| Nanowire-filled polymer composites with ultrahigh thermal conductivity N Balachander, I Seshadri, RJ Mehta, LS Schadler, T Borca-Tasciuc, ... Applied Physics Letters 102 (9), 2013 | 98 | 2013 |
| In situ tensile deformation characterization of human hair with atomic force microscopy IP Seshadri, B Bhushan Acta materialia 56 (4), 774-781, 2008 | 97 | 2008 |
| Effect of ethnicity and treatments on in situ tensile response and morphological changes of human hair characterized by atomic force microscopy IP Seshadri, B Bhushan Acta materialia 56 (14), 3585-3597, 2008 | 66 | 2008 |
| EUV patterning successes and frontiers N Felix, D Corliss, K Petrillo, N Saulnier, Y Xu, L Meli, H Tang, A De Silva, ... Extreme Ultraviolet (EUV) Lithography VII 9776, 480-486, 2016 | 39 | 2016 |
| Microwave synthesis of branched silver nanowires and their use as fillers for high thermal conductivity polymer composites I Seshadri, GL Esquenazi, T Cardinal, T Borca-Tasciuc, G Ramanath Nanotechnology 27 (17), 175601, 2016 | 38 | 2016 |
| Multifold increases in thermal conductivity of polymer nanocomposites through microwave welding of metal nanowire fillers I Seshadri, GL Esquenazi, T Borca-Tasciuc, P Keblinski, G Ramanath Adv. Mater. Interfaces 2 (15), 1500186, 2015 | 35 | 2015 |
| Vertical-transport nanosheet technology for CMOS scaling beyond lateral-transport devices H Jagannathan, B Anderson, CW Sohn, G Tsutsui, J Strane, R Xie, S Fan, ... 2021 IEEE International Electron Devices Meeting (IEDM), 26.1. 1-26.1. 4, 2021 | 33 | 2021 |
| Effect of rubbing load on nanoscale charging characteristics of human hair characterized by AFM based Kelvin probe IP Seshadri, B Bhushan Journal of colloid and interface science 325 (2), 580-587, 2008 | 26 | 2008 |
| Fundamentals of EUV resist-inorganic hardmask interactions DL Goldfarb, M Glodde, A De Silva, I Sheshadri, NM Felix, K Lionti, ... Advances in Patterning Materials and Processes XXXIV 10146, 35-47, 2017 | 19 | 2017 |
| Study of alternate hardmasks for extreme ultraviolet patterning A De Silva, I Seshadri, A Arceo, K Petrillo, L Meli, B Mendoza, Y Yao, ... Journal of Vacuum Science & Technology B 34 (6), 2016 | 17 | 2016 |
| Single-expose patterning development for EUV lithography A De Silva, K Petrillo, L Meli, JC Shearer, G Beique, L Sun, I Seshadri, ... Extreme Ultraviolet (EUV) Lithography VIII 10143, 311-319, 2017 | 16 | 2017 |
| Nanosheet substrate to source/drain isolation FL Lie, M Ebrish, EA De Silva, I Seshadri, G Karve, LA Clevenger, ... US Patent 10,734,523, 2020 | 12 | 2020 |
| Approach to lowering extreme ultraviolet exposure dose for inorganic hardmasks for extreme ultraviolet patterning EA De Silva, KE Petrillo, IP Seshadri US Patent 10,082,736, 2018 | 12 | 2018 |
| Reliable airgap BEOL technology in advanced 48 nm pitch copper/ULK interconnects for substantial power and performance benefits C Penny, S Gates, B Peethala, J Lee, D Priyadarshini, S Nguyen, ... 2017 IEEE International Interconnect Technology Conference (IITC), 1-4, 2017 | 12 | 2017 |
| Integrated dual SPE processes with low contact resistivity for future CMOS technologies H Wu, SC Seo, C Niu, W Wang, G Tsutsui, O Gluschenkov, Z Liu, ... 2017 IEEE International Electron Devices Meeting (IEDM), 22.3. 1-22.3. 4, 2017 | 11 | 2017 |
| Additive core subtractive liner for metal cut etch processes R Bao, K Chung, AM Greene, SK Kanakasabapathy, DL Rath, ... US Patent 10,600,884, 2020 | 10 | 2020 |
| Ultrathin EUV patterning stack using polymer brush as an adhesion promotion layer I Seshadri, A De Silva, L Meli, C Liu, C Chi, J Guo, K Schmidt, H Truang, ... Extreme Ultraviolet (EUV) Lithography VIII 10143, 290-300, 2017 | 9 | 2017 |
| Gate-cut-last in RMG to enable gate extension scaling and parasitic capacitance reduction A Greene, H Zhou, R Xie, C Park, L Economikos, V Chan, K Akarvardar, ... 2019 Symposium on VLSI Technology, T144-T145, 2019 | 8 | 2019 |
| Softening in silver-nanowire-filled polydimethylsiloxane nanocomposites I Seshadri, GL Esquenazi, T Borca-Tasciuc, P Keblinski, G Ramanath Applied Physics Letters 105 (1), 2014 | 8 | 2014 |
| Enabling residue free gap fill between nanosheets I Seshadri, EA De Silva, J Guo, R Bao, M Sankarapandian, N Felix US Patent 10,658,521, 2020 | 7 | 2020 |
