitink Heat Transfer Engineering 42 (12), 967-984, 2021 | 69 | 2021 |
| Design and evaluation of a 150 kva sic mosfet based three level tnpc phase-leg pebb for aircraft motor driving application Z Yuan, A Deshpande, B Narayanasamy, H Peng, AI Emon, R Whitt, ... 2019 IEEE Energy Conversion Congress and Exposition (ECCE), 6569-6574, 2019 | 39 | 2019 |
| Heat transfer and pressure drop performance of additively manufactured polymer heat spreaders for low-weight directed cooling integration in power electronics R Whitt, B Nafis, D Huitink, Z Yuan, A Deshpande, B Narayanasamy, ... 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2019 | 16 | 2019 |
| System-Level Thermal Management and Reliability of Automotive Electronics: Goals and Opportunities Using Phase-Change Materials BM Nafis, AC Iradukunda, D Huitink Journal of Electronic Packaging 142 (4), 041108, 2020 | 12 | 2020 |
| Accelerated mechanical low cycle fatigue in isothermal solder interconnects CJ Marbut, B Nafis, D Huitink Microelectronics Reliability 116, 113998, 2021 | 8 | 2021 |
| Drive Schedule Impacts to Thermal Design Requirements and the Associated Reliability Implications in Electric Vehicle Traction Drive Inverters BM Nafis, A Iradukunda, D Huitink International Electronic Packaging Technical Conference and Exhibition 51920 …, 2018 | 7 | 2018 |
| Additive Manufactured, Low EMI, Non-Metallic Convective Heat Spreader Design and Optimization R Whitt, D Huitink, S Hudson, B Nafis, Z Yuan, B Narayanasamy, ... International Electronic Packaging Technical Conference and Exhibition 59322 …, 2019 | 6 | 2019 |
| Helical fin design by additive manufacturing of metal for enhanced heat sink for electronics cooling D Huitink, BM Nafis, R Whitt US Patent 11,071,234, 2021 | 4 | 2021 |
| Effect of flap temperature on single expansion ramp nozzle performance BM Nafis, T Paul, ABM Hasan AIP Conference Proceedings 1851 (1), 2017 | 4 | 2017 |
| System-Level Thermal Management and Reliability of Automotive Electronics: Goals and Opportunities in the Next Generation of Electric and Hybrid Electric Vehicles BM Nafis, AC Iradukunda, I Al Razi, DR Huitink, Y Peng International Electronic Packaging Technical Conference and Exhibition 59322 …, 2019 | 2 | 2019 |
| Toward Direct Cooling In High Voltage Power Electronics: Dielectric Fluid Microchannel Embedded Source Bussing Terminal AC Iradukunda, BM Nafis, D Huitink, Y Chen, HA Mantooth, G Campbell, ... IEEE Transactions on Components, Packaging and Manufacturing Technology, 2024 | | 2024 |
| Reliability evaluation of a novel metal oxide-aluminum glycerol film capacitor using nonlinear degradation modeling with dependency considerations EG Okafor, X Wang, BM Nafis, A Leda, DR Huitink, X Meng Quality Engineering, 1-13, 2023 | | 2023 |
| Capabilities of Sintered Silver as a High Temperature Packaging Material BM Nafis University of Arkansas, 2023 | | 2023 |
| System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application at High Coolant Temperatures and Off-Road Mission Profile B Mohammad Nafis, M Mahmud, Z Wang, Y Wu, D Huitink, Y Zhao Journal of Electronic Packaging 144 (2), 021107, 2022 | | 2022 |
| Mission Profile Effects on Automotive Drivetrain Electronics Reliability: Modeling and Mitigation B Mohammad Nafis | | 2021 |
| Mission Profile Effects on Automotive Drivetrain Electronics Reliability: Modeling and Mitigation BM Nafis University of Arkansas, 2021 | | 2021 |
| System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application at High Coolant Temperatures and Off-road Mission Profile BM Nafis, M Mahmud, Z Wang, Y Wu, D Huitink, Y Zhao | | 2021 |
| System-Level Thermal Management and Reliability of Automotive Electronics: Goals and Opportunities Using Phase Change Materials B Mohammad Nafis, AC Iradukunda, D Huitink Journal of Electronic Packaging, 2020 | | 2020 |
