| From early microstructural evolution to intergranular crack propagation in SAC solders under thermomechanical fatigue EB Romdhane, P Roumanille, A Guédon-Gracia, S Pin, P Nguyen, ... Microelectronics Reliability 126, 114288, 2021 | 26 | 2021 |
| Bi2(C2O4)3·7H2O and Bi(C2O4)OH Oxalates Thermal Decomposition Revisited. Formation of Nanoparticles with a Lower Melting Point than Bulk Bismuth P Roumanille, V Baco-Carles, C Bonningue, M Gougeon, B Duployer, ... Inorganic Chemistry 56 (16), 9486-9496, 2017 | 25 | 2017 |
| Impact of crystalline orientation of lead-free solder joints on thermomechanical response and reliability of ball grid array components EB Romdhane, A Guédon-Gracia, S Pin, P Roumanille, H Frémont Microelectronics Reliability 114, 113812, 2020 | 21 | 2020 |
| Evaluation of thermomechanical fatigue lifetime of BGA lead-free solder joints and impact of isothermal aging P Roumanille, EB Romdhane, S Pin, P Nguyen, JY Delétage, ... Microelectronics Reliability 126, 114201, 2021 | 17 | 2021 |
| Early microstructural indicators of crack initiation in lead-free solder joints under thermal cycling EB Romdhane, P Roumanille, A Guédon-Gracia, S Pin, P Nguyen, ... 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2293-2301, 2021 | 12 | 2021 |
| Evaluation of SAC solder joint thermomechanical fatigue in different types of components EB Romdhane, P Roumanille, A Guédon-Gracia, S Pin, P Nguyen, ... 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics …, 2022 | 6 | 2022 |
| New LGT crystal for ultra-stable resonators JJ Boy, M Allani, N Batis, O Bel, O Cambon, J Haines, P Roumanille, ... 2014 European Frequency and Time Forum (EFTF), 75-78, 2014 | 6 | 2014 |
| Using X-ray imaging for the study of crack development in solder reliability testing P Roumanille, J Lesseur, J Uzanu, H Le Trong, EB Romdhane, ... Microelectronics Reliability 150, 115079, 2023 | 3 | 2023 |
| QFN (Quad Flat No–lead) SAC Solder Joints under Thermal Cycling: Identification of Two Failure Mechanisms EB Romdhane, P Roumanille, A Guedon-Gracia, S Pin, P Nguyen, ... 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 716-722, 2022 | 3 | 2022 |
| Enhancement of the piezoelectric effect in Fe-substituted GaAsO4: A combined XRD, Raman spectroscopy and first principles study D Zheng, P Roumanille, P Hermet, M Cambon, J Haines, O Cambon Solid State Sciences 101, 106157, 2020 | 2 | 2020 |
| Matériaux d'assemblage basse température pour applications électroniques: de l'intérêt des oxalates et formiates de métaux P Roumanille Université Paul Sabatier-Toulouse III, 2018 | 2 | 2018 |
| Developing new joining materials for low-temperature electronics assembly P Roumanille, V Baco-Carles, C Bonningue, M Gougeon, P Tailhades, ... 11th IEEE Nanotechnology Materials and Devices Conference (NMDC), 1-2, 2016 | | 2016 |
| OATAO is an open access repository that collects the work of Toulouse researchers and makes it freely available over the web where possible P Roumanille, V Baco-Carles, C Bonningue, M Gougeon, P Tailhades, ... JNRDM 2016 (Journées Nationales du Réseau Doctoral en Micro-nanoélectronique), 2016 | | 2016 |
| Matériaux innovants sans plomb pour l'assemblage de composants électroniques à basse température P Roumanille, V Baco-Carles, C Bonningue, M Gougeon, P Tailhades, ... | | 2016 |
